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公开(公告)号：US10939560B1
公开(公告)日：2021-03-02
申请号：US16935556
申请日：2020-07-22
Applicant: TE Connectivity Services GmbH , TYCO ELECTRONICS JAPAN G.K.
Inventor： Craig Warren Hornung , Chad William Morgan , Hiroshi Shirai , John Joseph Consoli
Abstract: An electrical connector assembly includes a contact organizer having a substrate having a lower surface facing the host circuit board and an upper surface facing a component circuit board. The electrical connector includes data transmission contacts each including a main body, a upper mating element extending from the main body top mated to the component circuit board, and a lower mating element extending from the main body bottom soldered to the host circuit board. The main body includes a main body length between the top and the bottom and an adjustable height section to adjust a height of the main body between the top and the bottom. The adjustable height sections of the data transmission contacts are varied to adjust vertical positions of at least one of the upper mating element or the lower mating element such that the contacts have variable heights.
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2.发明授权公开(公告)号：US11894629B2
公开(公告)日：2024-02-06
申请号：US17195738
申请日：2021-03-09
Applicant: TE Connectivity Services GmbH , TYCO ELECTRONICS JAPAN G.K.
Inventor： John Joseph Consoli , Chad William Morgan , Megan Hoarfrost Beers , Christopher William Blackburn , Nathan Lincoln Tracy , Jennifer Love , Clarence Leon Yu , Shinichi Hashimoto , Hiroshi Shirai
CPC classification number: H01R13/2407 , H01R12/52 , H01R12/714 , H01R13/11 , H01R13/2414 , H01R13/6599 , H05K1/095 , H01R12/712 , H05K2201/03 , H05K2201/0314 , H05K2201/0329
Abstract: A socket assembly includes an electrical interconnect having an insulator having apertures. The electrical interconnect includes primary contacts and secondary contacts received in corresponding apertures. The primary contacts include a primary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting first and second electronic packages. The secondary contacts include a secondary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting the first and second electronic packages. The contact tips of the secondary conductive polymer columns have a different shape from the shape of the contact tips of the primary conductive polymer columns.
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公开(公告)号：US20220294145A1
公开(公告)日：2022-09-15
申请号：US17195738
申请日：2021-03-09
Applicant: TE Connectivity Services GmbH , TYCO ELECTRONICS JAPAN G.K.
Inventor： John Joseph Consoli , Chad William Morgan , Megan Hoarfrost Beers , Christopher William Blackburn , Nathan Lincoln Tracy , Jennifer Love , Clarence Leon Yu , Shinichi Hashimoto , Hiroshi Shirai
Abstract: A socket assembly includes an electrical interconnect having an insulator having apertures. The electrical interconnect includes primary contacts and secondary contacts received in corresponding apertures. The primary contacts include a primary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting first and second electronic packages. The secondary contacts include a secondary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting the first and second electronic packages. The contact tips of the secondary conductive polymer columns have a different shape from the shape of the contact tips of the primary conductive polymer columns.
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公开(公告)号：US20230411906A1
公开(公告)日：2023-12-21
申请号：US17841597
申请日：2022-06-15
Inventor： Chad William Morgan , Hirotate Kadobayashi , Hiroshi Shirai
IPC: H01R13/6471 , H01R13/24 , H01R13/11
CPC classification number: H01R13/6471 , H01R13/24 , H01R13/11
Abstract: A socket connector includes a substrate having signal and ground contact channels between upper and lower surfaces and ground bar slots. The socket connector includes signal socket contacts received in signal contact channels and ground socket contacts received in ground contact channels. The socket connector includes ground bars received in corresponding ground bar slots. The ground bars electrically connect the corresponding ground socket contacts.
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公开(公告)号：US20180219330A1
公开(公告)日：2018-08-02
申请号：US15417351
申请日：2017-01-27
Applicant: TE CONNECTIVITY CORPORATION , TYCO ELECTRONICS JAPAN G.K.
Inventor： Chad William Morgan , John Joseph Consoli , Yoshihiko Kodaira , Hiroshi Shirai , Masayuki Aizawa
IPC: H01R13/6586 , H01R13/6598
CPC classification number: H01R13/6587 , H01R12/724 , H01R13/514 , H01R13/6586
Abstract: A contact module includes a dielectric holder having right and left sides holding signal contacts. A shield structure is coupled to the dielectric holder providing electrical shielding for the signal contacts. The shield structure has a first ground shield provided at the right side of the dielectric holder and a second ground shield provided at the left side of the dielectric holder. The first and second ground shields are electrically connected together between corresponding pairs of the signal contacts and providing electrical shielding between corresponding signal contacts along a majority of a length of the transition portions.
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Patent Agency Ranking
6.发明申请公开(公告)号：US20170062989A1
公开(公告)日：2017-03-02
申请号：US14834592
申请日：2015-08-25
Applicant: Tyco Electronics Corporation , TYCO ELECTRONICS JAPAN G.K.
Inventor： Masayuki Aizawa , Chad William Morgan
IPC: H01R13/6473 , H01R24/60
CPC classification number: H01R13/6473
Abstract: Electrical connector includes a connector body and a plurality of electrical contacts coupled to the connector body. Each of the electrical contacts has an elongated body that includes a base material and an impedance-control material plated over the base material. The impedance-control material extends along only a designated portion of the elongated body. The impedance-control material has a relative magnetic permeability that is greater than a relative magnetic permeability of the base material. The impedance-control material increasing an impedance of the electrical contact along the designated portion.
Abstract translation: 电连接器包括连接器主体和耦合到连接器主体的多个电触头。 每个电触头具有细长主体，该主体包括基材和在该基材上电镀的阻抗控制材料。 阻抗控制材料仅沿着细长体的指定部分延伸。 阻抗控制材料的相对导磁率大于基材的相对导磁率。 阻抗控制材料沿着指定部分增加电接触的阻抗。
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公开(公告)号：US10186810B2
公开(公告)日：2019-01-22
申请号：US15417351
申请日：2017-01-27
Applicant: TE CONNECTIVITY CORPORATION , TYCO ELECTRONICS JAPAN G.K.
Inventor： Chad William Morgan , John Joseph Consoli , Yoshihiko Kodaira , Hiroshi Shirai , Masayuki Aizawa
IPC: H01R13/6586 , H01R13/6587 , H01R12/72 , H01R13/514
Abstract: A contact module includes a dielectric holder having right and left sides holding signal contacts. A shield structure is coupled to the dielectric holder providing electrical shielding for the signal contacts. The shield structure has a first ground shield provided at the right side of the dielectric holder and a second ground shield provided at the left side of the dielectric holder. The first and second ground shields are electrically connected together between corresponding pairs of the signal contacts and providing electrical shielding between corresponding signal contacts along a majority of a length of the transition portions.
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公开(公告)号：US09930772B2
公开(公告)日：2018-03-27
申请号：US14983829
申请日：2015-12-30
Applicant: TYCO ELECTRONICS CORPORATION , TYCO ELECTRONICS JAPAN G.K.
Inventor： Chad William Morgan , Masayuki Aizawa , Arash Behziz , Brian Patrick Costello , Nathan Lincoln Tracy , Michael David Herring
IPC: H05K1/02
CPC classification number: H05K1/0245 , H05K1/0222 , H05K1/024 , H05K1/0248 , H05K1/115 , H05K2201/044 , H05K2201/09063 , H05K2201/09227 , H05K2201/09672 , H05K2201/10189
Abstract: Printed circuit includes a planar substrate having opposite sides and a thickness extending therebetween. The sides extend parallel to a lateral plane. The printed circuit also includes a plurality of conductive vias extending through the planar substrate in a direction that is perpendicular to the lateral plane. The conductive vias include ground vias and signal vias. The signal vias form a plurality of quad groups in which each quad group includes a two-by-two array of the signal vias. Optionally, the printed circuit also includes signal traces that electrically couple to the signal vias. The signal traces may form a plurality of quad lines in which each quad line includes four of the signal traces. The four signal traces of each quad line may extend parallel to one another and be in a two-by-two formation.
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公开(公告)号：US20240047909A1
公开(公告)日：2024-02-08
申请号：US17879147
申请日：2022-08-02
IPC: H01R12/71 , H01R13/6592 , H01R13/516 , H05K1/11
CPC classification number: H01R12/716 , H01R13/6592 , H01R13/516 , H05K1/117
Abstract: A cable connector module includes a circuit card having signal contact pads on an upper surface and signal mating pads on a lower surface configured to be mated with interposer contacts of a socket connector. Signal vias extend directly through the circuit card electrically connecting the signal contact pads and the corresponding signal mating pads in the shortest path possible. The cable connector module includes cable assemblies terminated to the upper surface having a cable and a ground structure coupled to an end of the cable.
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公开(公告)号：US10741950B1
公开(公告)日：2020-08-11
申请号：US16353007
申请日：2019-03-14
Applicant: TE CONNECTIVITY CORPORATION , TYCO ELECTRONICS JAPAN G.K.
Inventor： John Joseph Consoli , Chad William Morgan , Hiroshi Shirai
Abstract: A communication system includes first and second circuit card assemblies mated such that first and second PCBs move relative to each other along a board mating axis parallel to a slot in the first PCB with the first PCB oriented perpendicular to the second PCB and with first and second mating ends of first and second electrical connectors oriented parallel to the board mating axis. The first and second circuit card assemblies are mated such that the first electrical connector and the second electrical connector move relative to each other along a connector mating axis perpendicular to the board mating axis. Mating interfaces the contacts are oriented at contact mating angles non-parallel to the board loading axis and non-parallel to the connector mating axis.
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