公开(公告)号：US20190131249A1

公开(公告)日：2019-05-02

申请号：US16231735

申请日：2018-12-24

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

发明人： Cheng-Hsien HSIEH ,  Li-Han HSU ,  Wei-Cheng WU ,  Hsien-Wei CHEN ,  Der-Chyang YEH ,  Chi-Hsi WU

IPC分类号： H01L23/544 ,  H01L23/528 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00 ,  H01L23/31

摘要： A method for forming a package structure and method for forming the same are provided. The method includes forming a package layer over a substrate, and forming a first dielectric layer over the package layer. The method further includes forming a first alignment mark and a second alignment mark over the first dielectric layer. The method includes forming a second dielectric layer over the first dielectric layer and removing a portion of the second dielectric layer to form a first trench to expose the first alignment mark, and to form a first opening to expose the second alignment.

公开(公告)号：US20180005955A1

公开(公告)日：2018-01-04

申请号：US15200747

申请日：2016-07-01

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Cheng-Hsien HSIEH ,  Li-Han HSU ,  Wei-Cheng WU ,  Hsien-Wei CHEN ,  Der-Chyang YEH ,  Chi-Hsi WU

IPC分类号： H01L23/544 ,  H01L23/00 ,  H01L23/31 ,  H01L23/528

CPC分类号： H01L23/544 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/528 ,  H01L24/14 ,  H01L24/82 ,  H01L24/96 ,  H01L24/97 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/0239 ,  H01L2224/0401 ,  H01L2224/18 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01073 ,  H01L2924/01074

摘要： A package structure and method for forming the same are provided. The package structure includes a substrate and a package layer formed over the substrate. The package structure further includes an alignment structure formed over the package layer, and the alignment structure includes a first alignment mark formed in a trench, and the trench has a step-shaped structure.