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公开(公告)号:US20240304703A1
公开(公告)日:2024-09-12
申请号:US18579330
申请日:2022-07-14
IPC分类号: H01L29/66 , H01L21/02 , H01L29/20 , H01L29/737 , H01L29/778
CPC分类号: H01L29/66462 , H01L21/02458 , H01L21/02461 , H01L21/0254 , H01L21/02543 , H01L29/2003 , H01L29/66318 , H01L29/737 , H01L29/7786
摘要: A method for fabricating low defective non-planar bipolar heterostructure transistors includes a steps of providing a substrate that is coated with a first dielectric layer when the substrate is not composed of a dielectric material. A layer of a first semiconductor material is formed by template liquid phase (TLP) crystal growth wherein a second dielectric layer is disposed over the first semiconductor material. A trench is patterned into the second dielectric layer. An intermediate heterostructure is formed by epitaxially growing second semiconductor material in the trench to form a fin structure therein. Various power transistor structures can be formed from the intermediate heterostructure.
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公开(公告)号:US20240282366A1
公开(公告)日:2024-08-22
申请号:US18571407
申请日:2022-06-20
IPC分类号: G11C11/419 , G11C11/418
CPC分类号: G11C11/419 , G11C11/418
摘要: A novel approach for improving the power, performance, area metric for AI computations by dynamically augmenting (doubling) the memory storage capacity uses novel eight transistor SRAM bit-cells.
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公开(公告)号:US20240220840A1
公开(公告)日:2024-07-04
申请号:US18684145
申请日:2022-08-16
IPC分类号: G06N10/40
CPC分类号: G06N10/40
摘要: A heterogeneous quantum device includes an interposer, a qubit sources disposed over the interposer, and an electro-optic quantum transducer disposed over the interposer. The electro-optic quantum transducer being a frequency converter that converts microwave frequency to optical frequency coupled to the qubit sources by superconducting capacitive or inductive coupling.
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公开(公告)号:US20210342991A1
公开(公告)日:2021-11-04
申请号:US17244183
申请日:2021-04-29
发明人: Ajey Poovannummoottil JACOB , John DAMOULAKIS , Akhilesh JAISWAL , Devanand Krishna SHENOY , Andrew RITTENBACH
摘要: A method for assuring that integrated circuits are free of malicious circuit insertions and/or IC design modifications through mask swapping/addition is provided. The method includes a step of comparing 3D tomographic images constructed from design GDS to the 3D tomographic images constructed from in-line fab metrology data.
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公开(公告)号:US20240170055A1
公开(公告)日:2024-05-23
申请号:US18281662
申请日:2022-03-14
发明人: Ajey Poovannummoottil JACOB , Akhilesh Ramlaut JAISWAL , Ramesh KUDALIPPALLIYALIL , Sujith CHANDRAN
CPC分类号: G11C11/42 , G02F1/225 , G11C13/047 , G02F2203/15
摘要: An electro-optic random-access memory enables (1) ultra-fast write and read operation (2) featuring differential sensing (3) wavelength, and polarization multiplex high bandwidth memory access (4) enables very large-scale memory array for wafer scale ICs.
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