公开(公告)号：US20170210951A1

公开(公告)日：2017-07-27

申请号：US15313206

申请日：2015-05-28

申请人： TANAKA KIKINZOKU KOGYO K.K.

发明人： Shintaro ABE ,  Rikia FURUSHO

IPC分类号： C09J9/02 ,  C09J163/04 ,  H01L23/00 ,  C09J11/08 ,  C09K5/14 ,  C09J163/00 ,  C09J11/04

CPC分类号： C09J9/02 ,  C08G59/5033 ,  C08G59/504 ,  C08G59/621 ,  C08K2003/0806 ,  C09J11/04 ,  C09J11/06 ,  C09J11/08 ,  C09J121/00 ,  C09J163/00 ,  C09J163/04 ,  C09K5/14 ,  H01B1/02 ,  H01B1/22 ,  H01L23/3737 ,  H01L24/29 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/2075 ,  H01L2924/20751 ,  C08L63/00 ,  C08K2201/001

摘要： The present invention relates to a thermally and electrically conductive adhesive composition, which includes (A) an electrically conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent, wherein the component (A) is a silver powder having an average particle diameter of 1 to 10 μm, the component (B) has two or more epoxy functional groups and aromatic rings in each molecule, the component (C) is a compound having two or more glycidyl ether functional groups in an aliphatic hydrocarbon chain and also having a molecular weight of 150 to 600, and the component (D) is a compound having two or more phenol functional groups in each molecule, a compound having two or more aniline functional groups in each molecule, or a mixture of these compounds, and the content of each of the component (A), (B), (C), and (D) is within a specific range.

公开(公告)号：US20200157388A1

公开(公告)日：2020-05-21

申请号：US16619356

申请日：2018-06-06

申请人： TANAKA KIKINZOKU KOGYO K.K.

发明人： Shintaro ABE ,  Kanako FURUTACHI ,  Takeshi KONDO ,  Rikia FURUSHO

IPC分类号： C09J9/02 ,  C09J163/00 ,  C09K5/14 ,  H01B1/22

摘要： The purpose of the present invention is to provide a thermally-conductive and electrically-conductive adhesive composition which is for use as a die bonding material and which has high heat-conducting properties and high-temperature adhesiveness. The present invention relates to a thermally-conductive and electrically-conductive adhesive composition including (A) an electrically conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent.

公开(公告)号：US20190136099A1

公开(公告)日：2019-05-09

申请号：US16097874

申请日：2018-03-28

申请人： TANAKA KIKINZOKU KOGYO K.K.

发明人： Koyo KOBORI ,  Yoshito IMAI ,  Shintaro ABE ,  Takeshi KONDO

IPC分类号： C09J9/02 ,  C09J167/02

摘要： The present invention is to provide an electroconductive adhesive composition which contains a thermoplastic resin and has high heat dissipation properties and which is inhibited from suffering the bleeding-out phenomenon in which a nonpolar solvent undesirably bleeds out after die bonding. The present invention relates to an electroconductive adhesive composition including (A) electroconductive particles, (B) a thermoplastic resin, (C) a nonpolar solvent, and (D) a water-insoluble fluorochemical surfactant.