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公开(公告)号：US20170011860A1
公开(公告)日：2017-01-12
申请号：US15119337
申请日：2015-02-02
IPC分类号： H01G11/06 , H01G11/52 , H01G11/28 , H01G11/72 , H01G11/70 , H01G11/24 , H02J7/00 , H01G11/34
CPC分类号： H01G11/06 , H01G11/14 , H01G11/24 , H01G11/28 , H01G11/32 , H01G11/34 , H01G11/52 , H01G11/70 , H01G11/72 , H01G11/84 , H02J7/007 , H02J7/345 , Y02E60/13
摘要： A capacitor includes a positive electrode, a negative electrode, a separator disposed between the positive electrode and the negative electrode, and an electrolyte. The positive electrode includes a positive electrode current collector and a positive electrode active material held on the positive electrode current collector. The positive electrode active material contains activated carbon. The activated carbon has a carboxyl group, and an amount of desorption of carboxyl group per unit mass of the activated carbon is 0.03 μmol/g or less when the activated carbon is heated with a temperature increase from 300° C. to 500° C. The capacitor has an upper-limit voltage Vu for charging and discharging. The upper-limit voltage Vu of a lithium-ion capacitor is 4.2 V or more. The upper-limit voltage Vu of an electric double-layer capacitor is 3.3 V or more.
摘要翻译： 电容器包括正极，负极，设置在正极和负极之间的隔膜和电解质。 正极包括正极集电体和保持在正极集电体上的正极活性物质。 正极活性物质含有活性炭。 活性炭具有羧基，活性炭在300℃〜500℃的温度升温时，每单位质量活性炭的羧基的解吸量为0.03μmol/ g以下。 电容器具有用于充电和放电的上限电压Vu。 锂离子电容器的上限电压Vu为4.2V以上。 双电层电容器的上限电压Vu为3.3V以上。
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公开(公告)号：US11871514B2
公开(公告)日：2024-01-09
申请号：US17627114
申请日：2021-03-26
发明人： Kenji Takahashi , Shoichiro Sakai
摘要： A flexible printed circuit board according to an aspect is a flexible printed circuit board including a base film and a wiring layer disposed on at least one surface of the base film and having a plurality of wiring lines. The wiring lines have an average line width of 30 μm or less and an average spacing of 30 μm or less. The wiring lines have a copper-based plating layer. The copper-based plating layer has an electrical resistivity of more than 1.68×10−8 Ω·m.
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公开(公告)号：US10548217B1
公开(公告)日：2020-01-28
申请号：US16495234
申请日：2018-02-07
发明人： Kenji Takahashi , Kouji Nitta , Shoichiro Sakai , Junichi Motomura , Maki Ikebe , Kousuke Miura , Masahiro Itou
摘要： A base material for printed interconnect boards according to one aspect of the present invention includes a base film; and at least one conductive layer that is layered on the base film. The base material for printed interconnect boards includes a product in which a plurality of interconnect board pieces are regularly arrayed in plan view and includes an outer frame region surrounding the product. The outer frame region includes a proximity region within 5 mm from an outer edge of the product and includes an outside region other than the proximity region. A layered conductive layer area rate of the proximity region is smaller than a layered conductive layer area rate of the product.
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公开(公告)号：US09786443B2
公开(公告)日：2017-10-10
申请号：US14890350
申请日：2014-03-27
摘要： Provided is a capacitor in which, even in the case of a high maximum charging voltage, decomposition of the electrolyte can be suppressed and charging and discharging can be performed with stability. The capacitor includes a positive electrode containing a positive-electrode active material, a negative electrode containing a negative-electrode active material, a separator disposed between the positive electrode and the negative electrode, and an electrolyte, wherein the positive-electrode active material contains a porous carbon material, in a volume-based pore size distribution of the porous carbon material, a cumulative volume of pores having a pore size of 1 nm or less accounts for 85% or more of a total pore volume, the porous carbon material has a crystallite size of 1 to 10 nm, the porous carbon material contains an oxygen-containing functional group, and a content of the oxygen-containing functional group is 3.3 mol % or less.
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公开(公告)号：US11330718B2
公开(公告)日：2022-05-10
申请号：US16621447
申请日：2018-05-21
发明人： Junichi Motomura , Koji Nitta , Shoichiro Sakai , Kenji Takahashi , Maki Ikebe , Kousuke Miura , Masahiro Itoh
摘要： A printed wiring board production method that forms a base film and a conductive pattern on the base film by an additive method or a subtractive method, includes a plating process that electroplates the conductive pattern on a surface of the base film, wherein the plating process includes a shield plate arranging process that arranges a shield plate between an anode and a printed wiring board substrate that forms a cathode, and a substrate arranging process that arranges the printed wiring board substrate in a plating tank, and wherein a distance between the shield plate and the printed wiring board substrate is 50 mm or greater and 150 mm or less.
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6.发明申请POSITIVE ELECTRODE FOR LITHIUM ION CAPACITOR AND LITHIUM ION CAPACITOR USING THE SAME 审中-公开用于锂离子电容器和锂离子电容器的正极公开(公告)号：US20160336118A1
公开(公告)日：2016-11-17
申请号：US15110485
申请日：2015-01-08
发明人： Masatoshi Majima , Kazuki Okuno , Mitsuyasu Ogawa , Mitsuyasu Ueda , Tomoharu Takeyama , Kenji Takahashi
摘要： A positive electrode for a lithium ion capacitor includes a positive electrode current collector with a three-dimensional network structure and a positive electrode mixture which contains a positive electrode active material and with which the positive electrode current collector is filled. The positive electrode current collector contains aluminum or an aluminum alloy. The positive electrode active material contains a porous carbon material that reversibly carries at least an anion. The positive electrode has an active material density of 350 to 1000 mg/cm3.
摘要翻译： 锂离子电容器用正极包括具有三维网状结构的正极集电体和含有正极活性物质的正极合剂，正极集电体被填充。 正极集电体含有铝或铝合金。 正极活性物质含有可逆地携带至少一种阴离子的多孔碳材料。 正极的活性物质密度为350〜1000mg / cm 3。
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7.发明申请ALKALI METAL ION CAPACITOR, METHOD FOR PRODUCING THE SAME AND METHOD FOR CHARGING AND DISCHARGING THE SAME 审中-公开碱金属离子电容器及其制造方法及其充电和放电方法公开(公告)号：US20160276112A1
公开(公告)日：2016-09-22
申请号：US15032452
申请日：2014-03-14
发明人： Kazuki Okuno , Masatoshi Majima , Mitsuyasu Ueda , Tomoharu Takeyama , Mitsuyasu Ogawa , Kenji Takahashi
CPC分类号： H01G11/62 , H01G11/06 , H01G11/28 , H01G11/50 , H01G11/52 , H01G11/60 , H01G11/70 , H01G11/84 , H02J7/0068 , Y02E60/13
摘要： An alkali metal ion capacitor includes a positive electrode containing a positive electrode active material, a negative electrode containing a negative electrode active material, a separator disposed between the positive electrode and the negative electrode, and an electrolyte. The electrolyte contains an alkali metal salt and an ionic liquid. The alkali metal salt is a salt of a first alkali metal ion serving as a first cation and a first anion. The negative electrode active material is pre-doped with a second alkali metal ion until the potential of the negative electrode reaches 0.05 V or less with respect to a second alkali metal. The alkali metal ion capacitor has an upper-limit voltage for charging and discharging of more than 3.8 V.
摘要翻译： 碱金属离子电容器包括含有正极活性物质的正极，含有负极活性物质的负极，设置在正极和负极之间的隔膜和电解质。 电解质含有碱金属盐和离子液体。 碱金属盐是作为第一阳离子和第一阴离子的第一碱金属离子的盐。 负极活性物质预先掺杂有第二碱金属离子，直到负极的电位相对于第二碱金属达到0.05V以下。 碱金属离子电容器具有高于3.8V的充放电的上限电压。
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公开(公告)号：US11672082B2
公开(公告)日：2023-06-06
申请号：US17658710
申请日：2022-04-11
发明人： Junichi Motomura , Koji Nitta , Shoichiro Sakai , Kenji Takahashi , Maki Ikebe , Kousuke Miura , Masahiro Itoh
CPC分类号： H05K3/18 , C25D5/022 , C25D7/00 , C25D17/008 , H05K3/108 , H05K2203/0723
摘要： A printed wiring board production method that forms a base film and a conductive pattern on the base film by an additive method or a subtractive method, includes a plating process that electroplates the conductive pattern on a surface of the base film, wherein the plating process includes a shield plate arranging process that arranges a shield plate between an anode and a printed wiring board substrate that forms a cathode, and a substrate arranging process that arranges the printed wiring board substrate in a plating tank, and wherein a distance between the shield plate and the printed wiring board substrate is 50 mm or greater and 150 mm or less.
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公开(公告)号：US10952321B2
公开(公告)日：2021-03-16
申请号：US16621022
申请日：2018-08-06
发明人： Kenji Takahashi , Koji Nitta , Shoichiro Sakai , Junichi Okaue
摘要： A printed circuit board according to one aspect of the present invention includes an insulating layer having a through-hole, a conductive layer laminated on an inner circumferential surface of the through-hole, and metal plating layers laminated on a surface of the conductive layer facing opposite the insulating layer and laminated on both surfaces of the insulating layer, wherein an average thickness of the insulating layer is greater than or equal to 5 μm and less than or equal to 50 μm, wherein an average thickness of the metal plating layers is greater than or equal to 3 μm and less than or equal to 50 μm, wherein a hole diameter of the through-hole gradually increases from a first end of the through-hole at one surface of the insulating layer to a second end of the through-hole at another surface of the insulating layer, wherein the hole diameter of the through-hole at the first end is greater than or equal to 1.5 times, and less than or equal to 2.5 times, the average thickness of the metal plating layers, and wherein the hole diameter of the through-hole at the second end is greater than or equal to 1.1 times, and less than or equal to 2 times, the hole diameter of the through-hole at the first end thereof.
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公开(公告)号：US10917967B2
公开(公告)日：2021-02-09
申请号：US16977586
申请日：2019-03-06
发明人： Kenji Takahashi , Eiko Imazaki , Koji Nitta , Shoichiro Sakai , Kousuke Miura , Masahiro Matsumoto , Hirohisa Saito
摘要： A printed wiring board includes an insulator having a first surface, and a second surface opposite to the first surface, a through-hole penetrating from the first surface to the second surface, and a metal plated layer formed on the first and second surfaces of the insulator, and on an inner peripheral surface of the through-hole, wherein an inside diameter of the through-hole gradually decreases from the first surface toward the second surface of the insulator. An average diameter of the through-hole is 20 μm or greater and 35 μm or less at the first surface, and is 3 μm or greater and 15 μm or less at the second surface, and an average thickness of the metal plated layer formed on the first and second surfaces is 8 μm or greater and 12 μm or less.
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