摘要:
An epoxy resin compound having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin compound can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.
摘要:
Disclosed are an epoxy resin compound and a radiant heat circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a curing agent, and an inorganic filler. The curing agent comprises epoxy adducts formed to add the curing agent to a crystalline epoxy resin. The epoxy resin is used on a printed circuit board as an insulating material, so that a substrate having a high heat radiation property is provided.
摘要:
Disclosed is an RF transmitting device of a mobile radio communication base station system in a CDMA system capable of digital-modulating baseband signals which are converted into band spread signals by using the same path which three frequency assignment frequency signals have for an RF in a multi-carrier mobile radio communication system supporting three frequency assignment, digital-coupling the modulated signals, and up-converting the digital-coupled signal into an IF signal and an RF signal in a sequential order, thereby transmitting the up-converted signal.
摘要:
Disclosed are an epoxy resin compound and a radiant heat circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a curing agent, and an inorganic filler. The epoxy resin includes a crystalline epoxy resin and a rubber additive to disperse the inorganic filler into the epoxy resin. The epoxy resin is used on a printed circuit board as an insulating material, so that a substrate having a high heat radiation property is provided.
摘要:
A backward closed loop power control apparatus for a mobile communication system is disclosed. The apparatus includes a demodulation and PCB extraction unit for receiving a communication frame transmitted from a base station, demodulating the received communication frame and extracting a PCB having an allocated transmission power up or down instruction information, a CRC checking unit for checking a CRC with respect to the communication frame transmitted from the base station, a control unit for outputting a transmission power up or down control signal in accordance with a PCB extracted by the demodulation and PCB extraction unit and a CRC result value checked by the CRC checking unit, and a power adjusting unit for increasing the transmission power of the mobile station to the maximum value of the transmission power and decreasing the transmission power of the mobile station to the minimum value of the transmission power in accordance with a transmission power up or down control signal outputted from the controller, for thereby implementing an economic use of a power of a mobile station by judging a propagation environment of a forward link and backward link based on a CRC(Cyclic Redundancy check) in a mobile station of a mobile communication system which adapts a CDMA method and dynamically performing a backward closed loop power control.
摘要:
Disclosed are an epoxy resin compound and a radiant heat circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a curing agent, and an inorganic filler. The curing agent comprises epoxy adducts formed to add the curing agent to a crystalline epoxy resin. The epoxy resin is used on a printed circuit board as an insulating material, so that a substrate having a high heat radiation property is provided.
摘要:
An epoxy resin compound having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin compound can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.
摘要:
An epoxy resin compound having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin compound can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.
摘要:
An ink composition, and a method of forming a pattern, a color filter and a method of manufacturing the color filter using the same. The ink composition includes a binder resin, a multifunctional monomer having an ethylenic unsaturated double bond, a coloring agent, a polymerization initiator containing a certain positive ion and a solvent. Therefore, the composition has excellent coating property and chemical resistance and also an improved adhesion to a printing member, and thus the ink composition may be useful in forming a precise micropattern using a roll printing method, particularly a reversed printing method.