公开(公告)号：US20200381342A1

公开(公告)日：2020-12-03

申请号：US16886130

申请日：2020-05-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： YongSeok PARK ,  Makarand Ramkrishna KULKARNI ,  Ricky Alan JACKSON ,  Byron Lovell WILLIAMS ,  Thomas Dyer BONIFIELD

IPC: H01L23/495 ,  H01L23/528 ,  H01L23/31 ,  H01L43/06 ,  G01R15/20 ,  H01L21/56 ,  H01L21/48 ,  H01L23/00

Abstract: In examples, a semiconductor package comprises a first conductive terminal; a second conductive terminal; a conductive pathway coupling the first and second conductive terminals, the conductive pathway configured to generate a magnetic field; a semiconductor die including a circuit configured to detect the magnetic field; and first and second polyimide layers positioned between the conductive pathway and the semiconductor die.