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公开(公告)号：US20240213957A1
公开(公告)日：2024-06-27
申请号：US18145497
申请日：2022-12-22
Applicant: Texas Instruments Incorporated
Inventor： Yao Yu , Hassan Omar Ali , Ting-Ta Yen , Swaminathan Sankaran
CPC classification number: H03H9/542 , H03H7/42 , H03H9/0095 , H03H9/02133
Abstract: In one example, an integrated circuit comprises a filter having first and second filter terminals. The filter includes a first inductor coupled between the first and second filter terminals. The filter further includes a resonator coupled between the first and second filter terminals. A second inductor is coupled between differential terminals and is magnetically coupled to the first inductor.
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公开(公告)号：US20230061753A1
公开(公告)日：2023-03-02
申请号：US17463013
申请日：2021-08-31
Applicant: Texas Instruments Incorporated
Inventor： Bichoy Bahr , Jeronimo Segovia Fernandez , Hassan Omar Ali
Abstract: An example apparatus includes: a semiconductor substrate; a mechanical resonator supported by the substrate, the mechanical resonator including an array of capacitors; and a plasmonic infrared (IR) absorber including an array of metal structures. The mechanical resonator is between the substrate and the IR absorber.
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公开(公告)号：US20220166144A1
公开(公告)日：2022-05-26
申请号：US17328082
申请日：2021-05-24
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Hassan Omar Ali , Richard George Wallace , Benjamin Stassen Cook , Swaminathan Sankaran , Sanjay Mohan
Abstract: An antenna integrated in a device package is formed such that at least a portion of the antenna is elevated with respect to a substrate of the device package. The entire antenna and its functionality are positioned within a space extending vertically upwardly from a footprint of the substrate that contains circuitry of the device. The boundary of the space is defined by the perimeter of an over mold positioned on the substrate and encapsulating the circuitry.
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公开(公告)号：US20150222004A1
公开(公告)日：2015-08-06
申请号：US14684821
申请日：2015-04-13
Applicant: Texas Instruments Incorporated
Inventor： Swaminathan Sankaran , Nirmal C. Warke , Hassan Omar Ali , Bradley A. Kramer
CPC classification number: H01P5/222 , H01P5/16 , H01Q3/26 , H01Q21/0075 , Y10T29/49016
Abstract: An apparatus is provided. First and second hybrid couplers are provided with each having a first port, a second port, a third port, a fourth port and with each being substantially curvilinear. The fourth ports of the first and second hybrid couplers are first and second isolation port that are mutually coupled. The first port of the first hybrid coupler is configured to carry a first portion of a differential signal, and the first port of the second hybrid coupler is configured to carry a second portion of the differential signal.
Abstract translation: 提供了一种装置。 提供了第一和第二混合耦合器，每个耦合器具有第一端口，第二端口，第三端口，第四端口，并且每个具有大致曲线。 第一和第二混合耦合器的第四端口是相互耦合的第一和第二隔离端口。 第一混合耦合器的第一端口被配置为承载差分信号的第一部分，并且第二混合耦合器的第一端口被配置为承载差分信号的第二部分。
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公开(公告)号：US20230327678A1
公开(公告)日：2023-10-12
申请号：US18334312
申请日：2023-06-13
Applicant: Texas Instruments Incorporated
Inventor： Juan Alejandro Herbsommer , Nikita Mahjabeen , Hassan Omar Ali , Meysam Moallem
IPC: H03L7/26 , H01P3/00 , H01Q1/22 , G06F1/12 , H05K1/02 , H01Q1/38 , G04F5/14 , H04B1/40 , H01Q13/18 , H01P5/107 , G01N29/44 , H01P3/12
CPC classification number: H03L7/26 , H01P3/003 , H01Q1/2283 , G06F1/12 , H05K1/0243 , H01Q1/38 , H01P3/006 , G04F5/145 , H04B1/40 , H01Q13/18 , H01P5/107 , G01N29/44 , H01P3/121
Abstract: In a described example, an apparatus includes: a package substrate having a device side surface and a board side surface opposite the device side surface; a physics cell mounted on the device side surface having a first end and a second end; a first opening extending through the package substrate and lined with a conductor, aligned with the first end; a second opening extending through the package substrate and lined with the conductor, aligned with the second end; a millimeter wave transmitter module on the board side, having a millimeter wave transfer structure including a transmission line coupled to an antenna aligned with the first opening; and a millimeter wave receiver module mounted on the board side surface of the package substrate and having a millimeter wave transfer structure including a transmission line coupled to an antenna for receiving millimeter wave signals, aligned with the second opening.
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Patent Agency Ranking
公开(公告)号：US11677156B2
公开(公告)日：2023-06-13
申请号：US17328082
申请日：2021-05-24
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Hassan Omar Ali , Richard George Wallace , Benjamin Stassen Cook , Swaminathan Sankaran , Sanjay Mohan
CPC classification number: H01Q9/045 , H01Q1/2283
Abstract: An antenna integrated in a device package is formed such that at least a portion of the antenna is elevated with respect to a substrate of the device package. The entire antenna and its functionality are positioned within a space extending vertically upwardly from a footprint of the substrate that contains circuitry of the device. The boundary of the space is defined by the perimeter of an over mold positioned on the substrate and encapsulating the circuitry.
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公开(公告)号：US20220075745A1
公开(公告)日：2022-03-10
申请号：US17530669
申请日：2021-11-19
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Mark Edward Wentroble , Suzanne Mary Vining , Hassan Omar Ali
Abstract: This disclosure generally relates to USB TYPE-C, and, in particular, DISPLAYPORT Alternate Mode communication in a USB TYPE-C environment. In one embodiment, a device determines a DISPLAYPORT mode and determines an orientation of a USB TYPE-C connector plug. A multiplexer multiplexes a DISPLAYPORT transmission based in part on the determined orientation of the USB TYPE-C connector plug.
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公开(公告)号：US20210183915A1
公开(公告)日：2021-06-17
申请号：US16716652
申请日：2019-12-17
Applicant: Texas Instruments Incorporated
Inventor： Scott Robert Summerfelt , Hassan Omar Ali , Benjamin Stassen Cook
IPC: H01L27/146
Abstract: In described examples an integrated circuit (IC) has multiple layers of dielectric material overlying at least a portion of a surface of a substrate. A trench is etched through the layers of dielectric material to expose a portion the substrate to form a trench floor, the trench being surrounded by a trench wall formed by the layers of dielectric material. A metal perimeter band surrounds the trench adjacent the trench wall, the perimeter band being embedded in one of the layers of the dielectric material.
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公开(公告)号：US20220209779A1
公开(公告)日：2022-06-30
申请号：US17246300
申请日：2021-04-30
Applicant: Texas Instruments Incorporated
Inventor： Juan Alejandro Herbsommer , Nikita Mahjabeen , Hassan Omar Ali , Meysam Moallem
Abstract: In a described example, an apparatus includes: a package substrate having a device side surface and a board side surface opposite the device side surface; a physics cell mounted on the device side surface having a first end and a second end; a first opening extending through the package substrate and lined with a conductor, aligned with the first end; a second opening extending through the package substrate and lined with the conductor, aligned with the second end; a millimeter wave transmitter module on the board side, having a millimeter wave transfer structure including a transmission line coupled to an antenna aligned with the first opening; and a millimeter wave receiver module mounted on the board side surface of the package substrate and having a millimeter wave transfer structure including a transmission line coupled to an antenna for receiving millimeter wave signals, aligned with the second opening.
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公开(公告)号：US11210255B2
公开(公告)日：2021-12-28
申请号：US16709073
申请日：2019-12-10
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor： Mark Edward Wentroble , Suzanne Mary Vining , Hassan Omar Ali
Abstract: This disclosure generally relates to USB TYPE-C, and, in particular, DISPLAYPORT Alternate Mode communication in a USB TYPE-C environment. In one embodiment, a device determines a DISPLAYPORT mode and determines an orientation of a USB TYPE-C connector plug. A multiplexer multiplexes a DISPLAYPORT transmission based in part on the determined orientation of the USB TYPE-C connector plug.
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