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公开(公告)号：US20110214905A1
公开(公告)日：2011-09-08
申请号：US12997867
申请日：2009-06-08
申请人： Wolfgang Pahl , Hans Krueger , Peter Demmer
发明人： Wolfgang Pahl , Hans Krueger , Peter Demmer
CPC分类号： H05K1/189 , H01L2224/16225 , H05K3/4691 , H05K2201/0394 , H05K2201/09081 , H05K2201/09109 , H05K2203/308 , Y10T29/49124 , Y10T428/24322
摘要： A circuit board comprising a circuit carrier, a cover layer composed of a nonconductive material, comprising an organic substance, arranged on the circuit carrier, a first metallization layer at least partly arranged on the cover layer, wherein the first metallization layer has a flexible region.
摘要翻译： 一种电路板，包括电路载体，由非导电材料构成的覆盖层，包括布置在电路载体上的有机物质，至少部分地布置在覆盖层上的第一金属化层，其中第一金属化层具有柔性区域 。
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公开(公告)号：US09035189B2
公开(公告)日：2015-05-19
申请号：US12997867
申请日：2009-06-08
申请人： Wolfgang Pahl , Hans Krueger , Peter Demmer
发明人： Wolfgang Pahl , Hans Krueger , Peter Demmer
CPC分类号： H05K1/189 , H01L2224/16225 , H05K3/4691 , H05K2201/0394 , H05K2201/09081 , H05K2201/09109 , H05K2203/308 , Y10T29/49124 , Y10T428/24322
摘要： A circuit board comprising a circuit carrier, a cover layer composed of a nonconductive material, comprising an organic substance, arranged on the circuit carrier, a first metallization layer at least partly arranged on the cover layer, wherein the first metallization layer has a flexible region.
摘要翻译： 一种电路板，包括电路载体，由非导电材料构成的覆盖层，包括布置在电路载体上的有机物质，至少部分地布置在覆盖层上的第一金属化层，其中第一金属化层具有柔性区域 。
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3.发明授权Process for manufacturing an electronic component, in particular a surface-wave component working with acoustic surface waves 有权用于制造电子部件的工艺，特别是用声表面波工作的表面波部件公开(公告)号：US06722030B1
公开(公告)日：2004-04-20
申请号：US09622351
申请日：2000-11-13
申请人： Alois Stelzl , Hans Krueger , Peter Demmer
发明人： Alois Stelzl , Hans Krueger , Peter Demmer
IPC分类号： H05K330
CPC分类号： H01L24/97 , H01L23/552 , H01L2224/16225 , H01L2224/73253 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/01052 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/3025 , H03H3/08 , Y10T29/4913 , Y10T29/49139 , Y10T29/49142 , Y10T29/49146 , Y10T29/49171 , Y10T29/49789 , H01L2224/81
摘要： A method is provided for manufacturing a saw filter in which a carrier plate 10 that can be separated into base plates 2 is respectively provided with interconnects in the base plate regions A and these are contacted to the active structures of SAW chips 1 in flip-chip technique. A metal foil 3 or plastic film 4 is placed onto the chip-equipped carrier plate 10 and, for example, is pressure and heat treated such that it envelopes each chip 1 (except for the chip surface facing toward the carrier plate 10) and lies hermetically tight on the carrier plate surface in regions between the chips.
摘要翻译： 提供了一种用于制造锯切式过滤器的方法，其中可分离成基板2的承载板10在基板区域A中分别设置有互连，并且这些接触件与倒装芯片中的SAW芯片1的有源结构接触 技术。 将金属箔3或塑料膜4放置在装有芯片的承载板10上，并且例如进行压力和热处理，使得其包围每个芯片1（除了面向载体板10的芯片表面）并且位于 在芯片之间的区域中，在承载板表面上气密地密封。
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4.发明授权Sensor array for a capacitance measuring fingerprint sensor, and method for producing such a sensor array 有权用于电容测量指纹传感器的传感器阵列，以及用于产生这种传感器阵列的方法公开(公告)号：US06481294B2
公开(公告)日：2002-11-19
申请号：US09796214
申请日：2001-02-28
申请人： Maximilian Zellner , Jörg Zapf , Peter Demmer
发明人： Maximilian Zellner , Jörg Zapf , Peter Demmer
IPC分类号： G01D700
CPC分类号： G06K9/0002
摘要： A base layer, which is preferably flexible, has first conductor tracks, a first insulation layer, fine structures with first electrodes, second conductor tracks and second electrodes, and finally a second insulation layer applied to it in succession. The first electrodes are connected, via plated-through holes, to associated first conductor tracks. Changes, caused by lines in the skin of a finger pad, in the stray capacitance between adjacent first and second electrodes are evaluated for recording fingerprints.
摘要翻译： 优选为柔性的基层具有第一导体轨道，第一绝缘层，具有第一电极，第二导体轨道和第二电极的精细结构，以及最后连续施加到其上的第二绝缘层。 第一电极通过电镀通孔连接到相关联的第一导体轨道。 评估在相邻的第一和第二电极之间的杂散电容中由手指皮肤的线引起的变化用于记录指纹。
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