公开(公告)号：US20100308465A1

公开(公告)日：2010-12-09

申请号：US12794012

申请日：2010-06-04

Applicant: Masami Ogura ,  Takahito Takayanagi ,  Yuko Yamada ,  Jun Kato ,  Tsugio Masuda ,  Tsukasa Aiba ,  Fumitomo Takano

Inventor： Masami Ogura ,  Takahito Takayanagi ,  Yuko Yamada ,  Jun Kato ,  Tsugio Masuda ,  Tsukasa Aiba ,  Fumitomo Takano

IPC: H01L23/488 ,  H01L21/60

CPC classification number: H05K1/0204 ,  H01L23/3735 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K3/0058 ,  H01L2924/00

Abstract: There is provided a semiconductor device including: a circuit board formed by bonding a first and a second metal plates to both surfaces of an insulating substrate respectively, at least one semiconductor element to be bonded to an external surface of the first metal plate through a first solder, and a radiating base plate to be bonded to an external surface of the second metal plate through a second solder, wherein the first and the second solders are constituted by solder materials of the same type, and a ratio of a sum of thicknesses of the first and the second metal plates to a thickness of the insulating substrate is set in a predetermined range to ensure an endurance to a temperature stress of each of the first and the second solders.

Abstract translation: 提供了一种半导体器件，包括：电路板，其通过将第一和第二金属板分别接合到绝缘基板的两个表面而形成;至少一个半导体元件，其将通过第一和第二金属板接合到第一金属板的外表面 焊料和散热基板，其通过第二焊料与第二金属板的外表面接合，其中第一和第二焊料由相同类型的焊料构成，并且厚度之和的比率 将绝缘基板的厚度的第一金属板和第二金属板设定在预定范围内，以确保第一和第二焊料各自的温度应力的耐久性。

公开(公告)号：US06923363B2

公开(公告)日：2005-08-02

申请号：US10490804

申请日：2002-09-24

Applicant: Tsugio Masuda

Inventor： Tsugio Masuda

IPC: B23K35/00 ,  B23K35/14 ,  B23K35/24 ,  B23K35/28 ,  B23K35/32 ,  B23K35/34 ,  C04B37/00 ,  C04B37/02 ,  B23K31/02

CPC classification number: C04B37/006 ,  B23K35/002 ,  B23K35/24 ,  B23K35/284 ,  B23K35/286 ,  B23K35/327 ,  B23K35/34 ,  B23K2103/10 ,  B32B2309/022 ,  B32B2311/12 ,  B32B2311/24 ,  B32B2315/02 ,  C04B37/00 ,  C04B37/003 ,  C04B37/023 ,  C04B37/026 ,  C04B2235/3206 ,  C04B2235/3222 ,  C04B2235/3865 ,  C04B2235/401 ,  C04B2235/402 ,  C04B2235/80 ,  C04B2235/96 ,  C04B2237/121 ,  C04B2237/365 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/708 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A bonding agent for metals or ceramics comprising 0.25 to 18.0% by weight of a powder of Mg and 25 to 50% by weight of a hydroxyl solvent, the balance of its composition being a powder of AlN. The bonding agent having the constituents stated above has a large amount of reaction heat generated by the reaction of its constituents. This reaction heat destroys thermally any strong oxide film existing on the surface of a base body or a part to be joined thereto, and forming a barrier layer hindering their bonding when the base body and the part to be joined thereto are of an aluminum alloy.

Abstract translation: 一种用于金属或陶瓷的粘合剂，其包含0.25至18.0重量％的Mg粉末和25至50重量％的羟基溶剂，其组成为AlN粉末。 具有上述成分的粘合剂具有由其组分的反应产生的大量反应热。 这种反应热会破坏存在于基体的表面上的任何强的氧化物膜或与其接合的部分，并且当基体和待接合的部分为铝合金时，形成阻碍其接合的阻挡层。

公开(公告)号：US08415801B2

公开(公告)日：2013-04-09

申请号：US12794012

申请日：2010-06-04

Applicant: Masami Ogura ,  Takahito Takayanagi ,  Yuko Yamada ,  Jun Kato ,  Tsugio Masuda ,  Tsukasa Aiba ,  Fumitomo Takano

Inventor： Masami Ogura ,  Takahito Takayanagi ,  Yuko Yamada ,  Jun Kato ,  Tsugio Masuda ,  Tsukasa Aiba ,  Fumitomo Takano

IPC: H01L23/488

CPC classification number: H05K1/0204 ,  H01L23/3735 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K3/0058 ,  H01L2924/00

Abstract: There is provided a semiconductor device including: a circuit board formed by bonding a first and a second metal plates to both surfaces of an insulating substrate respectively, at least one semiconductor element to be bonded to an external surface of the first metal plate through a first solder, and a radiating base plate to be bonded to an external surface of the second metal plate through a second solder, wherein the first and the second solders are constituted by solder materials of the same type, and a ratio of a sum of thicknesses of the first and the second metal plates to a thickness of the insulating substrate is set in a predetermined range to ensure an endurance to a temperature stress of each of the first and the second solders.

Abstract translation: 提供了一种半导体器件，包括：电路板，其通过将第一和第二金属板分别接合到绝缘基板的两个表面而形成;至少一个半导体元件，其将通过第一和第二金属板接合到第一金属板的外表面 焊料和散热基板，其通过第二焊料与第二金属板的外表面接合，其中第一和第二焊料由相同类型的焊料构成，并且厚度之和的比率 将绝缘基板的厚度的第一金属板和第二金属板设定在预定范围内，以确保第一和第二焊料各自的温度应力的耐久性。