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公开(公告)号：US5836808A
公开(公告)日：1998-11-17
申请号：US667791
申请日：1996-06-21
申请人： Susumu Sawafuji , Nozomi Takai
发明人： Susumu Sawafuji , Nozomi Takai
摘要： The rotational center of a grinding wheel is eccentric to a slicing side in a slice feed direction with regard to the rotational center of an inner diameter saw. As a result, the diameter of the grinding wheel can be smaller, and the slice movement distance of the ingot can be shorter. Therefore, it is possible to provide a low-priced slicing machine with built-in grinder wherein a slicing time is short and the grinding face is accurate.
摘要翻译： 砂轮的旋转中心相对于内径锯的旋转中心以切片进给方向偏心于切片侧。 结果，砂轮的直径可以更小，并且锭的切片移动距离可以更短。 因此，可以提供具有内置研磨机的低价切片机，其中切片时间短并且研磨面准确。
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公开(公告)号：US07117719B2
公开(公告)日：2006-10-10
申请号：US10497665
申请日：2001-12-05
摘要： In a measuring apparatus 10, an arm 36 is lowered to insert a measuring sphere 30 into a hole 22A in a workpiece 22, and further the measuring sphere 30 is lowered in the depth direction of the hole 22A. Thereby, the back pressure of compressed air is detected at a plurality of locations by an A/E (air/electricity) converter 18. The detected value is compared with the master reference value by a controller 20 to convert the detected value into the inside diameter of the hole 22A. Thereby, the shape of various holes can be measured.
摘要翻译： 在测量装置10中，臂36下降以将测量球30插入到工件22中的孔22A中，并且测量球30在孔22A的深度方向上下降。由此，背压 的压缩空气通过A / E（空气/电力）转换器18在多个位置处被检测。 通过控制器20将检测值与主基准值进行比较，以将检测值转换成孔22A的内径。由此，可以测量各种孔的形状。
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公开(公告)号：US20050005715A1
公开(公告)日：2005-01-13
申请号：US10497665
申请日：2001-12-05
摘要： In a measuring apparatus 10, an arm 36 is lowered to insert a measuring sphere 30 into a hole 22A in a workpiece 22, and further the measuring sphere 30 is lowered in the depth direction of the hole 22A. Thereby, the back pressure of compressed air is detected at a plurality of locations by an A/E converter 18. The detected value is compared with the master reference value by a controller 20 to convert the detected value into the inside diameter of the hole 22A. Thereby, the shape of various holes can be measured.
摘要翻译： 在测量装置10中，臂36下降以将测量球30插入到工件22中的孔22A中，并且测量球30在孔22A的深度方向上下降。 由此，通过A / E转换器18在多个位置检测压缩空气的背压。通过控制器20将检测值与主基准值进行比较，将检测值转换为孔22A的内径 。 由此，可以测量各种孔的形状。
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4.发明申请公开(公告)号：US20090259435A1
公开(公告)日：2009-10-15
申请号：US12085292
申请日：2006-12-01
申请人： Masato Enomoto , Susumu Sawafuji
发明人： Masato Enomoto , Susumu Sawafuji
IPC分类号： G01B11/24
CPC分类号： G01B5/201 , G01B21/045
摘要： To realize a roundness measuring instrument of which the measurement precision when there is eccentricity has been improved. The instrument comprises a mount base 1, a tip head 11 having a spherical tip portion and capable of moving in a first plane including an axis of rotation of the mount base, which comes into contact with the surface of an object to be measured and moves, a measurement probe 12-14 that detects the displacement of the tip head and outputs measurement data, and a processing controller 15 that processes the measurement data, wherein the processing controller calculates a roundness by correcting a shift of the contact position of the surface of the object to be measured and the tip head in the first plane due to eccentricity between the center of the object to be measured and the center of rotation of the mount base, and further, the processing controller calculates a roundness by calculating a shift due to eccentricity of the contact position in a direction perpendicular to the first plane and also correcting a shift of the contact position due to the calculated shift in the first plane.
摘要翻译： 实现圆偏心测量仪器，其具有偏心时的测量精度得到改善。 该仪器包括安装基座1，具有球形尖端部分的尖端头部11，其能够在包括安装基座的旋转轴线的第一平面内移动，该第一平面与被测量物体的表面接触并移动 ，检测前端头的位移并输出测量数据的测量探针12-14以及处理测量数据的处理控制器15，其中处理控制器通过校正表面的接触位置的偏移来计算圆度 要测量的物体和由于被测量物体的中心与安装基座的旋转中心之间的偏心引起的第一平面中的尖端头，此外，处理控制器通过计算由于 接触位置在垂直于第一平面的方向上的偏心度，并且还校正由于计算出的第一平面中的移位引起的接触位置的偏移。
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公开(公告)号：US4852304A
公开(公告)日：1989-08-01
申请号：US150376
申请日：1988-01-29
申请人： Katsuo Honda , Susumu Sawafuji
发明人： Katsuo Honda , Susumu Sawafuji
摘要： In an apparatus and a method for slicing a cylindrical semiconductor ingot into thin wafer pieces using an inner peripheral sliding blade, a grind stone shaft with a grind stone mounted to the tip end thereof is located movably axially within a rotor provided with the inner peripheral sliding blade so that the grind stone shaft and rotor can be rotated integrally but axially movable relative to each other. The grind stone and slicing blade are arranged efficiently so that, after the semiconductor ingot is sliced with the slicing blade, the grind stone approaches the end face of the ingot to grind it. This can save a lapping step, thereby improving working efficiency.
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公开(公告)号：US4894956A
公开(公告)日：1990-01-23
申请号：US344956
申请日：1989-04-28
申请人： Katsuo Honda , Susumu Sawafuji
发明人： Katsuo Honda , Susumu Sawafuji
摘要： In an apparatus and a method for slicing a cylindrical semiconductor ingot into thin wafer pieces using an inner peripheral sliding blade, a grind stone shaft with a grind stone mounted to the tip end thereof is located movably axially within a rotor provided with the inner perpheral sliding blade so that the grind stone shaft and rotor can be rotated integrally but axially movable relative to each other. the grind stone and slicing blade are arranged effieciently so that, after the semiconductor ingot is sliced with the slicing blade, the grind stone approaches the end face of the ingot to grind it. This can save a lapping step, thereby improving working efficiency.
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公开(公告)号：US4838238A
公开(公告)日：1989-06-13
申请号：US212056
申请日：1988-06-27
申请人： Katsuo Honda , Susumu Sawafuji , Tomio Tomita
发明人： Katsuo Honda , Susumu Sawafuji , Tomio Tomita
摘要： An internal peripheral edge type blade holding device for use in an internal peripheral edge type slicing machine used when a silicone ingot is sliced into thin pieces each having a thickness of the order of several hundred microns in a semiconductor manufacturing process. In the blade holding device, a head assembly for stretching and holding an internal peripheral edge blade is supported to a rotary plate through 4 plate springs spaced at 90.degree. intervals. Accordingly, when stretching the internal peripheral edge blade, even if the tension assembly is deformed because of the anisotropic property of the blade, such deformation can be absorbed by the plate springs and thus is not transmitted to the rotary plate, so that the swaying of the edge of the internal peripheral edge blade can be prevented in cutting the ingot.
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