公开(公告)号：US20170137655A1

公开(公告)日：2017-05-18

申请号：US15318913

申请日：2015-06-22

申请人： TANAKA KIKINZOKU KOGYO K.K.

发明人： Kanako FURUTACHI ,  Rikia FURUSHO ,  Yoshito IMAI ,  Kenichiro TAKAOKA

IPC分类号： C09D11/52 ,  C09D11/03 ,  C09D11/107 ,  H05K3/22 ,  B41F15/06 ,  H05K1/09 ,  H05K3/12 ,  C09D11/101 ,  C09D11/105

CPC分类号： C09D11/52 ,  B41F15/06 ,  C09D11/03 ,  C09D11/037 ,  C09D11/101 ,  C09D11/105 ,  C09D11/107 ,  H01B1/22 ,  H01B5/14 ,  H01B13/00 ,  H05K1/095 ,  H05K3/12 ,  H05K3/1216 ,  H05K3/22 ,  H05K2203/0514

摘要： [Problem] Provided is a photocurable electroconductive ink composition for screen printing which can provide printability, printing precision and adhesiveness on a substrate good enough for screen printing, and can show stable electroconductive properties.[Solution] A photocurable electroconductive ink composition for screen printing, comprising: (A) an electroconductive filler, (B) a photopolymerizable resin precursor consisting of an oligomer of urethane acrylate, monofunctional acrylate and polyfunctional acrylate, (C) an alkyd resin, (D) two or more photopolymerization initiators and (E) a polymer dispersant, in which the content of the electroconductive filler (A) is 70 to 90 mass % relative to the total mass of the photocurable electroconductive ink composition, and more than 50 mass % of the electroconductive filler is silver powder in a scale-like, foil-like or flake-like form having a particle diameter at 50 % particle size distribution of 0.3 to 3.0 μm, and the total content of the photopolymerizable resin precursor (B) is 10 to 24 mass % relative to the total mass of the photocurable electroconductive ink composition, and the content of the oligomer of urethane acrylate is 5 mass % or less relative to the total mass of the photocurable electroconductive ink composition, and the content of the alkyd resin (C) is 1 to 10 mass % relative to the total mass of the photocurable electroconductive ink composition.

公开(公告)号：US20200157388A1

公开(公告)日：2020-05-21

申请号：US16619356

申请日：2018-06-06

申请人： TANAKA KIKINZOKU KOGYO K.K.

发明人： Shintaro ABE ,  Kanako FURUTACHI ,  Takeshi KONDO ,  Rikia FURUSHO

IPC分类号： C09J9/02 ,  C09J163/00 ,  C09K5/14 ,  H01B1/22

摘要： The purpose of the present invention is to provide a thermally-conductive and electrically-conductive adhesive composition which is for use as a die bonding material and which has high heat-conducting properties and high-temperature adhesiveness. The present invention relates to a thermally-conductive and electrically-conductive adhesive composition including (A) an electrically conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent.