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    Business card sized storage device
    1.
    发明申请
    Business card sized storage device 有权
    名片大小的存储设备

    公开(公告)号：US20080104299A1

    公开(公告)日：2008-05-01

    申请号：US11808402

    申请日：2007-06-08

    Applicant: Wen-Lung Lin ,  Yi-Ling Liu ,  Chang-Cheng Tsai

    Inventor： Wen-Lung Lin ,  Yi-Ling Liu ,  Chang-Cheng Tsai

    IPC: G06F13/00

    CPC classification number: G06K19/077

    Abstract: A business card sized storage device comprises: a housing having an upper and lower covers, from whose edges extend downward to form a sidewall, respectively, and in turn establish an internal space; a circuit board with circuit layout with one of its surface disposed with a control module and a plurality of flash memories; a frame formed by joining a plurality of side trims which encompass the circuit board therein and whose tops and bottoms are applied with glue to join the upper and lower covers such that the two covers may be joined face-to-face; and a connector whose one end is disposed with a plug and the other end is connected with a wire which is passed through the housing and connected with the circuit board to establish an electrical connection.

    Abstract translation: 名片大小的存储装置包括：具有上盖和下盖的壳体，其从其边缘向下延伸以分别形成侧壁，并进而建立内部空间; 具有电路布局的电路板，其表面中的一个设置有控制模块和多个闪存; 通过将包围电路板的多个侧装饰件接合而形成的框架，并且其顶部和底部用胶水施加以连接上盖和下盖，使得两个盖可以面对面地接合; 以及连接器，其一端设置有插头，另一端与通过壳体连接并与电路板连接以建立电连接的线连接。

    Low profile card reading device
    2.
    发明申请
    Low profile card reading device 审中-公开
    低档读卡器

    公开(公告)号：US20070143544A1

    公开(公告)日：2007-06-21

    申请号：US11640245

    申请日：2006-12-18

    Applicant: Kun-Cheng Lin ,  Wen-Lung Lin ,  Yi-Ling Liu ,  Chang-Cheng Tsai

    Inventor： Kun-Cheng Lin ,  Wen-Lung Lin ,  Yi-Ling Liu ,  Chang-Cheng Tsai

    IPC: G06F12/00

    CPC classification number: G06K7/0021 ,  G06K19/07732 ,  G06K19/07741

    Abstract: A low profile card reading device is disclosed to include a first interface having a plurality of contact terminals movably exposed to the outside for connection to a computer, an interface controller coupled to the first interface to execute signal conversion and protocol operation of the first interface, a memory card slot for the insertion of a memory card, a card reading device controller respectively coupled to the interface controller and the memory card slot to transfer data from the memory card in the memory card slot to the computer and to store data from the computer to the memory card in the memory card slot.

    Abstract translation: 公开了一种低调卡读取装置，包括具有可移动地暴露于外部以连接到计算机的多个接触端子的第一接口，耦合到第一接口的接口控制器，以执行第一接口的信号转换和协议操作， 用于插入存储卡的存储卡插槽，分别耦合到接口控制器和存储卡插槽的读卡装置控制器，用于将数据从存储卡插槽中的存储卡传送到计算机并存储来自计算机的数据 到存储卡插槽中的存储卡。

    Low profile storage device
    4.
    发明授权
    Low profile storage device 有权
    薄型存储设备

    公开(公告)号：US07685363B2

    公开(公告)日：2010-03-23

    申请号：US11639288

    申请日：2006-12-15

    Applicant: Kun-Cheng Lin ,  Wen-Lung Lin ,  Yi-Ling Liu ,  Chang-Cheng Tsai

    Inventor： Kun-Cheng Lin ,  Wen-Lung Lin ,  Yi-Ling Liu ,  Chang-Cheng Tsai

    IPC: G06F12/00 ,  G06F13/00 ,  G06F13/28

    CPC classification number: G06K19/07743 ,  G06K19/07732

    Abstract: A low profile storage device is disclosed to include a first interface having a plurality of contact terminals movably exposed to the outside for connection to a computer, an interface controller coupled to the first interface to execute signal conversion and protocol operation of the first interface, a memory for storing data temporarily, a memory controller respectively coupled to the interface controller and the memory to transfer data from the memory to the computer and to receive data from the computer and store the data in the memory.

    Abstract translation: 公开了一种低剖面存储装置，其包括具有可移动地暴露于外部以连接到计算机的多个接触端子的第一接口，耦合到第一接口以执行第一接口的信号转换和协议操作的接口控制器， 用于临时存储数据的存储器，分别耦合到接口控制器和存储器的存储器控​​制器，用于将数据从存储器传送到计算机并从计算机接收数据并将数据存储在存储器中。

    Low profile storage device
    5.
    发明申请
    Low profile storage device 有权
    薄型存储设备

    公开(公告)号：US20070143543A1

    公开(公告)日：2007-06-21

    申请号：US11639288

    申请日：2006-12-15

    Applicant: Kun-Cheng Lin ,  Wen-Lung Lin ,  Yi-Ling Liu ,  Chang-Cheng Tsai

    Inventor： Kun-Cheng Lin ,  Wen-Lung Lin ,  Yi-Ling Liu ,  Chang-Cheng Tsai

    IPC: G06F12/00

    CPC classification number: G06K19/07743 ,  G06K19/07732

    Abstract: A low profile storage device is disclosed to include a first interface having a plurality of contact terminals movably exposed to the outside for connection to a computer, an interface controller coupled to the first interface to execute signal conversion and protocol operation of the first interface, a memory for storing data temporarily, a memory controller respectively coupled to the interface controller and the memory to transfer data from the memory to the computer and to receive data from the computer and store the data in the memory.

    Abstract translation: 公开了一种低剖面存储装置，其包括具有可移动地暴露于外部以连接到计算机的多个接触端子的第一接口，耦合到第一接口以执行第一接口的信号转换和协议操作的接口控制器， 用于临时存储数据的存储器，分别耦合到接口控制器和存储器的存储器控​​制器，用于将数据从存储器传送到计算机并从计算机接收数据并将数据存储在存储器中。

    Semiconductor package and substrate for the same
    8.
    发明申请
    Semiconductor package and substrate for the same 审中-公开
    半导体封装和衬底相同

    公开(公告)号：US20090096070A1

    公开(公告)日：2009-04-16

    申请号：US12068623

    申请日：2008-02-08

    Applicant: Wen-Jeng Fan ,  Yi-Ling Liu

    Inventor： Wen-Jeng Fan ,  Yi-Ling Liu

    IPC: H01L23/495 ,  H05K7/18

    CPC classification number: H01L23/13 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49838 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

    Abstract: A semiconductor package is revealed with a special designed substrate. The substrate has a plurality of fingers, a dummy metal pattern, and at least a peripheral slot penetrating through the substrate. The dummy metal pattern is aligned to two opposing sides of the peripheral slot and is electrically isolated from the fingers. A chip is disposed on the substrate and is electrically connected to the fingers. An encapsulant is completely filled the peripheral slot. The peripheral slot can enhance the mold flow and eliminate the mold flash. The shape of the dummy metal pattern aligned to the peripheral slot is used to offer stiffening edges to prevent the substrate from warpage and from breakage at peripheries, to enhance the thermal stress resistance due to thermal cycles, and to avoid damages to the chip.

    Abstract translation: 使用特殊设计的基板显露半导体封装。 衬底具有多个指状物，虚拟金属图案，以及穿透衬底的至少一个外围槽。 虚设金属图案与外围槽的两个相对的侧对齐并且与手指电隔离。 芯片设置在基板上并与手指电连接。 密封剂完全填充外围槽。 外围槽可以增强模具流动，消除模具闪光。 与外围槽对准的虚设金属图案的形状用于提供加强边缘，以防止基板翘曲并在周边断裂，从而提高由于热循环引起的热应力阻力，并避免损坏芯片。

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