公开(公告)号：US11317515B2

公开(公告)日：2022-04-26

申请号：US15695828

申请日：2017-09-05

Applicant: The Board of Regents, The University of Texas System

Inventor： David Espalin ,  Ryan Wicker ,  Alfonso Fernandez ,  Jorge Ramirez ,  Jose Motta

IPC: H05K3/10 ,  B29C70/82 ,  B33Y50/02 ,  H05K3/00 ,  H05K1/11 ,  B33Y10/00 ,  H05K1/02 ,  B33Y30/00

Abstract: A method for embedding a line in a substrate. A line embedding head in positioned relative to a surface of the substrate. The line from an output port in the line embedding head is output at an angle relative to the embedding head such that the line is embedded in the substrate.

公开(公告)号：US20180043618A1

公开(公告)日：2018-02-15

申请号：US15555468

申请日：2016-02-29

Applicant: The Board of Regents, The University of Texas System

Inventor： Corey Shemelya ,  David Espalin ,  Eric MacDonald ,  Ryan Wicker

IPC: B29C64/314 ,  B33Y70/00 ,  B33Y30/00 ,  B29C64/112 ,  B33Y10/00

CPC classification number: B29C64/314 ,  B29C64/00 ,  B29C64/112 ,  B29C70/82 ,  B29C70/88 ,  B29C70/885 ,  B29K2069/00 ,  B29K2705/10 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  B33Y80/00 ,  H05K3/4664

Abstract: An embedded material and an embedding apparatus and method. A compatible solute can be dissolved in a solvent. The object to be embedded can be coated with the solvent/plastic solution using, for example, addition and/or condensation polymerization. The solvent can be removed. The coated object can be inserted, snap fit, or submerged into a partially 3D printed substrate with or without the aid of ultrasonic embedding, thermal energy, joule heating, and/or the use of adhesives, and the 3D printing process resumes in order to fully embed the coated object within the 3D printed substrate. The coated object can be inserted, snap fit, or submerged into a partially 3D printed substrate with or without the addition of ultrasonic embedding, thermal energy, joule heating, and/or adhesives, and the 3D printing process resumes in order to fully embed the coated object within the 3D printed substrate.

公开(公告)号：US20180070453A1

公开(公告)日：2018-03-08

申请号：US15695828

申请日：2017-09-05

Applicant: The Board of Regents, The University of Texas System

Inventor： David Espalin ,  Ryan Wicker ,  Alfonso Fernandez ,  Jorge Ramirez ,  Jose Motta

IPC: H05K3/10 ,  B33Y50/02 ,  H05K3/00 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K3/103 ,  B29C70/82 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  H05K1/0284 ,  H05K1/119 ,  H05K3/0014 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2203/0195 ,  H05K2203/1105 ,  H05K2203/163

Abstract: A method for embedding a line in a substrate. A line embedding head in positioned relative to a surface of the substrate. The line from an output port in the line embedding head is output at an angle relative to the embedding head such that the line is embedded in the substrate.