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公开(公告)号：US11885652B2
公开(公告)日：2024-01-30
申请号：US17519983
申请日：2021-11-05
发明人： Ercan M. Dede , Yuqing Zhou , Feng Zhou , Danny Lohan
摘要： Disclosed herein are an apparatus and method fluid flow measurements which include a pressure transducer and a flexible tube. The pressure transducer is tuned to measure flow speeds having a Reynolds number less than 100 and include an inlet. The flexible tube has a first end fluidly coupled to the inlet and a second end positioned adjacent to and in fluid communication with a plurality of fluid outlets of a microchannel flow structure. Each of the plurality of fluid outlets has a cross section defining an outlet area. The second end has a cross section defining a flexible tube area that is larger than the outlet area.
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公开(公告)号：US20240328024A1
公开(公告)日：2024-10-03
申请号：US18193711
申请日：2023-03-31
申请人： Toyota Motor Engineering & Manufacturing North America, Inc. , The Board of Trustees of the University of Illinois
发明人： Sujan Dewanjee , Gaurav Singhal , Nenad Milijkovic , Paul Braun , Danny Lohan , Shailesh Joshi
摘要： In one embodiment, a method of fabricating a porous structure includes applying a first electroplating current at first current density for a first period of time, wherein the first electroplating current is a constant current, and applying a second electroplating current at a second current density for a second period of time following the first period of time, wherein the second electroplating current is a pulsed current and the first electroplating current and the second electroplating current grows the porous structure on a surface of the substrate.
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公开(公告)号：US20220167528A1
公开(公告)日：2022-05-26
申请号：US17165490
申请日：2021-02-02
发明人： Shailesh N. Joshi , Danny Lohan , Hitoshi Fujioka , Feng Zhou
IPC分类号： H05K7/20 , F28F13/18 , F28D15/02 , H01L23/427 , H01L23/473
摘要： A two-phase cold plate includes an outer enclosure having a fluid inlet and a fluid outlet each fluidly coupled to a fluid pathway, an inner enclosure having a vapor cavity and a vapor outlet, and one or more wicking structures disposed in the outer enclosure. The one or more wicking structures fluidly couple the fluid pathway of the outer enclosure with the vapor cavity of the inner enclosure and the one or more wicking structures comprise a plurality of nucleation sites configured to induce vaporization of a cooling fluid and facilitate vapor flow into the vapor cavity of the inner enclosure.
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4.发明公开公开(公告)号：US20240198798A1
公开(公告)日：2024-06-20
申请号：US18067473
申请日：2022-12-16
申请人： Toyota Motor Engineering & Manufacturing North America, Inc. , University of Connecticut Health Center
IPC分类号： B60K35/00 , A61B5/00 , A61B5/372 , G06N3/0464
CPC分类号： B60K35/00 , A61B5/372 , A61B5/725 , A61B5/7257 , A61B5/7267 , G06N3/0464 , B60K2370/119 , B60K2370/149 , B60K2370/1529 , B60K2370/188
摘要： A vehicle system includes a controller programmed to display a plurality of icons on a HUD of the vehicle, receive EEG data from a driver of the vehicle, perform a Fast Fourier Transform of the EEG data to obtain an EEG spectrum, input the EEG spectrum into a trained machine learning model, determine which of the plurality of icons the driver is viewing based on an output of the trained machine learning model, and perform one or more vehicle operations based on the output of the trained machine learning model.
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公开(公告)号：US11638359B2
公开(公告)日：2023-04-25
申请号：US17308565
申请日：2021-05-05
发明人： Danny Lohan , Shailesh N. Joshi
IPC分类号： H05K5/02 , H02M7/537 , H01L23/538 , H01L23/532 , H05K1/14
摘要： Methods, systems, and apparatus for a module electronics package. The modular electronics package includes a main circuit. The first main circuit board is configured to provide electrical interconnections to form an electric circuit. The modular electronics package includes a first power module. The first power module includes a first power device card and a first expansion slot. The first power device card is configured to be inserted into the first expansion slot and to be electrically coupled to the main circuit board via the first expansion slot.
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公开(公告)号：US20240332124A1
公开(公告)日：2024-10-03
申请号：US18129409
申请日：2023-03-31
申请人： Toyota Motor Engineering & Manufacturing North America, Inc. , The Board of Trustees of the University of Illinois
发明人： Sujan Dewanjee , Gaurav Singhal , Nenad Milijkovic , Paul V. Braun , Danny Lohan , Shailesh Joshi
IPC分类号： H01L23/373 , H01L21/311 , H01L21/3205
CPC分类号： H01L23/3736 , H01L21/31138 , H01L21/32051
摘要： Porous structures and processes for generating porous structures are disclosed. In one embodiment, a porous structure includes a target surface, a photoresist material deposited onto the target surface, and a metal electrodeposited onto the target surface and the photoresist material. An electrodeposition of metal generates a metal porous structure and the photoresist material is removed through reactive ion etching, generating at least one microchannel through the metal porous structure.
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公开(公告)号：US20230138653A1
公开(公告)日：2023-05-04
申请号：US17518321
申请日：2021-11-03
发明人： Shailesh N. Joshi , Danny Lohan
摘要： Evaporator assemblies, vapor chamber assemblies, and methods for fabricating a vapor chamber are disclosed. In one embodiment, an evaporator assembly for a vapor chamber includes an evaporator surface, an array of posts extending from the evaporator surface, and an array of vapor vents within the evaporator surface. Each vapor vent of the array of vapor vents is configured as a depression within the evaporator surface. The evaporator assembly further includes a porous layer disposed on the evaporator surface, the array of posts, and the array of vapor vents.
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公开(公告)号：US20220319956A1
公开(公告)日：2022-10-06
申请号：US17217348
申请日：2021-03-30
IPC分类号： H01L23/427 , H01L23/528 , H01L23/06 , H01L23/373 , H01L25/07
摘要： A power device assembly includes a heat-generating device, one or more porous bonding layers, and one or more cap layers. The one or more porous bonding layers are formed on a surface of the heat-generating device and define a plurality of embedded vapor channels. The one or more cap layers are engaged with a porous bonding layer of the one or more porous bonding layers opposite the heat-generating device. The one or more cap layer comprise a plurality of liquid feed channels for feeding cooling fluid to the heat-generating device via the porous bonding layer.
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公开(公告)号：US12062593B2
公开(公告)日：2024-08-13
申请号：US17217348
申请日：2021-03-30
IPC分类号： H01L23/427 , H01L23/06 , H01L23/373 , H01L23/528 , H01L25/07
CPC分类号： H01L23/427 , H01L23/06 , H01L23/3735 , H01L23/5286 , H01L25/074
摘要： A power device assembly includes a heat-generating device, one or more porous bonding layers, and one or more cap layers. The one or more porous bonding layers are formed on a surface of the heat-generating device and define a plurality of embedded vapor channels. The one or more cap layers are engaged with a porous bonding layer of the one or more porous bonding layers opposite the heat-generating device. The one or more cap layer comprise a plurality of liquid feed channels for feeding cooling fluid to the heat-generating device via the porous bonding layer.
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公开(公告)号：US20240119185A1
公开(公告)日：2024-04-11
申请号：US17938690
申请日：2022-10-07
发明人： Sarah N. Hankins , Yuqing Zhou , Ercan Dede , Danny Lohan
IPC分类号： G06F30/10
CPC分类号： G06F30/10 , G06F2113/08
摘要： One or more multi-zoned microreactor flow field configurations that facilitate optimized reaction-fluid performance, and one or more methods of designing such multi-zoned microreactor flow fields.
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