公开(公告)号：US10950485B2

公开(公告)日：2021-03-16

申请号：US16559089

申请日：2019-09-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsai-Hao Hung ,  Ping-Cheng Ko ,  Tzu-Yang Lin ,  Fang-Yu Liu ,  Cheng-Han Wu

IPC: H01L21/687 ,  H01L21/677 ,  H01L21/67 ,  H05F1/00 ,  H01L21/66

Abstract: Semiconductor processing apparatuses and methods are provided in which an electrostatic discharge (ESD) prevention layer is utilized to prevent or reduce ESD events from occurring between a semiconductor wafer and one or more components of the apparatuses. In some embodiments, a semiconductor processing apparatus includes a wafer handling structure that is configured to support a semiconductor wafer during processing of the semiconductor wafer. The apparatus further includes an ESD prevention layer on the wafer handling structure. The ESD prevention layer includes a first material and a second material, and the second material has an electrical conductivity that is greater than an electrical conductivity of the first material.

公开(公告)号：US11796123B2

公开(公告)日：2023-10-24

申请号：US16922387

申请日：2020-07-07

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tse-Lun Hsu ,  Fang-Yu Liu ,  Tsez-Chong Tsai

IPC: F16M11/08 ,  B23P19/04 ,  G06K7/10 ,  H04W4/80 ,  H01L21/67 ,  H01L21/673

CPC classification number: F16M11/08 ,  B23P19/04 ,  G06K7/10009 ,  H01L21/67373 ,  H01L21/67386 ,  H04W4/80

Abstract: An apparatus includes a first portion and a second portion. The first portion includes a first front side wall, a first rear side wall, a top wall, and at least one pivotal pin structure extending from the first rear side wall. The at least one pivotal pin structure comprises a base, a shaft, and a head having a non-circular cross-sectional shape. The second portion includes a second front side wall, a second rear side wall, a bottom wall, and at least one pin holder extending from the second rear side wall. The at least one pin holder defines an opening for accepting the head of the at least one pivotal pin structure at an alignment. The head of the at least one pivotal pin structure extends through the opening. The first portion and the second portion are pivotally movable between an open configuration and a closed container configuration.

公开(公告)号：US11532499B2

公开(公告)日：2022-12-20

申请号：US17182782

申请日：2021-02-23

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsai-Hao Hung ,  Ping-Cheng Ko ,  Tzu-Yang Lin ,  Fang-Yu Liu ,  Cheng-Han Wu

IPC: H01L21/687 ,  H01L21/677 ,  H01L21/67 ,  H05F1/00 ,  H01L21/66

Abstract: Semiconductor processing apparatuses and methods are provided in which an electrostatic discharge (ESD) prevention layer is utilized to prevent or reduce ESD events from occurring between a semiconductor wafer and one or more components of the apparatuses. In some embodiments, a semiconductor processing apparatus includes a wafer handling structure that is configured to support a semiconductor wafer during processing of the semiconductor wafer. The apparatus further includes an ESD prevention layer on the wafer handling structure. The ESD prevention layer includes a first material and a second material, and the second material has an electrical conductivity that is greater than an electrical conductivity of the first material.

公开(公告)号：US20200332943A1

公开(公告)日：2020-10-22

申请号：US16922387

申请日：2020-07-07

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tse-Lun Hsu ,  Fang-Yu Liu ,  Tsez-Chong Tsai

IPC: F16M11/08 ,  B23P19/04 ,  G06K7/10 ,  H04W4/80 ,  H01L21/673

Abstract: An apparatus includes a first portion and a second portion. The first portion includes a first front side wall, a first rear side wall, a top wall, and at least one pivotal pin structure extending from the first rear side wall. The at least one pivotal pin structure comprises a base, a shaft, and a head having a non-circular cross-sectional shape. The second portion includes a second front side wall, a second rear side wall, a bottom wall, and at least one pin holder extending from the second rear side wall. The at least one pin holder defines an opening for accepting the head of the at least one pivotal pin structure at an alignment. The head of the at least one pivotal pin structure extends through the opening. The first portion and the second portion are pivotally movable between an open configuration and a closed container configuration.

公开(公告)号：US12255091B2

公开(公告)日：2025-03-18

申请号：US18516703

申请日：2023-11-21

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsai-Hao Hung ,  Ping-Cheng Ko ,  Tzu-Yang Lin ,  Fang-Yu Liu ,  Cheng-Han Wu

IPC: H01L21/687 ,  H01L21/66 ,  H01L21/67 ,  H01L21/677 ,  H05F1/00

Abstract: Semiconductor processing apparatuses and methods are provided in which an electrostatic discharge (ESD) prevention layer is utilized to prevent or reduce ESD events from occurring between a semiconductor wafer and one or more components of the apparatuses. In some embodiments, a semiconductor processing apparatus includes a wafer handling structure that is configured to support a semiconductor wafer during processing of the semiconductor wafer. The apparatus further includes an ESD prevention layer on the wafer handling structure. The ESD prevention layer includes a first material and a second material, and the second material has an electrical conductivity that is greater than an electrical conductivity of the first material.

公开(公告)号：US11854860B2

公开(公告)日：2023-12-26

申请号：US18055784

申请日：2022-11-15

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tsai-Hao Hung ,  Ping-Cheng Ko ,  Tzu-Yang Lin ,  Fang-Yu Liu ,  Cheng-Han Wu

IPC: H01L21/687 ,  H01L21/67 ,  H01L21/677 ,  H01L21/66 ,  H05F1/00

CPC classification number: H01L21/68757 ,  H01L21/6719 ,  H01L21/67167 ,  H01L21/67173 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67242 ,  H01L21/67742 ,  H01L22/10 ,  H05F1/00

Abstract: Semiconductor processing apparatuses and methods are provided in which an electrostatic discharge (ESD) prevention layer is utilized to prevent or reduce ESD events from occurring between a semiconductor wafer and one or more components of the apparatuses. In some embodiments, a semiconductor processing apparatus includes a wafer handling structure that is configured to support a semiconductor wafer during processing of the semiconductor wafer. The apparatus further includes an ESD prevention layer on the wafer handling structure. The ESD prevention layer includes a first material and a second material, and the second material has an electrical conductivity that is greater than an electrical conductivity of the first material.

公开(公告)号：US10738935B2

公开(公告)日：2020-08-11

申请号：US15713772

申请日：2017-09-25

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tse-Lun Hsu ,  Fang-Yu Liu ,  Tsez-Chong Tsai

IPC: F16M11/08 ,  B23P19/04 ,  G06K7/10 ,  H01L21/673 ,  H04W4/80

Abstract: An apparatus includes a first portion and a second portion. The first portion includes a first front side wall, a first rear side wall, a top wall, and at least one pivotal pin structure extending from the first rear side wall. The at least one pivotal pin structure comprises a base, a shaft, and a head having a non-circular cross-sectional shape. The second portion includes a second front side wall, a second rear side wall, a bottom wall, and at least one pin holder extending from the second rear side wall. The at least one pin holder defines an opening for accepting the head of the at least one pivotal pin structure at an alignment. The head of the at least one pivotal pin structure extends through the opening. The first portion and the second portion are pivotally movable between an open configuration and a closed container configuration.

公开(公告)号：US20240360950A1

公开(公告)日：2024-10-31

申请号：US18770555

申请日：2024-07-11

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tse-Lun Hsu ,  Fang-Yu Liu ,  Tsez-Chong Tsai

IPC: F16M11/08 ,  B23P19/04 ,  G06K7/10 ,  H01L21/673 ,  H04W4/80

CPC classification number: F16M11/08 ,  B23P19/04 ,  G06K7/10009 ,  H01L21/67373 ,  H01L21/67386 ,  H04W4/80

Abstract: An apparatus includes a first portion and a second portion. The first portion includes a first front side wall, a first rear side wall, a top wall, and at least one pivotal pin structure extending from the first rear side wall. The at least one pivotal pin structure comprises a base, a shaft, and a head having a non-circular cross-sectional shape. The second portion includes a second front side wall, a second rear side wall, a bottom wall, and at least one pin holder extending from the second rear side wall. The at least one pin holder defines an opening for accepting the head of the at least one pivotal pin structure at an alignment. The head of the at least one pivotal pin structure extends through the opening. The first portion and the second portion are pivotally movable between an open configuration and a closed container configuration.

公开(公告)号：US12085220B2

公开(公告)日：2024-09-10

申请号：US18231763

申请日：2023-08-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tse-Lun Hsu ,  Fang-Yu Liu ,  Tsez-Chong Tsai

IPC: F16M11/08 ,  B23P19/04 ,  G06K7/10 ,  H01L21/67 ,  H01L21/673 ,  H04W4/80

CPC classification number: F16M11/08 ,  B23P19/04 ,  G06K7/10009 ,  H01L21/67373 ,  H01L21/67386 ,  H04W4/80

Abstract: An apparatus includes a first portion and a second portion. The first portion includes a first front side wall, a first rear side wall, a top wall, and at least one pivotal pin structure extending from the first rear side wall. The at least one pivotal pin structure comprises a base, a shaft, and a head having a non-circular cross-sectional shape. The second portion includes a second front side wall, a second rear side wall, a bottom wall, and at least one pin holder extending from the second rear side wall. The at least one pin holder defines an opening for accepting the head of the at least one pivotal pin structure at an alignment. The head of the at least one pivotal pin structure extends through the opening. The first portion and the second portion are pivotally movable between an open configuration and a closed container configuration.

公开(公告)号：US20230383895A1

公开(公告)日：2023-11-30

申请号：US18231763

申请日：2023-08-08

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Tse-Lun HSU ,  Fang-Yu Liu ,  Tsez-Chong Tsai

IPC: F16M11/08 ,  B23P19/04 ,  G06K7/10 ,  H04W4/80 ,  H01L21/673

CPC classification number: F16M11/08 ,  B23P19/04 ,  H01L21/67373 ,  H04W4/80 ,  H01L21/67386 ,  G06K7/10009

Abstract: An apparatus includes a first portion and a second portion. The first portion includes a first front side wall, a first rear side wall, a top wall, and at least one pivotal pin structure extending from the first rear side wall. The at least one pivotal pin structure comprises a base, a shaft, and a head having a non-circular cross-sectional shape. The second portion includes a second front side wall, a second rear side wall, a bottom wall, and at least one pin holder extending from the second rear side wall. The at least one pin holder defines an opening for accepting the head of the at least one pivotal pin structure at an alignment. The head of the at least one pivotal pin structure extends through the opening. The first portion and the second portion are pivotally movable between an open configuration and a closed container configuration.