公开(公告)号：US20250093593A1

公开(公告)日：2025-03-20

申请号：US18403531

申请日：2024-01-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wen-Chih Lin ,  Cheng-Yu Kuo ,  Yen-Hung Chen ,  Hsuan-Ting Kuo ,  Chia-Shen Cheng ,  Chao-Wei Li ,  Ching-Hua Hsieh ,  Wen-Chih Chiou ,  Ming-Fa Chen ,  Shang-Yun Hou

IPC: G02B6/42

Abstract: Optical devices and methods of manufacture are presented in which a mirror structure is utilized to transmit and receive optical signals to and from an optical device. In embodiments the mirror structure receives optical signals from outside of an optical device and directs the optical signals through at least one mirror to an optical component of the optical device.

公开(公告)号：US20240274440A1

公开(公告)日：2024-08-15

申请号：US18631589

申请日：2024-04-10

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Te-Chien Hou ,  Yu-Ting Yen ,  Cheng-Yu Kuo ,  Chih Hung Chen ,  William Weilun Hong ,  Kei-Wei Chen

IPC: H01L21/3105 ,  B24B37/04 ,  B24B37/20 ,  C02F1/469 ,  H01L21/02 ,  H01L29/66

CPC classification number: H01L21/31053 ,  B24B37/042 ,  B24B37/044 ,  B24B37/20 ,  H01L21/02065 ,  H01L21/31055 ,  H01L29/66545 ,  C02F1/4691

Abstract: A chemical mechanical planarization (CMP) system including a capacitive deionization module (CDM) for removing ions from a solution and a method for using the same are disclosed. In an embodiment, an apparatus includes a planarization unit for planarizing a wafer; a cleaning unit for cleaning the wafer; a wafer transportation unit for transporting the wafer between the planarization unit and the cleaning unit; and a capacitive deionization module for removing ions from a solution used in at least one of the planarization unit or the cleaning unit.

公开(公告)号：US11984323B2

公开(公告)日：2024-05-14

申请号：US17372705

申请日：2021-07-12

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Te-Chien Hou ,  Yu-Ting Yen ,  Cheng-Yu Kuo ,  Chih Hung Chen ,  William Weilun Hong ,  Kei-Wei Chen

IPC: H01L21/3105 ,  B24B37/04 ,  B24B37/20 ,  C02F1/469 ,  H01L21/02 ,  H01L29/66

CPC classification number: H01L21/31053 ,  B24B37/042 ,  B24B37/044 ,  B24B37/20 ,  H01L21/02065 ,  H01L21/31055 ,  H01L29/66545 ,  C02F1/4691

Abstract: A chemical mechanical planarization (CMP) system including a capacitive deionization module (CDM) for removing ions from a solution and a method for using the same are disclosed. In an embodiment, an apparatus includes a planarization unit for planarizing a wafer; a cleaning unit for cleaning the wafer; a wafer transportation unit for transporting the wafer between the planarization unit and the cleaning unit; and a capacitive deionization module for removing ions from a solution used in at least one of the planarization unit or the cleaning unit.

公开(公告)号：US20210343538A1

公开(公告)日：2021-11-04

申请号：US17372705

申请日：2021-07-12

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Te-Chien Hou ,  Yu-Ting Yen ,  Cheng-Yu Kuo ,  Chih Hung Chen ,  William Weilun Hong ,  Kei-Wei Chen

IPC: H01L21/3105 ,  B24B37/04 ,  H01L29/66 ,  B24B37/20

Abstract: A chemical mechanical planarization (CMP) system including a capacitive deionization module (CDM) for removing ions from a solution and a method for using the same are disclosed. In an embodiment, an apparatus includes a planarization unit for planarizing a wafer; a cleaning unit for cleaning the wafer; a wafer transportation unit for transporting the wafer between the planarization unit and the cleaning unit; and a capacitive deionization module for removing ions from a solution used in at least one of the planarization unit or the cleaning unit.

公开(公告)号：US20200168568A1

公开(公告)日：2020-05-28

申请号：US16441029

申请日：2019-06-14

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Cheng-Yu Kuo ,  Ching-Hua Hsieh ,  Chen-Hua Yu ,  Chung-Shi Liu ,  Yi-Yang Lei ,  Wei-Jie Huang

IPC: H01L23/66 ,  H01L23/29 ,  H01L23/31 ,  H01L23/00 ,  H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01Q1/22

Abstract: A package structure includes a semiconductor die, an insulating encapsulant, a first redistribution layer, a second redistribution layer, antenna elements and a first insulating film. The insulating encapsulant is encapsulating the at least one semiconductor die, the insulating encapsulant has a first surface and a second surface opposite to the first surface. The first redistribution layer is disposed on the first surface of the insulating encapsulant. The second redistribution layer is disposed on the second surface of the insulating encapsulant. The antenna elements are located over the second redistribution layer. The first insulating film is disposed in between the second redistribution layer and the antenna elements, wherein the first insulating film comprises a resin rich region and a filler rich region, the resin rich region is located in between the filler rich region and the second redistribution layer and separating the filler rich region from the second redistribution layer.