公开(公告)号：US20220294145A1

公开(公告)日：2022-09-15

申请号：US17195738

申请日：2021-03-09

Applicant: TE Connectivity Services GmbH ,  TYCO ELECTRONICS JAPAN G.K.

Inventor： John Joseph Consoli ,  Chad William Morgan ,  Megan Hoarfrost Beers ,  Christopher William Blackburn ,  Nathan Lincoln Tracy ,  Jennifer Love ,  Clarence Leon Yu ,  Shinichi Hashimoto ,  Hiroshi Shirai

IPC: H01R13/24 ,  H01R12/71 ,  H01R12/52 ,  H05K1/09 ,  H01R13/6599 ,  H01R13/11

Abstract: A socket assembly includes an electrical interconnect having an insulator having apertures. The electrical interconnect includes primary contacts and secondary contacts received in corresponding apertures. The primary contacts include a primary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting first and second electronic packages. The secondary contacts include a secondary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting the first and second electronic packages. The contact tips of the secondary conductive polymer columns have a different shape from the shape of the contact tips of the primary conductive polymer columns.

公开(公告)号：US11894629B2

公开(公告)日：2024-02-06

申请号：US17195738

申请日：2021-03-09

Applicant: TE Connectivity Services GmbH ,  TYCO ELECTRONICS JAPAN G.K.

Inventor： John Joseph Consoli ,  Chad William Morgan ,  Megan Hoarfrost Beers ,  Christopher William Blackburn ,  Nathan Lincoln Tracy ,  Jennifer Love ,  Clarence Leon Yu ,  Shinichi Hashimoto ,  Hiroshi Shirai

IPC: H01R13/24 ,  H01R12/71 ,  H01R12/52 ,  H01R13/6599 ,  H01R13/11 ,  H05K1/09

CPC classification number: H01R13/2407 ,  H01R12/52 ,  H01R12/714 ,  H01R13/11 ,  H01R13/2414 ,  H01R13/6599 ,  H05K1/095 ,  H01R12/712 ,  H05K2201/03 ,  H05K2201/0314 ,  H05K2201/0329

Abstract: A socket assembly includes an electrical interconnect having an insulator having apertures. The electrical interconnect includes primary contacts and secondary contacts received in corresponding apertures. The primary contacts include a primary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting first and second electronic packages. The secondary contacts include a secondary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting the first and second electronic packages. The contact tips of the secondary conductive polymer columns have a different shape from the shape of the contact tips of the primary conductive polymer columns.