公开(公告)号：US20220166144A1

公开(公告)日：2022-05-26

申请号：US17328082

申请日：2021-05-24

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hassan Omar Ali ,  Richard George Wallace ,  Benjamin Stassen Cook ,  Swaminathan Sankaran ,  Sanjay Mohan

IPC: H01Q9/04 ,  H01Q1/22

Abstract: An antenna integrated in a device package is formed such that at least a portion of the antenna is elevated with respect to a substrate of the device package. The entire antenna and its functionality are positioned within a space extending vertically upwardly from a footprint of the substrate that contains circuitry of the device. The boundary of the space is defined by the perimeter of an over mold positioned on the substrate and encapsulating the circuitry.

公开(公告)号：US11677156B2

公开(公告)日：2023-06-13

申请号：US17328082

申请日：2021-05-24

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hassan Omar Ali ,  Richard George Wallace ,  Benjamin Stassen Cook ,  Swaminathan Sankaran ,  Sanjay Mohan

IPC: H01Q1/22 ,  H01Q9/04

CPC classification number: H01Q9/045 ,  H01Q1/2283

Abstract: An antenna integrated in a device package is formed such that at least a portion of the antenna is elevated with respect to a substrate of the device package. The entire antenna and its functionality are positioned within a space extending vertically upwardly from a footprint of the substrate that contains circuitry of the device. The boundary of the space is defined by the perimeter of an over mold positioned on the substrate and encapsulating the circuitry.