Barrier layer circuit element and method of forming
    1.
    发明授权
    Barrier layer circuit element and method of forming 失效
    障碍层电路元件和形成方法

    公开(公告)号:US3561106A

    公开(公告)日:1971-02-09

    申请号:US3561106D

    申请日:1968-07-03

    发明人: MCGEE THOMAS D

    摘要: A FERROELECTRIC CRYSTAL SUCH AS BARIUM TITANATE, IS UNIFORMLY DOPED TO PRODUCE AN N-TYPE SEMCONDUCTOR. ELECTRON-ACCEPTOR IONS ARE THEN ADDED TO THE SURFACE OF THE CRYSTAL TO PRODUCE A SURFACE BARRIER LAYER WHEREIN THE ELECTRON-DONOR IONS OF THE ORIGINAL N-TYPE SEMICONDUCTOR CRYSTAL ARE EXACTLY COMPENSATED BY THE ADDED ELECTRONIC ACCEPTOR IONS. THE RESISTIVITY OF THE COMPENSATED LAYER IS VERY HIGH; AND THE LAYER DEFINES A JUNCTION OF HIGH DIELECTRIC CONSTANT CAPABLE OF STORING A RELATIVELY LARGE ELECTRIC CHARGE THUS PRODUCING A CAPACITOR. THIS BARRIER LAYER MAY ALSO SERVE AS A DIODE FOR RECTIFICATION, OR A TEMPERATURE-SENSITIVE RESISTOR, OR A CURRENT- OR VOLTAGESENSITIVE RESISTOR. IN ONE EMBODIMENT, THE ACCEPTOR IONS ARE PROVIDED IN THE FORM OF A METALLIC OXIDE AND SILVER ELECTRODES CONTACT THE CRYSTAL. WHEN THE COMBINATION IS FIRED IN A SUITABLE ATMOSPHERE, THE OXIDE IS REDUCED AND THE METAL DIFFUSES INTO THE N-TYPE CRYSTAL TO PRODUCE THE COMPENSATED LAYER. THUS, AN ELECTRONIC ELEMENT IS PROVIDED IN A SINGLE PROCESS STEP WITH THE SILVER ELECTRODES ALLOYING WITH THE REDUCED OXIDE ON THE SURFACE OF THE CRYSTAL.