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1.发明授权公开(公告)号：US11478874B2
公开(公告)日：2022-10-25
申请号：US16821485
申请日：2020-03-17
申请人： TDK Corporation
发明人： Akifumi Kamijima
IPC分类号： B23K26/06 , B23K26/382 , B23K26/362 , B23K103/00
摘要： In a method of processing a substrate, in a second step, only some of a plurality of altered portions are exposed from an opening portion of a mask, and the remaining portions are not exposed. In this case, at the time of etching in a third step, an etching rate may be made different between the altered portions exposed from the opening portion of the mask and the altered portions which are not exposed. Accordingly, it becomes easier to obtain a desired processed shape by adjusting the altered portions exposed from the opening portion of the mask and the altered portions which are not exposed.
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公开(公告)号：US11075041B2
公开(公告)日：2021-07-27
申请号：US16377418
申请日：2019-04-08
申请人： TDK CORPORATION
IPC分类号： H01H51/22 , H01H47/00 , H01H50/00 , H01H50/44 , H01H50/64 , H01H50/36 , H01H50/54 , H01H50/18
摘要： A magnetically actuated MEMS switch 100 includes a first magnetic core portion 120, a first signal line 15, a first contact point 16, a second magnetic core portion 220, a second signal line 25, a second contact point 26, and a first coil portion 111 and a second coil portion 211 serving as a magnetic field applying portion that causes a current to flow in conductor coil to apply a magnetic field to the first magnetic core portion 120 and the second magnetic core portion 220. The first contact point 16 is displaced depending on the presence or absence of a magnetic field applied by the magnetic field applying portion. Connection and disconnection between the first contact point 16 and the second contact point 26 are switched in response to displacement of the first contact point 16.
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公开(公告)号：US10687149B2
公开(公告)日：2020-06-16
申请号：US16509628
申请日：2019-07-12
申请人： TDK CORPORATION
发明人： Akifumi Kamijima , Tohru Inoue
摘要： A MEMS microphone includes a substrate, and a first conversion portion and a second conversion portion provided on the substrate, the first conversion portion and the second conversion portion convert sound into an electrical signal, the first conversion portion includes a first through hole, a first membrane covering the first through hole, and a first back plate facing the first membrane via a first air gap, the second conversion portion includes a second through hole, a second membrane covering the second through hole, and a second back plate facing the second membrane via a second air gap, and an area of the second membrane is 1.21 times or more and 2.25 times or less an area of the first membrane when viewed in a thickness direction of the substrate.
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公开(公告)号：US10917728B2
公开(公告)日：2021-02-09
申请号：US16509761
申请日：2019-07-12
申请人： TDK CORPORATION
发明人： Akifumi Kamijima , Tohru Inoue
IPC分类号： H04R19/04
摘要： A MEMS microphone includes a substrate, and a first conversion portion and a second conversion portion provided on the substrate, the first conversion portion and the second conversion portion convert sound into an electrical signal, the first conversion portion includes a first through hole, a first membrane covering the first through hole, and a first back plate facing the first membrane via a first air gap, the second conversion portion includes a second through hole, a second membrane covering the second through hole, and a second back plate facing the second membrane via a second air gap, and a dimension of the second air gap is greater than a dimension of the first air gap in a thickness direction of the substrate.
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公开(公告)号：US10153092B2
公开(公告)日：2018-12-11
申请号：US15725860
申请日：2017-10-05
申请人： TDK CORPORATION
发明人： Michihiro Kumagae , Akifumi Kamijima , Norihiko Matsuzaka , Junki Nakamoto , Kazuhiro Yoshikawa , Kenichi Yoshida
摘要： A thin-film capacitor including a stacked body having a lower electrode layer, a plurality of dielectric layers stacked on the lower electrode layer, one or more internal electrode layers interposed between the dielectric layers, and an upper electrode layer that is stacked on the opposite side of the lower electrode layer with the dielectric layers and the internal electrode layers interposed between, and a cover layer that covers the stacked body. The stacked body includes opening portions that have the lower electrode layer, opens upward in a stacking direction, and has a side surface formed to include an inclined surface. The cover layer is stacked on the inclined surface of the stacked body. A curved surface with a predetermined shape is formed on the inclined surface for each pair of layers including the dielectric layer forming the inclined surface and the electrode layer, forming the inclined surface.
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公开(公告)号：US11551896B2
公开(公告)日：2023-01-10
申请号：US17354432
申请日：2021-06-22
申请人： TDK CORPORATION
摘要： A magnetically actuated MEMS switch 100 includes a first magnetic core portion 120, a first signal line 15, a first contact point 16, a second magnetic core portion 220, a second signal line 25, a second contact point 26, and a first coil portion 111 and a second coil portion 211 serving as a magnetic field applying portion that causes a current to flow in conductor coil to apply a magnetic field to the first magnetic core portion 120 and the second magnetic core portion 220. The first contact point 16 is displaced depending on the presence or absence of a magnetic field applied by the magnetic field applying portion. Connection and disconnection between the first contact point 16 and the second contact point 26 are switched in response to displacement of the first contact point 16.
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公开(公告)号：US11350221B2
公开(公告)日：2022-05-31
申请号：US17143401
申请日：2021-01-07
申请人： TDK CORPORATION
发明人： Akifumi Kamijima , Tohru Inoue
IPC分类号： H04R19/04
摘要： A MEMS microphone includes a substrate, and a first conversion portion and a second conversion portion provided on the substrate, the first conversion portion and the second conversion portion convert sound into an electrical signal, the first conversion portion includes a first through hole, a first membrane covering the first through hole, and a first back plate facing the first membrane via a first air gap, the second conversion portion includes a second through hole, a second membrane covering the second through hole, and a second back plate facing the second membrane via a second air gap, and a dimension of the second air gap is greater than a dimension of the first air gap in a thickness direction of the substrate.
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公开(公告)号：US10679785B2
公开(公告)日：2020-06-09
申请号：US15495637
申请日：2017-04-24
申请人： TDK CORPORATION
发明人： Akifumi Kamijima
摘要： Provided is a coil component including a coil portion that has at least one layer of ring-shaped planar coil portion including a coil-wound portion and an insulative resin layer which covers the periphery of the coil-wound portion within the same layer as the coil-wound portion, and an insulative resin layer overlapping the planar coil portion; and a covering portion that covers the coil portion. The insulative resin layer has a superimposing region overlapping a forming region of the planar coil portion and a protrusion region protruding from at least any one of an inner peripheral edge and an outer peripheral edge of the superimposing region, when viewed in the direction of overlapping the planar coil portion.
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公开(公告)号：US10460877B2
公开(公告)日：2019-10-29
申请号：US15603743
申请日：2017-05-24
申请人： TDK CORPORATION
摘要： In a thin-film capacitor, a first extraction electrode provided along a side surface of a first groove portion is in contact with a first electrode layer and is not in contact with a second electrode layer. Also, a second extraction electrode provided along a side surface of a second groove portion is in contact with the second electrode layer exposed on the side surface of the second groove portion and is not in contact with the first electrode layer. Thus, a capacitor structure in which the first electrode layer in contact with the first extraction electrode and the second electrode layer in contact with the second extraction electrode are laminated with a dielectric layer therebetween is formed between the first groove portion and the second groove portion.
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