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37 条记录 (耗时 0.015 秒)

    LED lamp
    1.
    发明授权
    LED lamp 有权
    点灯

    公开(公告)号：US09377185B2

    公开(公告)日：2016-06-28

    申请号：US13513601

    申请日：2010-11-29

    申请人： Thomas Preuschl

    发明人： Thomas Preuschl

    IPC分类号： F21V23/06 ,  F21K99/00 ,  F21Y101/02 ,  F21V3/00

    CPC分类号： F21V23/06 ,  F21K9/232 ,  F21V3/00 ,  F21Y2115/10

    摘要： A light emitting diode lamp may include a socket; a first circuit board; and at least one plug connector electrically connected to the socket; wherein the connector is connected to the circuit board by means of a plug section.

    摘要翻译： 发光二极管灯可以包括插座; 第一个电路板; 以及至少一个插头连接器，电连接到插座; 其中所述连接器借助于插头部分连接到所述电路板。

    Luminous device having a flexible printed circuit board
    3.
    发明授权
    Luminous device having a flexible printed circuit board 有权
    发光装置具有柔性印刷电路板

    公开(公告)号：US08502262B2

    公开(公告)日：2013-08-06

    申请号：US13383154

    申请日：2010-06-16

    申请人： Thomas Preuschl ,  Steffen Strauss ,  Florian Zeus

    发明人： Thomas Preuschl ,  Steffen Strauss ,  Florian Zeus

    IPC分类号： H01L33/58

    CPC分类号： H05K3/284 ,  F21S4/22 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K1/189 ,  H05K2201/10106 ,  H05K2201/2072

    摘要： A lighting device (1;15) comprising at least one flexible printed circuit board (3) which is populated with at least one semiconductor light source, comprising a potting material overlaid on at least one populated side of the printed circuit board so as to leave at least one emission surface of the semiconductor light source (2) exposed; an adhesive element at least partially covering a top side of the semiconductor light source, wherein the adhesive element (7) protrudes partially from the potting compound (10), is enclosed around its sides by the potting compound (10) in an adhesive manner and has better adhesion to the potting compound (10) than does the semiconductor light source.

    摘要翻译： 一种照明装置（1; 15），包括至少一个柔性印刷电路板（3），所述至少一个柔性印刷电路板（3）装有至少一个半导体光源，包括覆盖在印刷电路板的至少一个填充侧上的封装材料，以便离开 半导体光源（2）的至少一个发射表面露出; 至少部分地覆盖半导体光源的顶侧的粘合元件，其中所述粘合元件（7）从所述封装化合物（10）部分突出，以粘合方式围绕所述封装化合物（10）封闭，并且 与封装化合物（10）相比，具有比半导体光源更好的附着力。

    LIGHTING APPARATUS
    4.
    发明申请
    LIGHTING APPARATUS 审中-公开
    照明设备

    公开(公告)号：US20130063946A1

    公开(公告)日：2013-03-14

    申请号：US13699306

    申请日：2011-05-13

    申请人： Thomas Preuschl

    发明人： Thomas Preuschl

    IPC分类号： F21V21/00

    CPC分类号： F21V23/06 ,  F21K9/20 ,  F21V23/001 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48472 ,  H05K1/0306 ,  H05K3/0061 ,  H05K2201/10106 ,  Y10T29/49002 ,  H01L2924/00014

    摘要： A lighting apparatus may include: a light source substrate, to the front side of which at least one semiconductor light source is fitted and the rear side of which is fitted to an electrically conductive carrier; wherein alongside the light source substrate at least two electrically conductive contact pins are led through the carrier and the contact pins are electrically connected to the at least one semiconductor light source; wherein the contact pins are in each case introduced into an electrically insulating sleeve and the respective sleeve is inserted into an associated cutout of the carrier.

    摘要翻译： 照明装置可以包括：光源基板，在其前侧安装有至少一个半导体光源并且其后侧安装在导电载体上; 其中在所述光源基板旁边，至少两个导电接触引脚被引导通过所述载体，并且所述接触引脚电连接到所述至少一个半导体光源; 其中所述接触销在每种情况下被引入电绝缘套筒中，并且相应的套筒插入到所述载体的相关联的切口中。

    LIGHTING DEVICE
    5.
    发明申请
    LIGHTING DEVICE 有权
    照明设备

    公开(公告)号：US20110310624A1

    公开(公告)日：2011-12-22

    申请号：US13148670

    申请日：2010-02-11

    申请人： Thomas Preuschl ,  Florian Zeus

    发明人： Thomas Preuschl ,  Florian Zeus

    IPC分类号： F21V29/00

    CPC分类号： F21V23/002 ,  F21K9/23 ,  F21V29/70 ,  F21Y2115/10

    摘要： A lighting device may include a heat sink, which has at least one carrier attached to the outside of the heat sink for at least one semiconductor light source; a recess for accommodating a driver; and at least one electrically insulating supply, which connects the recess to the outside of the heat sink; wherein the electrically insulating supply includes a contact surface that connects to the outside of the heat sink in a flush manner, the contact surface being at least partially covered by the carrier.

    摘要翻译： 照明装置可以包括散热器，其具有至少一个载体，其附接到用于至少一个半导体光源的散热器的外部; 用于容纳驾驶员的凹部; 以及将所述凹部连接到所述散热器的外部的至少一个电绝缘电源; 其中所述电绝缘电源包括以平齐方式连接到所述散热器的外部的接触表面，所述接触表面至少部分地被所述载体覆盖。

    Substrate for a Lighting Module and Lighting Module
    6.
    发明申请
    Substrate for a Lighting Module and Lighting Module 审中-公开
    照明模块和照明模块基板

    公开(公告)号：US20120307488A1

    公开(公告)日：2012-12-06

    申请号：US13578789

    申请日：2011-01-24

    申请人： Thomas Preuschl

    发明人： Thomas Preuschl

    IPC分类号： F21V9/00 ,  F21V21/00

    CPC分类号： H05K1/029 ,  H05K1/111 ,  H05K2201/10106

    摘要： A substrate (1; 11; 21) for a lighting module (M), said substrate comprising a plurality of light source mounting slots (DLn), and at least one resistor mounting slot (RLm) for a bridge resistor, wherein the at least one resistor mounting slot (RLm) is in each case connected in parallel with at least one of the light source mounting slots

    摘要翻译： 一种用于照明模块（M）的衬底（1; 11; 21），所述衬底包括多个光源安装槽（DLn），以及用于桥接电阻器的至少一个电阻器安装槽（RLm），其中至少 每个情况下，一个电阻器安装槽（RLm）与至少一个光源安装槽并联连接

    Bendable Luminous Modules and Method for Producing Bendable Luminous Modules
    7.
    发明申请
    Bendable Luminous Modules and Method for Producing Bendable Luminous Modules 有权
    可弯曲发光模块和生产弯曲发光模块的方法

    公开(公告)号：US20120113606A1

    公开(公告)日：2012-05-10

    申请号：US13384541

    申请日：2010-06-16

    申请人： Thomas Preuschl

    发明人： Thomas Preuschl

    IPC分类号： H05K5/02 ,  H05K13/00

    CPC分类号： H05K1/189 ,  F21S8/08 ,  F21W2131/103 ,  F21Y2107/00 ,  F21Y2115/10 ,  H05K1/0203 ,  H05K1/0278 ,  H05K1/028 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/058 ,  H05K2201/09063 ,  H05K2201/09254 ,  H05K2201/0969 ,  H05K2201/10106 ,  Y10T29/49128 ,  Y10T156/10 ,  Y10T156/1002

    摘要： A light module (1; 14), comprising a carrier (8, 10) for mounting at least one semiconductor source (5), in particular a light emitting diode, wherein: the carrier (8, 10) has a flexible printed circuit board (10), the flexible printed circuit board (10) is bonded face-to face to at least one base plate, (8) and the carrier (8, 10) can be bent along at least one predetermined bending line (3; 3a-3e), the base plate (8) can be bent along the at least one bending line, (3; 3a-3e), the base plate (8) has at least one cutout (9) along the bending line (3; 3a-3e) and the flexible printed circuit board (10) has at least one strip (11; 15) which crosses at least one of the cutouts (9).

    摘要翻译： 一种光模块（1; 14），包括用于安装至少一个半导体源（5）的载体（8,10），特别是发光二极管，其中：所述载体（8,10）具有柔性印刷电路板 （10）中，柔性印刷电路板（10）面对至少一个基板（8）接合，并且载体（8,10）可以沿着至少一个预定弯曲线（3; 3a）弯曲 -3e），所述基板（8）可以沿着所述至少一条弯曲线（3,3a-3e）弯曲，所述基板（8）沿着所述弯曲线（3; 3a-3e）具有至少一个切口（9） 3a-3e）和柔性印刷电路板（10）具有至少一个穿过至少一个切口（9）的条带（11; 15）。

    Luminous Device Having a Flexible Printed Circuit Board
    8.
    发明申请
    Luminous Device Having a Flexible Printed Circuit Board 有权
    具有柔性印刷电路板的发光装置

    公开(公告)号：US20120112235A1

    公开(公告)日：2012-05-10

    申请号：US13383154

    申请日：2010-06-16

    申请人： Thomas Preuschl ,  Steffen Strauss ,  Florian Zeus

    发明人： Thomas Preuschl ,  Steffen Strauss ,  Florian Zeus

    IPC分类号： H01L33/58 ,  H01L33/52

    CPC分类号： H05K3/284 ,  F21S4/22 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K1/189 ,  H05K2201/10106 ,  H05K2201/2072

    摘要： A lighting device (1;15) comprising at least one flexible printed circuit board (3) which is populated with at least one semiconductor light source, comprising a potting material overlaid on at least one populated side of the printed circuit board so as to leave at least one emission surface of the semiconductor light source (2) exposed; an adhesive element at least partially covering a top side of the semiconductor light source, wherein the adhesive element (7) protrudes partially from the potting compound (10), is enclosed around its sides by the potting compound (10) in an adhesive manner and has better adhesion to the potting compound (10) than does the semiconductor light source.

    摘要翻译： 一种照明装置（1; 15），包括至少一个柔性印刷电路板（3），所述至少一个柔性印刷电路板（3）装有至少一个半导体光源，包括覆盖在印刷电路板的至少一个填充侧上的封装材料，以便离开 半导体光源（2）的至少一个发射表面露出; 至少部分地覆盖半导体光源的顶侧的粘合元件，其中所述粘合元件（7）从所述封装化合物（10）部分突出，以粘合方式围绕所述封装化合物（10）封闭，并且 与封装化合物（10）相比，具有比半导体光源更好的附着力。

    Module for Integrated Control Electronics Having Simplified Design
    9.
    发明申请
    Module for Integrated Control Electronics Having Simplified Design 有权
    集成控制电子元件简化设计模块

    公开(公告)号：US20100271791A1

    公开(公告)日：2010-10-28

    申请号：US12676935

    申请日：2008-08-04

    申请人： Josef Loibl ,  Thomas Preuschl ,  Hermann-Josef Robin ,  Karl Smirra

    发明人： Josef Loibl ,  Thomas Preuschl ,  Hermann-Josef Robin ,  Karl Smirra

    IPC分类号： H05K7/00 ,  H05K13/00

    CPC分类号： H05K5/069 ,  B60R16/0239 ,  F16H61/0006 ,  H05K1/141 ,  H05K1/144 ,  H05K1/147 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/365 ,  H05K3/4691 ,  H05K5/0082 ,  H05K2201/0999 ,  H05K2201/10598 ,  H05K2203/1147 ,  Y10T29/49002

    摘要： A housing concept for integrated control electronics, comprising a housing bottom, a circuit carrier populated with electronic components of the central control electronics, and a signal and current distribution component as the electric connection between the central control electronics and peripheral components. The housing bottom is configured in the shape of a basin, the circuit carrier for the electronic components of the central control electronics being disposed therein such that the same can be electrically connected on at least one upwardly curved edge region to the signal and current distribution component disposed above the same via contact points, and wherein the housing bottom may also be connected circumferentially to the signal and current distribution component.

    摘要翻译： 用于集成控制电子器件的壳体概念，包括壳体底部，安装有中央控制电子器件的电子部件的电路载体，以及作为中央控制电子设备和外围部件之间的电连接的信号和电流分配部件。 壳体底部构造为盆形，用于中央控制电子器件的电子部件的电路载体设置在其中，使得其可以在至少一个向上弯曲的边缘区域上电连接到信号和电流分布部件 设置在同一经过接触点上方，并且其中壳体底部也可以与信号和电流分布部件周向连接。