Substrate processing apparatus and substrate processing method

    公开(公告)号:US10668494B2

    公开(公告)日:2020-06-02

    申请号:US15710017

    申请日:2017-09-20

    摘要: A substrate processing apparatus according to the present disclosure includes a holding unit, a nozzle, a driving unit, and a controller. The holding unit holds a substrate. The nozzle supplies a processing liquid to the substrate held on the holding unit. The driving unit moves the nozzle. The controller controls the driving unit, so as to move the nozzle while supplying the processing liquid to the substrate from the nozzle. Further, the controller controls the driving unit based on recipe information including step information including positions of first and second points above the substrate, total time for moving the nozzle between the first and second points, and a moving speed of the nozzle, so as to cause reciprocation of the nozzle.

    SUBSTRATE LIQUID PROCESSING APPARATUS AND LIQUID DISCHARGE EVALUATION METHOD

    公开(公告)号:US20210260612A1

    公开(公告)日:2021-08-26

    申请号:US17179551

    申请日:2021-02-19

    摘要: A controller is configured to control a liquid supply to change a landing position of a liquid on a surface of a substrate continuously by discharging the liquid toward the surface of the substrate from a first liquid discharge nozzle while moving the first liquid discharge nozzle. The controller is also configured to derive discharge position deviation information of the liquid supply by comparing first temperature information based on a spot temperature measured by a temperature measurement device when the first liquid discharge nozzle is moved along a first nozzle path and second temperature information based on the spot temperature measured by the temperature measurement device when the first liquid discharge nozzle is moved along a second nozzle path which is different from the first nozzle path.