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公开(公告)号：US10939560B1
公开(公告)日：2021-03-02
申请号：US16935556
申请日：2020-07-22
Applicant: TE Connectivity Services GmbH , TYCO ELECTRONICS JAPAN G.K.
Inventor： Craig Warren Hornung , Chad William Morgan , Hiroshi Shirai , John Joseph Consoli
Abstract: An electrical connector assembly includes a contact organizer having a substrate having a lower surface facing the host circuit board and an upper surface facing a component circuit board. The electrical connector includes data transmission contacts each including a main body, a upper mating element extending from the main body top mated to the component circuit board, and a lower mating element extending from the main body bottom soldered to the host circuit board. The main body includes a main body length between the top and the bottom and an adjustable height section to adjust a height of the main body between the top and the bottom. The adjustable height sections of the data transmission contacts are varied to adjust vertical positions of at least one of the upper mating element or the lower mating element such that the contacts have variable heights.
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2.发明授权公开(公告)号：US11894629B2
公开(公告)日：2024-02-06
申请号：US17195738
申请日：2021-03-09
Applicant: TE Connectivity Services GmbH , TYCO ELECTRONICS JAPAN G.K.
Inventor： John Joseph Consoli , Chad William Morgan , Megan Hoarfrost Beers , Christopher William Blackburn , Nathan Lincoln Tracy , Jennifer Love , Clarence Leon Yu , Shinichi Hashimoto , Hiroshi Shirai
CPC classification number: H01R13/2407 , H01R12/52 , H01R12/714 , H01R13/11 , H01R13/2414 , H01R13/6599 , H05K1/095 , H01R12/712 , H05K2201/03 , H05K2201/0314 , H05K2201/0329
Abstract: A socket assembly includes an electrical interconnect having an insulator having apertures. The electrical interconnect includes primary contacts and secondary contacts received in corresponding apertures. The primary contacts include a primary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting first and second electronic packages. The secondary contacts include a secondary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting the first and second electronic packages. The contact tips of the secondary conductive polymer columns have a different shape from the shape of the contact tips of the primary conductive polymer columns.
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公开(公告)号：US20220294145A1
公开(公告)日：2022-09-15
申请号：US17195738
申请日：2021-03-09
Applicant: TE Connectivity Services GmbH , TYCO ELECTRONICS JAPAN G.K.
Inventor： John Joseph Consoli , Chad William Morgan , Megan Hoarfrost Beers , Christopher William Blackburn , Nathan Lincoln Tracy , Jennifer Love , Clarence Leon Yu , Shinichi Hashimoto , Hiroshi Shirai
Abstract: A socket assembly includes an electrical interconnect having an insulator having apertures. The electrical interconnect includes primary contacts and secondary contacts received in corresponding apertures. The primary contacts include a primary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting first and second electronic packages. The secondary contacts include a secondary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting the first and second electronic packages. The contact tips of the secondary conductive polymer columns have a different shape from the shape of the contact tips of the primary conductive polymer columns.
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公开(公告)号：US20220037823A1
公开(公告)日：2022-02-03
申请号：US17502564
申请日：2021-10-15
Applicant: Tyco Electronics Japan G.K.
Inventor： Shinichi Hashimoto , Hiroshi Shirai , Masayuki Aizawa
Abstract: An interposer includes a housing having a plurality of through-holes penetrating a first surface and a second surface and a signal contact pair composed of a pair of signal contacts. Each of the signal contacts includes a base portion press-fitted in one of the through-holes, a first contact beam extending from the base portion beyond the first surface, and a second contact beam extending from the base portion beyond the second surface. The pair of signal contacts are positioned adjacently to each other widthwise and are each asymmetrical with respect to a width direction. The signal contact pair has a plane-symmetrical shape with respect to the width direction.
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公开(公告)号：US10186810B2
公开(公告)日：2019-01-22
申请号：US15417351
申请日：2017-01-27
Applicant: TE CONNECTIVITY CORPORATION , TYCO ELECTRONICS JAPAN G.K.
Inventor： Chad William Morgan , John Joseph Consoli , Yoshihiko Kodaira , Hiroshi Shirai , Masayuki Aizawa
IPC: H01R13/6586 , H01R13/6587 , H01R12/72 , H01R13/514
Abstract: A contact module includes a dielectric holder having right and left sides holding signal contacts. A shield structure is coupled to the dielectric holder providing electrical shielding for the signal contacts. The shield structure has a first ground shield provided at the right side of the dielectric holder and a second ground shield provided at the left side of the dielectric holder. The first and second ground shields are electrically connected together between corresponding pairs of the signal contacts and providing electrical shielding between corresponding signal contacts along a majority of a length of the transition portions.
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Patent Agency Ranking
公开(公告)号：US20150062828A1
公开(公告)日：2015-03-05
申请号：US14087708
申请日：2013-11-22
Applicant: Tyco Electronics Japan G.K.
Inventor： Hiroshi Shirai
CPC classification number: H01R13/6205 , H05K1/0243 , H05K1/181 , H05K2201/10098
Abstract: A connector is provided that is capable of high-speed transmission over a carrier wave of, for example, 30 GHz or higher. The connector includes a housing, a wireless communication module and a first magnet. The housing includes a planar face, and the wireless communication module is disposed in the housing and includes a wireless signal transmission IC and a wireless signal reception IC. The first magnet is disposed along the planar face.
Abstract translation: 提供了能够通过例如30GHz或更高的载波进行高速传输的连接器。 连接器包括壳体，无线通信模块和第一磁体。 壳体包括平面，无线通信模块设置在壳体中，并且包括无线信号传输IC和无线信号接收IC。 第一磁体沿平面设置。
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公开(公告)号：US20230411906A1
公开(公告)日：2023-12-21
申请号：US17841597
申请日：2022-06-15
Inventor： Chad William Morgan , Hirotate Kadobayashi , Hiroshi Shirai
IPC: H01R13/6471 , H01R13/24 , H01R13/11
CPC classification number: H01R13/6471 , H01R13/24 , H01R13/11
Abstract: A socket connector includes a substrate having signal and ground contact channels between upper and lower surfaces and ground bar slots. The socket connector includes signal socket contacts received in signal contact channels and ground socket contacts received in ground contact channels. The socket connector includes ground bars received in corresponding ground bar slots. The ground bars electrically connect the corresponding ground socket contacts.
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公开(公告)号：US20200381841A1
公开(公告)日：2020-12-03
申请号：US16889633
申请日：2020-06-01
Applicant: Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Corporation , Tyco Electronics Japan G.K.
Inventor： Jiahui Chen , Michael Tryson , Hiroshi Shirai , Zhiqiang Li , Biaobing Lv
Abstract: A connector for connecting an antenna array includes an insulation body, a plurality of feed terminals on the insulation body electrically contacting a plurality of feed lines of the antenna array, and a plurality of ground terminals on the insulation body electrically contacting a ground layer of the antenna array.
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公开(公告)号：US10454193B2
公开(公告)日：2019-10-22
申请号：US15433540
申请日：2017-02-15
Applicant: Tyco Electronics Japan G.K.
Inventor： Masaaki Iwasaki , Yoshihiko Kodaira , Hiroshi Shirai
Abstract: A contact is disclosed. The contact has a press-fit portion and a deformable portion. The press-fit portion is press-fit into a passageway of a circuit board. The deformable portion is disposed adjacent the press-fit portion in a direction opposite a press-fitting direction and has a shape adjacent the press-fit portion larger than the passageway. The deformable portion is plastically deformable.
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公开(公告)号：US20180219330A1
公开(公告)日：2018-08-02
申请号：US15417351
申请日：2017-01-27
Applicant: TE CONNECTIVITY CORPORATION , TYCO ELECTRONICS JAPAN G.K.
Inventor： Chad William Morgan , John Joseph Consoli , Yoshihiko Kodaira , Hiroshi Shirai , Masayuki Aizawa
IPC: H01R13/6586 , H01R13/6598
CPC classification number: H01R13/6587 , H01R12/724 , H01R13/514 , H01R13/6586
Abstract: A contact module includes a dielectric holder having right and left sides holding signal contacts. A shield structure is coupled to the dielectric holder providing electrical shielding for the signal contacts. The shield structure has a first ground shield provided at the right side of the dielectric holder and a second ground shield provided at the left side of the dielectric holder. The first and second ground shields are electrically connected together between corresponding pairs of the signal contacts and providing electrical shielding between corresponding signal contacts along a majority of a length of the transition portions.
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