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    Tabular member swinging device
    1.
    发明授权
    Tabular member swinging device 有权
    板状摆动装置

    公开(公告)号：US09075234B2

    公开(公告)日：2015-07-07

    申请号：US13394699

    申请日：2010-12-14

    Applicant: Takashi Ozaki ,  Ryo Kodama

    Inventor： Takashi Ozaki ,  Ryo Kodama

    IPC: G09G3/34 ,  G02B26/08

    CPC classification number: G02B26/0841 ,  G09G3/34

    Abstract: A plurality of movable units is arranged in a matrix. First and second electrodes are used in common in the movable units arranged in a column. A plurality of third electrodes, which commonly connects tabular members of the movable units arranged in a row, is formed for each row. The drive circuit selects, in order and one by one, the third electrodes. Subsequently, the drive circuit swings the tabular member by applying a bias voltage to the selected third electrode and applying an approach voltage or a separating voltage to a plurality of the first electrodes and second electrodes. During a predetermined period of maintaining a swinging posture, the voltage applied to the third electrodes is maintained as the bias voltage. The tabular member is returned to a non-swinging state by changing the voltage applied to the third electrodes to a reset voltage after the lapse of the predetermined period.

    Abstract translation: 多个可移动单元被布置成矩阵。 第一和第二电极在布置成列的可移动单元中共同使用。 为每排形成多个第三电极，其通常连接布置成一排的可动单元的板状构件。 驱动电路按顺序依次选择第三电极。 随后，驱动电路通过向所选择的第三电极施加偏置电压并向多个第一电极和第二电极施加接近电压或分离电压来摆动板状构件。 在保持摆动姿态的预定时段期间，施加到第三电极的电压被保持为偏置电压。 通过将施加到第三电极的电压改变为经过预定周期之后的复位电压，板状构件返回到非摆动状态。

    TABULAR MEMBER SWINGING DEVICE
    2.
    发明申请
    TABULAR MEMBER SWINGING DEVICE 有权
    TABULAR会员摆动装置

    公开(公告)号：US20120169702A1

    公开(公告)日：2012-07-05

    申请号：US13394699

    申请日：2010-12-14

    Applicant: Takashi Ozaki ,  Ryo Kodama

    Inventor： Takashi Ozaki ,  Ryo Kodama

    IPC: G06F3/038

    CPC classification number: G02B26/0841 ,  G09G3/34

    Abstract: A plurality of movable units is arranged in a matrix. First and second electrodes are used in common in the movable units arranged in a column. A plurality of third electrodes, which commonly connects tabular members of the movable units arranged in a row, is formed for each row. The drive circuit selects, in order and one by one, the third electrodes. Subsequently, the drive circuit swings the tabular member by applying a bias voltage to the selected third electrode and applying an approach voltage or a separating voltage to a plurality of the first electrodes and second electrodes. During a predetermined period of maintaining a swinging posture, the voltage applied to the third electrodes is maintained as the bias voltage. The tabular member is returned to a non-swinging state by changing the voltage applied to the third electrodes to a reset voltage after the lapse of the predetermined period.

    Abstract translation: 多个可移动单元被布置成矩阵。 第一和第二电极在布置成列的可移动单元中共同使用。 为每排形成多个第三电极，其通常连接布置成一排的可动单元的板状构件。 驱动电路按顺序依次选择第三电极。 随后，驱动电路通过向所选择的第三电极施加偏置电压并向多个第一电极和第二电极施加接近电压或分离电压来摆动板状构件。 在保持摆动姿态的预定时段期间，施加到第三电极的电压被保持为偏置电压。 通过将施加到第三电极的电压改变为经过预定周期之后的复位电压，板状构件返回到非摆动状态。

    PERMANENT MAGNET AND MANUFACTURING METHOD THEREOF
    4.
    发明申请
    PERMANENT MAGNET AND MANUFACTURING METHOD THEREOF 有权
    永磁体及其制造方法

    公开(公告)号：US20120182108A1

    公开(公告)日：2012-07-19

    申请号：US13499568

    申请日：2011-03-28

    Applicant: Izumi Ozeki ,  Katsuya Kume ,  Keisuke Hirano ,  Tomohiro Omure ,  Keisuke Taihaku ,  Takashi Ozaki

    Inventor： Izumi Ozeki ,  Katsuya Kume ,  Keisuke Hirano ,  Tomohiro Omure ,  Keisuke Taihaku ,  Takashi Ozaki

    IPC: H01F7/02 ,  B22F3/12 ,  B22F1/02

    CPC classification number: H01F41/0266 ,  B22F2998/10 ,  C22C33/0278 ,  C22C2202/02 ,  H01F1/0572 ,  H01F1/0577 ,  H01F1/086 ,  B22F9/04 ,  B22F1/02 ,  B22F9/22 ,  B22F2003/248 ,  B22F3/02 ,  B22F3/10

    Abstract: There are provided a permanent magnet and a manufacturing method thereof capable of densely sintering the entirety of the magnet without making a gap between a main phase and a grain boundary phase in the sintered magnet. To fine powder of milled neodymium magnet is added an organometallic compound solution containing an organometallic compound expressed with a structural formula of M-(OR)x (M represents V, Mo, Zr, Ta, Ti, W or Nb, R represents a substituent group consisting of a straight-chain or branched-chain hydrocarbon, x represents an arbitrary integer) so as to uniformly adhere the organometallic compound to particle surfaces of the neodymium magnet powder. Thereafter, desiccated magnet powder is held for several hours in hydrogen atmosphere at 200 through 900 degrees Celsius. Thereafter, the powdery calcined body calcined through the calcination process in hydrogen is held for several hours in vacuum atmosphere at 200 through 600 degrees Celsius for a dehydrogenation process.

    Abstract translation: 提供了一种永磁体及其制造方法，其能够在烧结磁体中在主相和晶界相之间形成间隙而密集地烧结整个磁体。 向研磨的钕磁体的细粉末中加入含有结构式为M-（OR）x（M表示V，Mo，Zr，Ta，Ti，W或Nb的有机金属化合物）的有机金属化合物溶液，R表示取代基 由直链或支链烃构成的基团，x表示任意的整数），以使有机金属化合物均匀地附着于钕磁体粉末的粒子表面。 此后，将干燥的磁铁粉末在200-900摄氏度的氢气氛中保持数小时。 此后，通过煅烧工序在氢气中煅烧的粉状煅烧体在真空度为200〜600摄氏度的条件下在脱氢工序中保持数小时。

    Producing method of semiconductor device and substrate processing apparatus
    6.
    发明授权
    Producing method of semiconductor device and substrate processing apparatus 有权
    半导体器件和衬底处理设备的生产方法

    公开(公告)号：US08084369B2

    公开(公告)日：2011-12-27

    申请号：US12404003

    申请日：2009-03-13

    Applicant: Takashi Ozaki ,  Kazuhiro Yuasa ,  Kiyohiko Maeda

    Inventor： Takashi Ozaki ,  Kazuhiro Yuasa ,  Kiyohiko Maeda

    IPC: H01L21/31 ,  H01L21/469

    CPC classification number: H01L21/02238 ,  H01L21/0223 ,  H01L21/02255 ,  H01L21/31662 ,  H01L21/67109

    Abstract: Disclosed is a producing method of a semiconductor device produced by transferring a plurality of substrates into a processing chamber, supplying oxygen-containing gas and hydrogen-containing gas into the processing chamber to process the plurality of substrates by oxidation, and transferring the plurality of the oxidation-processed substrates out from the processing chamber, wherein in the oxidation-processing, the hydrogen-containing gas is supplied from a plurality of locations of a region which is in proximity to the inner wall of the processing chamber and which corresponds to a substrate arrangement region in which the plurality of substrates are arranged in the processing chamber.

    Abstract translation: 公开了一种通过将多个基板转移到处理室中而制造的半导体器件的制造方法，向处理室供给含氧气体和含氢气体，以通过氧化处理多个基板，并且将多个基板 氧化处理的基板从处理室出来，其中在氧化处理中，含氢气体从位于处理室的内壁附近并对应于基板的区域的多个位置供应 其中所述多个基板布置在所述处理室中。

    Substrate processing apparatus, method of manufacturing a semiconductor device, and method of forming a thin film on metal surface
    7.
    发明授权
    Substrate processing apparatus, method of manufacturing a semiconductor device, and method of forming a thin film on metal surface 有权
    基板处理装置，制造半导体装置的方法以及在金属表面上形成薄膜的方法

    公开(公告)号：US07879400B2

    公开(公告)日：2011-02-01

    申请号：US11907270

    申请日：2007-10-10

    Applicant: Takahiro Maeda ,  Kiyohiko Maeda ,  Takashi Ozaki

    Inventor： Takahiro Maeda ,  Kiyohiko Maeda ,  Takashi Ozaki

    IPC: C23C16/00

    CPC classification number: C23C16/4404 ,  Y10T428/1259 ,  Y10T428/265

    Abstract: There is provided a substrate processing apparatus equipped with a metallic component, with at least a part of its metallic surface exposed to an inside of a processing chamber and subjected to baking treatment at a pressure less than atmospheric pressure. As a result of this baking treatment, a film which does not react with various types of reactive gases, and which can block the out diffusion of metals, is formed on the surface of the above-mentioned metallic component.

    Abstract translation: 提供了一种配备有金属部件的基板处理装置，其金属表面的至少一部分暴露于处理室的内部，并在低于大气压的压力下进行烘烤处理。 作为这种烘烤处理的结果，在上述金属组分的表面上形成不与各种反应性气体反应并且可以阻止金属扩散的膜。

    Substrate treating apparatus and method for manufacturing semiconductor device
    8.
    发明申请
    Substrate treating apparatus and method for manufacturing semiconductor device 有权

    公开(公告)号：US20100201055A1

    公开(公告)日：2010-08-12

    申请号：US12662384

    申请日：2010-04-14

    Applicant: Takashi Ozaki ,  Kenichi Suzaki

    Inventor： Takashi Ozaki ,  Kenichi Suzaki

    IPC: B25B11/00

    CPC classification number: H01L21/67309 ,  C23C16/4401 ,  C23C16/4583 ,  C23C16/4584 ,  H01L21/67098 ,  H01L21/67253 ,  Y10S269/903 ,  Y10T29/49126

    Abstract: A support section (28) for supporting a wafer (1) is convexly formed in the center of a receiving section (26) of a support groove (25) of a boat 21. At the time of boat loading of the boat (21), in which wafers (1) respectively received by the supporting sections (28) are aligned, from a standby chamber (33) to a processing chamber (14), the pressure in the standby chamber (33) and processing chamber (14) is set to 200 pascals or more, and 3000 pascals or less. By supporting the wafer upwards from the receiving section with use of the support section, even if peeling of the film on the wafer occurs from a large frictional force between the supported surface of the wafer and the support section under a reduced pressure, the particles from the peeling are caught by the receiving section and therefore particles are prevented from adhering to the IC fabrication surface of the wafer directly below the receiving section.

    Medical Device Data Analysis Device
    9.
    发明申请
    Medical Device Data Analysis Device 审中-公开
    医疗器械数据分析装置

    公开(公告)号：US20080161658A1

    公开(公告)日：2008-07-03

    申请号：US11795675

    申请日：2006-01-16

    Applicant: Koichi Tashiro ,  Akinobu Uchikubo ,  Masakazu Gotanda ,  Chie Imamiya ,  Takeaki Nakamura ,  Takashi Ozaki

    Inventor： Koichi Tashiro ,  Akinobu Uchikubo ,  Masakazu Gotanda ,  Chie Imamiya ,  Takeaki Nakamura ,  Takashi Ozaki

    IPC: A61B5/00

    CPC classification number: G06Q50/22 ,  A61B34/10 ,  A61B90/00 ,  A61B2018/00988 ,  G06F19/3418

    Abstract: The medical device data analysis device (57, 22) of the present invention are used for analyzing plural kinds of data of plural medical devices which have been obtained during an operation, and includes a data input portion for inputting the plural kinds of data outputted from the plural medical devices respectively, a data storage portion for storing the plural kinds of data outputted from the medical devices and inputted through the data input portion, and a display processing portion for processing the plural kinds of data stored in the data storage portion so as to be displayed, wherein the display processing portion executes a graph display processing for allowing display of the plural kinds of data stored in the data storage portion in a graph with a same time axis.

    Abstract translation: 本发明的医疗装置数据分析装置（57,22）用于分析在操作期间获得的多种医疗装置的多种数据，并且包括：数据输入部，其输入从 多个医疗装置，分别存储从医疗装置输出并通过数据输入部输入的多种数据的数据存储部分，以及用于处理存储在数据存储部分中的多种数据的显示处理部分，以便 要显示，其中显示处理部分执行用于允许以相同的时间轴显示存储在数据存储部分中的多种数据的图形显示处理。

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