公开(公告)号：US20220037054A1

公开(公告)日：2022-02-03

申请号：US17277000

申请日：2019-09-13

Applicant: Verily Life Sciences LLC

Inventor： Annapurna Karicherla ,  Bo Lu ,  Kedar Shah

IPC: H01B7/08 ,  H01B13/00 ,  H05K3/46

Abstract: The present disclosure relates to a monolithic thin-film lead assembly and methods of microfabricating a monolithic thin-film lead assembly. Particularly, aspects of the present disclosure are directed to a monolithic thin-film lead assembly that includes a cable having a proximal end, a distal end, a supporting structure that extends from the proximal end to the distal end, and a plurality of conductive traces formed on a portion of the supporting structure. The supporting structure includes one or more layers of dielectric material. The monolithic thin-film lead assembly may further include an electrode assembly formed on the supporting structure at the distal end of the cable. The electrode assembly includes one or more electrodes in electrical connection with one or more conductive traces of the plurality of conductive traces.

公开(公告)号：US10892573B1

公开(公告)日：2021-01-12

申请号：US16734729

申请日：2020-01-06

Applicant: Verily Life Sciences LLC

Inventor： Bo Lu ,  Annapurna Karicherla ,  Huanfen Yao

IPC: H01R12/78 ,  H01R12/79 ,  H01R12/53 ,  H01R13/04 ,  A61N1/375 ,  H01R13/10

Abstract: The present disclosure relates to data acquisition, and in particular to thin film connectors between a lead assembly and a data acquisition system. Particularly, aspects of the present disclosure are directed to a connector that includes a button having a housing and conductive pins extending from a proximal end of the housing through a base plate into a cavity on a distal end of the housing. The connector further includes a thin-film adapter having: (i) a supporting structure, (ii) bond pads formed on the supporting structure, (iii) a cable having conductive traces electrically connected to the bond pads, and (iv) feedthroughs that pass through the supporting structure and are electrically connected with the bond pads. Each conductive pin extends through a feedthrough, and each conductive pin is in electrical connection with one or more conductive traces via each bond pad.

公开(公告)号：US12089938B2

公开(公告)日：2024-09-17

申请号：US17267908

申请日：2019-08-01

Applicant: Verily Life Sciences LLC

Inventor： Annapurna Karicherla ,  Bejamin K. Yaffe ,  Celine Liong ,  Kimberly Kam

IPC: A61B5/263 ,  A61B5/294 ,  A61B5/388 ,  A61N1/05

CPC classification number: A61B5/263 ,  A61B5/388 ,  A61N1/05 ,  A61B5/294 ,  A61B2562/0209 ,  A61B2562/028 ,  A61B2562/0285 ,  A61B2562/04 ,  A61B2562/125 ,  A61N1/0556

Abstract: Embodiments relate to implantable-lead devices that include one or more materials with altered morphology and methods for making and using the same. Specifically, the morphology of electrodes and/or one or more other implant-device materials can be textured to include micro- and/or nanoscale topographical features, which can reduce in vivo fibrotic response and thereby improve signal-to-noise ratios and short-term extractability of the devices.

公开(公告)号：US20230172732A1

公开(公告)日：2023-06-08

申请号：US17924082

申请日：2021-04-02

Applicant: Verily Life Sciences LLC

Inventor： Annapurna Karicherla ,  Peng Cong ,  Ken Rys ,  Bo Lu

IPC: A61F2/90 ,  A61F2/95

CPC classification number: A61F2/90 ,  A61F2/95 ,  A61N1/04

Abstract: The present disclosure relates to thin-film lead assemblies and neural interfaces with stent-assisted deployment, and methods of microfabricating thin-film lead assemblies and neural interfaces. Particularly, aspects of the present disclosure are directed to a medical device having a thin-film neural interface, a stent, and a cable. The thin-film neural interface includes a first supporting structure, electrodes formed on the first supporting structure, and an encapsulation material encasing a portion of the first supporting structure. The cable includes a second supporting structure, conducive traces formed on the second supporting structure and electrically connected with the electrodes, and the encapsulation material encasing at least a portion of the second supporting structure. The stent is at least partially embedded in the encapsulation material encasing the portion of the first supporting structure, and the thin-film neural interface is helically wrapped around at least a portion of the stent.

公开(公告)号：US20230158294A1

公开(公告)日：2023-05-25

申请号：US17912478

申请日：2021-03-18

Applicant: Verily Life Sciences LLC

Inventor： Annapurna Karicherla ,  Bo Lu ,  Kedar Shah ,  Peng Cong

IPC: A61N1/05 ,  G06F3/01 ,  H01B7/08

CPC classification number: A61N1/0529 ,  G06F3/015 ,  H01B7/0846

Abstract: The present disclosure relates to a monolithic thin-film lead assembly and methods of microfabricating a monolithic thin-film lead assembly. Particularly, aspects of the present disclosure are directed to a monolithic thin-film lead assembly that includes a cable having a proximal end, a distal end, a supporting structure that extends from the proximal end to the distal end, and conductive traces formed on a portion of the supporting structure. The supporting structure includes one or more layers of dielectric material. The monolithic thin-film lead assembly further includes an interface formed on the supporting structure at the distal end of the cable. The interface includes electrodes and/or sensors in electrical connection with the conductive traces, and the supporting structure has at least one curved portion disposed between a first set of electrodes and a second set of electrodes, and/or between a first set of sensors and a second set of sensors.

公开(公告)号：US20220031214A1

公开(公告)日：2022-02-03

申请号：US17279004

申请日：2019-09-24

Applicant: Verily Life Sciences LLC

Inventor： Annapurna Karicherla ,  Bo Lu ,  Cindy Au

IPC: A61B5/25 ,  A61N1/05

Abstract: Embodiments relate to an implantable device. Specifically, a device includes a flexible connection component that includes a set of conductive filaments that connect a set of electrodes (or traces connected to the electrodes) and circuitry that receives and/or transmits electronic signals from and/or to the electrodes.

公开(公告)号：US20220370113A1

公开(公告)日：2022-11-24

申请号：US17622577

申请日：2020-06-05

Applicant: Verily Life Sciences LLC

Inventor： Benjamin K. Yaffe ,  Bo Lu ,  Annapurna Karicherla ,  Ken Rys ,  Ohseung Kwon

IPC: A61B18/02 ,  A61B5/00

Abstract: The present disclosure relates to mapping catheters, and in particular to mapping catheters having thin film electrodes used in sensing electrical activity within a patient. Particularly, aspects of the present disclosure are directed to a medical device having a hollow core, a balloon disposed over at least a portion of the hollow core, and a flexible framework having one or more thin film elements formed on at least a portion of the balloon. The one or more thin film elements comprise a plurality of mapping electrodes.

公开(公告)号：US20220126106A1

公开(公告)日：2022-04-28

申请号：US17276439

申请日：2019-09-13

Applicant: Verily Life Sciences LLC

Inventor： Shivkumar Sabesan ,  Bo Lu ,  Annapurna Karicherla

IPC: A61N1/375 ,  A61N1/05 ,  A61N1/36

Abstract: A stimulation system can include one or more stimulating components, each of which can include one or more electrodes and one or more leads. Each lead can be connected at a first end of the lead to an electrode of the one or more electrodes and can be connected at a second end of the lead to a bonding pad of the one or more bonding pads. The stimulation system can also include a cylindrical substrate. Each stimulating component can be secured to a surface of the cylindrical substrate. The stimulation system can further include a skull-mount package that includes electronics that identify stimulation parameters. The bonding pads can be electrically connected to the electronics. The skull-mount package can further include one or more bonding pads. Each lead can be directly electrically and physically connected to a bonding pad of the one or more bonding pads.

公开(公告)号：US20220032028A1

公开(公告)日：2022-02-03

申请号：US17381861

申请日：2021-07-21

Applicant: Verily Life Sciences LLC

Inventor： Eric Bennett ,  Kimberly Kam ,  Martin Sheridan ,  Annapurna Karicherla ,  Kassidy MacPhail

IPC: A61M37/00

Abstract: A device can include a capsule containing an array of microneedles and a mechanical actuator. The device can be in an ingestible form for delivery to a duodenum or other target location within a subject and can release the mechanical actuator from constraint by the capsule in response to stimuli or conditions in or en route to the duodenum or other target location. The mechanical actuator upon release from constraint by the capsule can expand outwardly (e.g., responsive to a bias provided by a flexibly resilient material of the mechanical actuator) in a direction away from a central longitudinal axis of the mechanical actuator and drive the array of microneedles into penetrating engagement with a lining of the duodenum or other target location. The penetrating engagement can facilitate delivery of a biotherapeutic agent or other payload via the microneedles.

公开(公告)号：US12070611B2

公开(公告)日：2024-08-27

申请号：US17276439

申请日：2019-09-13

Applicant: Verily Life Sciences LLC

Inventor： Shivkumar Sabesan ,  Bo Lu ,  Annapurna Karicherla

IPC: A61N1/375 ,  A61N1/05 ,  A61N1/36

CPC classification number: A61N1/37514 ,  A61N1/0534 ,  A61N1/0539 ,  A61N1/36125

Abstract: A stimulation system can include one or more stimulating components, each of which can include one or more electrodes and one or more leads. Each lead can be connected at a first end of the lead to an electrode of the one or more electrodes and can be connected at a second end of the lead to a bonding pad of the one or more bonding pads. The stimulation system can also include a cylindrical substrate. Each stimulating component can be secured to a surface of the cylindrical substrate. The stimulation system can further include a skull-mount package that includes electronics that identify stimulation parameters. The bonding pads can be electrically connected to the electronics. The skull-mount package can further include one or more bonding pads. Each lead can be directly electrically and physically connected to a bonding pad of the one or more bonding pads.