公开(公告)号：US20210039551A1

公开(公告)日：2021-02-11

申请号：US16934190

申请日：2020-07-21

申请人： TOYODA GOSEI CO., LTD.

发明人： Eiki KAWANO ,  Kenjo Matsui

IPC分类号： B60Q3/85 ,  B60Q3/20 ,  B60Q3/14

摘要： A vehicle interior lighting device includes a light-emitting portion, a case that includes a side wall surrounding the light-emitting portion and houses the light-emitting portion, and a plate-shaped lens fixed to the case so as to cover an opening of the case and an open end of the side wall defining the opening. Light emitted from the light-emitting portion can be extracted from the entire region of a light extraction surface of the lens including an edge without being reflected.

公开(公告)号：US20180166620A1

公开(公告)日：2018-06-14

申请号：US15834132

申请日：2017-12-07

申请人： TOYODA GOSEI CO., LTD.

发明人： Eiki KAWANO ,  Norifumi HATTORI

IPC分类号： H01L33/64 ,  H01L21/66 ,  H01L23/495 ,  H01L21/48 ,  H01L33/62

CPC分类号： H01L33/647 ,  H01L21/48 ,  H01L21/4839 ,  H01L21/4842 ,  H01L22/32 ,  H01L23/3107 ,  H01L23/48 ,  H01L23/49503 ,  H01L23/49551 ,  H01L23/49558 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49861 ,  H01L25/167 ,  H01L33/62 ,  H01L2933/0066

摘要： An electronic device includes: a first element which generates heat, and a second element which generates heat; a lead frame which includes: a first portion on which the first element is mounted; a second portion on which the second element is mounted; and a high-heat resistance portion between the first portion and the second portion; and a resin portion which covers a part of the lead frame.

公开(公告)号：US20160300989A1

公开(公告)日：2016-10-13

申请号：US15073305

申请日：2016-03-17

申请人： TOYODA GOSEI CO., LTD.

发明人： Eiki KAWANO ,  Masayuki Kaneko ,  Norifumi Hattori

IPC分类号： H01L33/62 ,  H01L33/54 ,  H01L33/48 ,  H01L33/56

CPC分类号： H01L33/62 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L33/486 ,  H01L2224/45015 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49113 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85424 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2933/0066 ,  H01L2224/45099 ,  H01L2924/20752 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2924/00

摘要： A light emitting device includes: a first lead including a first base portion having a constant thickness and a first small-thickness portion having a thickness smaller than that of the first base portion; a second lead including a second base portion having a constant thickness and a second small-thickness portion having a thickness smaller than that of the second base portion; wherein the first small-thickness portion and the second small-thickness portion face each other with a gap interposed therebetween; the length of the gap is 0.9 to 1.2 times the thickness of the edges of the first small-thickness portion and the second small-thickness portion; the length of the bonding wire in a plan view of the light emitting device is smaller than a value obtained by adding the thickness of the base portion, a width of a mounting-disabled area, and a width of a bonding-disabled area.

摘要翻译： 发光器件包括：第一引线，其包括具有恒定厚度的第一基部和具有比第一基部的厚度小的第一小厚度部分; 第二引线，包括具有恒定厚度的第二基部和具有比第二基部的厚度小的第二小厚度部分; 其中所述第一小厚度部分和所述第二小厚度部分彼此间隔开间隙; 间隙的长度是第一小厚度部分和第二小厚度部分的边缘厚度的0.9至1.2倍; 发光装置的平面图中的接合线的长度小于通过将基部的厚度，安装禁止区域的宽度和接合禁止区域的宽度相加而获得的值。