ALUMINUM PLATING APPARATUS AND METHOD FOR PRODUCING ALUMINUM FILM USING SAME
    8.
    发明申请
    ALUMINUM PLATING APPARATUS AND METHOD FOR PRODUCING ALUMINUM FILM USING SAME 审中-公开
    铝镀层装置和使用其制造铝膜的方法

    公开(公告)号:US20150211143A1

    公开(公告)日:2015-07-30

    申请号:US14425457

    申请日:2013-06-13

    IPC分类号: C25D17/06 C25D5/56 C25D3/66

    摘要: The invention offers an aluminum-plating apparatus that can satisfactorily form an aluminum plating even on the surface of a base body that has a surface on which an insulating or poorly conductive metal oxide film or the like is formed. The aluminum-plating apparatus electrodeposits aluminum onto a base body by conveying the base body in a plating bath. The plating bath is divided into a first electrolysis chamber and a second electrolysis chamber by a partition plate in this order from the upstream side in the conveying direction for the base body. In the first electrolysis chamber, a negative electrode provided in the chamber is electrically connected with the base body such that the base body acts as a positive electrode. In the second electrolysis chamber, a positive electrode provided in the chamber is electrically connected with the base body such that the base body acts as a negative electrode.

    摘要翻译: 本发明提供了一种能够令人满意地形成铝镀层的镀铝装置,即使在具有形成有绝缘或导电不良的金属氧化物膜等的表面的基体的表面上也是如此。 铝电镀装置通过在电镀槽中输送基体将铝电镀到基体上。 电镀槽从基体的输送方向的上游侧依次由分隔板分成第一电解室和第二电解室。 在第一电解室中,设置在室中的负极与基体电连接,使得基体用作正极。 在第二电解室中,设置在室中的正电极与基体电连接,使得基体用作负电极。