公开(公告)号：US20200381342A1

公开(公告)日：2020-12-03

申请号：US16886130

申请日：2020-05-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： YongSeok PARK ,  Makarand Ramkrishna KULKARNI ,  Ricky Alan JACKSON ,  Byron Lovell WILLIAMS ,  Thomas Dyer BONIFIELD

IPC: H01L23/495 ,  H01L23/528 ,  H01L23/31 ,  H01L43/06 ,  G01R15/20 ,  H01L21/56 ,  H01L21/48 ,  H01L23/00

Abstract: In examples, a semiconductor package comprises a first conductive terminal; a second conductive terminal; a conductive pathway coupling the first and second conductive terminals, the conductive pathway configured to generate a magnetic field; a semiconductor die including a circuit configured to detect the magnetic field; and first and second polyimide layers positioned between the conductive pathway and the semiconductor die.

公开(公告)号：US20190206828A1

公开(公告)日：2019-07-04

申请号：US16025603

申请日：2018-07-02

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Honglin GUO ,  Jason CHIEN ,  Byron Lovell WILLIAMS ,  Jeffrey Alan WEST ,  Anderson LI ,  Arvin Nono VERDEFLOR

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/495 ,  H01L23/31 ,  H01L25/065 ,  H01L25/00

CPC classification number: H01L24/49 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/85 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45664 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49505 ,  H01L2224/85013 ,  H01L2224/85913 ,  H01L2924/1205

Abstract: An integrated circuit package and methods for packaging an integrated circuit. In one example, a method for packaging an integrated circuit includes connecting input/output pads of a first die to terminals of a lead frame via palladium coated copper wires. An oxygen plasma is applied to the first die and the palladium coated copper wires. The first die and the palladium coated copper wires are encapsulated in a mold compound after application of the oxygen plasma.

公开(公告)号：US20200251440A1

公开(公告)日：2020-08-06

申请号：US16854823

申请日：2020-04-21

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Honglin GUO ,  Jason CHIEN ,  Byron Lovell WILLIAMS ,  Jeffrey Alan WEST ,  Anderson LI ,  Arvin Nono VERDEFLOR

IPC: H01L23/00 ,  H01L25/00 ,  H01L25/065 ,  H01L23/31 ,  H01L23/495 ,  H01L21/56

Abstract: An integrated circuit and methods for packaging the integrated circuit. In one example, a method for packaging an integrated circuit includes connecting input/output pads of a first integrated circuit die to terminals of a lead frame via palladium coated copper wires. An oxygen plasma is applied to the first integrated circuit die and the palladium coated copper wires. The first integrated circuit die and the palladium coated copper wires are encapsulated in a mold compound after application of the oxygen plasma.

公开(公告)号：US20200168534A1

公开(公告)日：2020-05-28

申请号：US16202663

申请日：2018-11-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Thomas Dyer BONIFIELD ,  Sreeram Subramanyam NASUM ,  Robert H. EKLUND ,  Jeffrey Alan WEST ,  Byron Lovell WILLIAMS ,  Elizabeth Costner STEWART

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/00

Abstract: In some examples, a multi-chip module (MCM), comprises a first and a second die-attach pad (DAP); a first die comprising a first set of microelectronic devices; a second die comprising a first capacitor and a second capacitor; and a third die comprising a second set of microelectronic devices, where the first and second dies are positioned on the first DAP, and the third die is positioned on the second DAP. The first set of microelectronic devices couples to the first capacitor via a first inter-die connection and the second set of microelectronic devices couples to the second capacitor via a second inter-die connection.