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1.发明授权公开(公告)号：US11894629B2
公开(公告)日：2024-02-06
申请号：US17195738
申请日：2021-03-09
Applicant: TE Connectivity Services GmbH , TYCO ELECTRONICS JAPAN G.K.
Inventor： John Joseph Consoli , Chad William Morgan , Megan Hoarfrost Beers , Christopher William Blackburn , Nathan Lincoln Tracy , Jennifer Love , Clarence Leon Yu , Shinichi Hashimoto , Hiroshi Shirai
CPC classification number: H01R13/2407 , H01R12/52 , H01R12/714 , H01R13/11 , H01R13/2414 , H01R13/6599 , H05K1/095 , H01R12/712 , H05K2201/03 , H05K2201/0314 , H05K2201/0329
Abstract: A socket assembly includes an electrical interconnect having an insulator having apertures. The electrical interconnect includes primary contacts and secondary contacts received in corresponding apertures. The primary contacts include a primary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting first and second electronic packages. The secondary contacts include a secondary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting the first and second electronic packages. The contact tips of the secondary conductive polymer columns have a different shape from the shape of the contact tips of the primary conductive polymer columns.
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公开(公告)号：US20220196926A1
公开(公告)日：2022-06-23
申请号：US17125547
申请日：2020-12-17
Applicant: TE Connectivity Services GmbH
Inventor： Christopher William Blackburn , Nathan Lincoln Tracy
Abstract: An optoelectronic assembly includes an optical module assembly including a fiber optic connector and an optical engine on an optical engine substrate. The fiber optic connector has a ferrule holding optical fibers optically coupled to the optical engine. The optical engine substrate includes a contact array of optical engine contacts at a bottom of the optical engine substrate. The optical module assembly includes a heat transfer element thermally coupled to the optical engine. The optical module assembly includes a backshell configured to be coupled to a circuit board. The backshell holds the heat transfer element in thermal contact with the optical engine. The optoelectronic assembly includes an interposer assembly electrically connected to the contact array of optical engine contacts having compressible interposer contacts with separable mating interfaces.
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公开(公告)号：US20220085532A1
公开(公告)日：2022-03-17
申请号：US17021475
申请日：2020-09-15
Applicant: TE Connectivity Services GmbH
IPC: H01R12/72 , H01R13/659 , H01R13/66 , H01R12/71 , H01R13/6594
Abstract: A communication system includes a receptacle connector assembly including a receptacle cage and a communication connector having an inner receptacle connector and an outer receptacle connector. The communication system includes a pluggable module received in the receptacle cage to mate with the communication connector. The pluggable module includes a pluggable body defining a module cavity. The pluggable module includes a module circuit board having mating pads at a mating edge of the module circuit board plugged into the inner receptacle connector and connector pads at a mounting location remote from the mating edge. The pluggable module includes a plug connector mounted to the mounting location. The plug connector includes plug contacts extending between a plug mating end and a plug mounting end. The plug mating end is plugged into the outer receptacle connector.
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公开(公告)号：US20220021137A1
公开(公告)日：2022-01-20
申请号：US16933288
申请日：2020-07-20
Applicant: TE Connectivity Services GmbH
Inventor： Jacob Rita , Christopher William Blackburn , Mohini C. Goel
Abstract: In one embodiment, a pluggable module is provided. The pluggable module includes a pluggable body having a top wall, a bottom wall, a first side wall and a second side wall. The pluggable body has a cavity. The pluggable body extends between a mating end and a cable end. An upper module circuit card is received in the cavity. The upper module circuit card has a mating edge at a mating end configured to be loaded into an upper card slot of a card edge connector and a cable end opposite the mating end. The upper module circuit card includes first upper contact pads on an upper surface of the upper module circuit card at the mating end. The upper module circuit card includes second upper contact pads on a lower surface of the upper module circuit card at the mating end. The upper module circuit card includes first upper cable termination areas on the upper surface of the upper module circuit card at the cable end. The upper module circuit card includes second upper cable termination areas on the lower surface of the upper module circuit card at the cable end. The first upper cable termination areas include first upper cable pads electrically connected to corresponding first upper contact pads. The second upper cable termination areas include second upper cable pads electrically connected to corresponding second upper contact pads. A lower module circuit card is received in the cavity. The lower module circuit card has a mating edge at a mating end configured to be loaded into a lower card slot of a card edge connector and a cable end opposite the mating end. The lower module circuit card includes first lower contact pads on an upper surface of the lower module circuit card at the mating end. The lower module circuit card includes second lower contact pads on a lower surface of the lower module circuit card at the mating end. The lower module circuit card includes first lower cable termination areas on the upper surface of the lower module circuit card at the cable end. The lower module circuit card includes second lower cable termination areas on the lower surface of the lower module circuit card at the cable end. The first lower cable termination areas includes first lower cable pads electrically connected to corresponding first lower contact pads. The second lower cable termination areas includes second lower cable pads electrically connected to corresponding second lower contact pads. Upper cables have upper cable conductors terminated to corresponding first and second upper cable pads. Lower cables having lower cable conductors terminated to corresponding first and second lower cable pads. Adjacent first upper cable termination areas are staggered relative to each other. Adjacent second upper cable termination areas are staggered relative to each other. Adjacent first lower cable termination areas are staggered relative to each other. Adjacent second lower cable termination areas are staggered relative to each other.
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公开(公告)号：US10856432B1
公开(公告)日：2020-12-01
申请号：US16698337
申请日：2019-11-27
Applicant: TE CONNECTIVITY SERVICES GMBH
Inventor： Christopher William Blackburn , Matthew Ryan Schmitt , Lucas A. Benson
Abstract: A socket connector assembly includes a socket connector and a cable assembly coupled to the socket connector. The socket connector includes a socket frame having a socket opening and a socket substrate received in the socket opening. The socket substrate includes lower socket conductors electrically connected to a host circuit board and upper socket contacts having deflectable spring beams. The cable assembly includes an outer housing and a paddle card received in a pocket having paddle card contacts at a mating end on a lower surface interfacing with the upper socket contacts. The cable assembly includes cables terminated to the paddle card communicatively coupled to corresponding paddle card contacts. The side walls of the outer housing engage an outer surface of the socket frame to locate the paddle card relative to the socket substrate.
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Patent Agency Ranking
公开(公告)号：US20220354013A1
公开(公告)日：2022-11-03
申请号：US17246085
申请日：2021-04-30
Applicant: TE Connectivity Services GmbH
Inventor： Brian Patrick Costello , Christopher William Blackburn
IPC: H05K7/10 , H01R13/05 , H01R13/11 , H01R13/629
Abstract: An electronic module includes a module substrate has an upper surface and a lower surface. The module substrate has a package pad array having package contact pads at the upper surface. The module substrate has a socket pad array having socket contact pads at the upper surface. The module substrate has guide pin locating pads associated with the socket pad array. The electronic module has an electronic package coupled to the package contact pads at the package pad array. The electronic module has guide pins surface mounted to the guide pin locating pads. The electronic module has a socket assembly coupled to the module substrate. The socket assembly has a socket housing holding socket contacts. The socket contacts are coupled to the socket contact pads at the socket pad array. The socket frame including pockets receiving the guide pins to locate the socket assembly relative to the module substrate.
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公开(公告)号：US11349236B2
公开(公告)日：2022-05-31
申请号：US17021475
申请日：2020-09-15
Applicant: TE Connectivity Services GmbH
IPC: H01R12/72 , H01R13/6594 , H01R12/71 , H01R13/659 , H01R13/66
Abstract: A communication system includes a receptacle connector assembly including a receptacle cage and a communication connector having an inner receptacle connector and an outer receptacle connector. The communication system includes a pluggable module received in the receptacle cage to mate with the communication connector. The pluggable module includes a pluggable body defining a module cavity. The pluggable module includes a module circuit board having mating pads at a mating edge of the module circuit board plugged into the inner receptacle connector and connector pads at a mounting location remote from the mating edge. The pluggable module includes a plug connector mounted to the mounting location. The plug connector includes plug contacts extending between a plug mating end and a plug mounting end. The plug mating end is plugged into the outer receptacle connector.
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公开(公告)号：US20210265754A1
公开(公告)日：2021-08-26
申请号：US17177669
申请日：2021-02-17
Applicant: TE Connectivity Services GmbH
Inventor： Christopher William Blackburn , John Eugene Westman , Michael Eugene Shirk , Michael David Herring , Zachary Galbraith
IPC: H01R12/72 , H01R12/57 , H01R13/627 , H01R13/631
Abstract: A card edge connector includes a housing having upper and lower card slots receiving upper and lower module circuit cards of a pluggable module. The card edge connector includes a contact assembly having a contact positioner holding upper and lower contacts. A guide feature guides mating of the contact assembly in the housing. A latching feature latchably secures the contact assembly to the housing. The upper contacts are arranged in first and second upper contact arrays. The lower contacts are arranged in first and second lower contact arrays. Contact tails of the upper and lower contacts are positioned at the bottom of the housing for surface mounting to the host circuit board.
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公开(公告)号：US20230261399A1
公开(公告)日：2023-08-17
申请号：US17676274
申请日：2022-02-21
Inventor： Christopher William Blackburn , Brian Patrick Costello , Wei Zhao , Guoxiao Shen
CPC classification number: H01R12/716 , H01R12/57 , H01R12/53 , H01R12/7047
Abstract: An electronic assembly includes an interposer assembly and a cable connector module coupled to the interposer assembly. The interposer assembly includes an array of compressible interposer contacts each having upper and lower mating interfaces defining separable mating interfaces. The cable connector module includes a cable connector having a module substrate including module contacts at a bottom of the module substrate coupled to the upper mating interfaces of the corresponding interposer contacts. The cable connector module includes a backshell including a backshell cavity that receives the cable connector. The backshell includes a compression member engaging the cable connector and pressing the cable connector in the direction of the interposer assembly to compress the interposer contacts.
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公开(公告)号：US11503732B1
公开(公告)日：2022-11-15
申请号：US17246085
申请日：2021-04-30
Applicant: TE Connectivity Services GmbH
Inventor： Brian Patrick Costello , Christopher William Blackburn
IPC: H05K7/10 , H01R13/05 , H01R13/11 , H01R13/629
Abstract: An electronic module includes a module substrate has an upper surface and a lower surface. The module substrate has a package pad array having package contact pads at the upper surface. The module substrate has a socket pad array having socket contact pads at the upper surface. The module substrate has guide pin locating pads associated with the socket pad array. The electronic module has an electronic package coupled to the package contact pads at the package pad array. The electronic module has guide pins surface mounted to the guide pin locating pads. The electronic module has a socket assembly coupled to the module substrate. The socket assembly has a socket housing holding socket contacts. The socket contacts are coupled to the socket contact pads at the socket pad array. The socket frame including pockets receiving the guide pins to locate the socket assembly relative to the module substrate.
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