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公开(公告)号：US09326383B2
公开(公告)日：2016-04-26
申请号：US13913114
申请日：2013-06-07
Applicant: TELEDYNE SCIENTIFIC & IMAGING, LLC
Inventor： Steve Qingjun Cai , Chung-Lung Chen , Chialun Tsai
CPC classification number: H01L23/427 , B23P15/26 , F28D15/0266 , F28D15/0283 , F28D15/046 , F28F21/04 , H01L21/4882 , H01L2924/0002 , H05K3/22 , Y10T29/49352 , Y10T29/49353 , Y10T156/10 , H01L2924/00
Abstract: A system and method is disclosed for fabricating a heat spreader system, including providing a plurality of bottom microporous wicks recessed in a bottom substrate, bonding a center substrate to the bottom substrate, and bonding a top substrate having a top chamber portion to the center substrate to establish a first vapor chamber with said plurality of bottom microporous wicks.
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公开(公告)号：US20160190037A1
公开(公告)日：2016-06-30
申请号：US15064304
申请日：2016-03-08
Applicant: TELEDYNE SCIENTIFIC & IMAGING, LLC
Inventor： Steve Qingjun Cai , Chung-Lung Chen , Chialun Tsai
IPC: H01L23/427 , B23P15/26 , F28F21/04 , F28D15/02 , F28D15/04
CPC classification number: H01L23/427 , B23P15/26 , F28D15/0266 , F28D15/0283 , F28D15/046 , F28F21/04 , H01L21/4882 , H01L2924/0002 , H05K3/22 , Y10T29/49352 , Y10T29/49353 , Y10T156/10 , H01L2924/00
Abstract: A system and method is disclosed for fabricating a heat spreader system, including providing a plurality of bottom microporous wicks recessed in a bottom substrate, bonding a center substrate to the bottom substrate, and bonding a top substrate having a top chamber portion to the center substrate to establish a first vapor chamber with said plurality of bottom microporous wicks.
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Patent Agency Ranking
公开(公告)号：US10727156B2
公开(公告)日：2020-07-28
申请号：US15064304
申请日：2016-03-08
Applicant: TELEDYNE SCIENTIFIC & IMAGING, LLC
Inventor： Steve Qingjun Cai , Chung-Lung Chen , Chialun Tsai
Abstract: A system and method is disclosed for fabricating a heat spreader system, including providing a plurality of bottom microporous wicks recessed in a bottom substrate, bonding a center substrate to the bottom substrate, and bonding a top substrate having a top chamber portion to the center substrate to establish a first vapor chamber with said plurality of bottom microporous wicks.
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公开(公告)号：US20130270220A1
公开(公告)日：2013-10-17
申请号：US13913114
申请日：2013-06-07
Applicant: TELEDYNE SCIENTIFIC & IMAGING, LLC
Inventor： Qingjun Cai , Chung-Lung Chen , Chialun Tsai
IPC: H05K3/22
CPC classification number: H01L23/427 , B23P15/26 , F28D15/0266 , F28D15/0283 , F28D15/046 , F28F21/04 , H01L21/4882 , H01L2924/0002 , H05K3/22 , Y10T29/49352 , Y10T29/49353 , Y10T156/10 , H01L2924/00
Abstract: A system and method is disclosed for fabricating a heat spreader system, including providing a plurality of bottom microporous wicks recessed in a bottom substrate, bonding a center substrate to the bottom substrate, and bonding a top substrate having a top chamber portion to the center substrate to establish a first vapor chamber with said plurality of bottom microporous wicks.
Abstract translation: 公开了一种用于制造散热器系统的系统和方法，包括提供凹陷在底部衬底中的多个底部微孔芯，将中心衬底接合到底部衬底，以及将具有顶部腔室部分的顶部衬底结合到中心衬底 建立具有所述多个底部微孔芯的第一蒸气室。
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公开(公告)号：US20130112376A1
公开(公告)日：2013-05-09
申请号：US13726434
申请日：2012-12-24
Applicant: Teledyne Scientific & Imaging, LLC
Inventor： Yuan Zhao , Chung-Lung Chen
IPC: F28D1/00
CPC classification number: F28D1/00 , B22F3/11 , B22F2003/026 , B22F2998/10 , B22F2999/00 , F28D15/046 , F28F2255/18 , Y10T428/131 , B22F3/02 , B22F3/1007 , B22F3/1017 , B22F2201/013 , B22F2201/20
Abstract: A heat pipe apparatus having a sintered lattice wick structure includes a plurality of wicking walls having respective length, width and heights and spaced in parallel to wick liquid in a first direction along the respective lengths, the respective lengths being longer than the respective widths and the respective heights, the plurality of wicking walls being adjacent to one another and spaced apart to form vapor vents between them, a plurality of interconnect wicking walls to wick liquid between adjacent wicking walls in a second direction substantially perpendicular to the first direction, and a vapor chamber encompassing the sintered lattice wick structure, the vapor chamber having an interior condensation surface and interior evaporator surface, wherein the plurality of wicking walls and the plurality of interconnect wicking walls are configured to wick liquid in first and second directions and the vapor vents communicate vapor in a direction orthogonal to the first and second directions.
Abstract translation: 具有烧结格栅芯结构的热管装置包括多个具有相应长度，宽度和高度的芯吸壁，并且沿着各自的长度在第一方向上与芯液体平行地间隔开，各自的长度大于相应的宽度，并且 多个芯吸壁彼此相邻并间隔开以在它们之间形成蒸汽通气口;多个互连芯吸壁，用于在基本上垂直于第一方向的第二方向上吸收相邻芯吸壁之间的液体;以及蒸汽 包括烧结晶格灯芯结构的腔室，蒸气室具有内部冷凝表面和内部蒸发器表面，其中多个芯吸壁和多个互连芯吸壁构造成在第一和第二方向上吸收液体，并且蒸汽通风口连通蒸汽 在与第一和第二歪斜正交的方向上 动作。
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公开(公告)号：US09459050B2
公开(公告)日：2016-10-04
申请号：US13726434
申请日：2012-12-24
Applicant: Teledyne Scientific & Imaging, LLC
Inventor： Yuan Zhao , Chung-Lung Chen
CPC classification number: F28D1/00 , B22F3/11 , B22F2003/026 , B22F2998/10 , B22F2999/00 , F28D15/046 , F28F2255/18 , Y10T428/131 , B22F3/02 , B22F3/1007 , B22F3/1017 , B22F2201/013 , B22F2201/20
Abstract: A heat pipe apparatus having a sintered lattice wick structure includes a plurality of wicking walls having respective length, width and heights and spaced in parallel to wick liquid in a first direction along the respective lengths, the respective lengths being longer than the respective widths and the respective heights, the plurality of wicking walls being adjacent to one another and spaced apart to form vapor vents between them, a plurality of interconnect wicking walls to wick liquid between adjacent wicking walls in a second direction substantially perpendicular to the first direction, and a vapor chamber encompassing the sintered lattice wick structure, the vapor chamber having an interior condensation surface and interior evaporator surface, wherein the plurality of wicking walls and the plurality of interconnect wicking walls are configured to wick liquid in first and second directions and the vapor vents communicate vapor in a direction orthogonal to the first and second directions.
Abstract translation: 具有烧结格栅芯结构的热管装置包括多个具有相应长度，宽度和高度的芯吸壁，并且沿着各自的长度在第一方向上与芯液体平行地间隔开，各自的长度大于相应的宽度，并且 多个芯吸壁彼此相邻并间隔开以在它们之间形成蒸汽通气口;多个互连芯吸壁，用于在基本上垂直于第一方向的第二方向上吸收相邻芯吸壁之间的液体;以及蒸汽 包括烧结晶格灯芯结构的腔室，蒸气室具有内部冷凝表面和内部蒸发器表面，其中多个芯吸壁和多个互连芯吸壁构造成在第一和第二方向上吸收液体，并且蒸汽通风口连通蒸汽 在与第一和第二歪斜正交的方向上 动作。
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7.发明申请High Performance Thermal Interface System With Improved Heat Spreading and CTE Compliance 审中-公开高性能热接口系统，具有改进的散热和CTE符合性公开(公告)号：US20150118514A1
公开(公告)日：2015-04-30
申请号：US14067684
申请日：2013-10-30
Applicant: Teledyne Scientific & Imaging, LLC.
Inventor： Yuan Zhao , Dennis R. Strauss , Ten-Luen T. Liao , Vivek Mehrotra , Chung-Lung Chen
CPC classification number: B23K1/20 , B23K35/262 , B32B3/28 , B32B9/007 , B32B15/01 , B32B15/043 , B32B2250/42 , B32B2255/06 , B32B2255/26 , B32B2307/302 , B32B2311/22 , B32B2311/30 , B32B2313/04 , B32B2457/00 , C22C13/00 , C25D3/30 , C25D5/10 , C25D5/12 , C25D5/48 , C25D5/505 , C25D5/54 , H01L21/4871 , H01L23/373 , H01L2924/0002 , Y10T29/49393 , Y10T428/1241 , Y10T428/12722 , Y10T428/24686 , Y10T428/24711 , Y10T428/30 , H01L2924/00
Abstract: A method of thermal interface material (TIM) assembly includes plating a seed layer on each of a plurality of graphite film layers, each of the graphite film layers comprising parallel-oriented graphite nanoplates, stacking the plurality of graphite film layers, each of the plurality of graphite film layers separated by at least one solder layer, pressing together the stacked graphite film layers, and applying heat to the plurality of graphite film layers and respective at least one solder layer in a vacuumed furnace to form a graphite laminate.
Abstract translation: 热界面材料（TIM）组件的方法包括在多个石墨膜层中的每一个上电镀种子层，每个石墨膜层包括平行取向的石墨纳米板，堆叠多个石墨膜层，每个石墨膜层 的由至少一个焊料层分离的石墨膜层，将堆叠的石墨膜层压在一起，并在真空炉中对多个石墨膜层和相应的至少一个焊料层施加热量以形成石墨层压体。
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