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公开(公告)号：US20230127566A1
公开(公告)日：2023-04-27
申请号：US17910489
申请日：2021-03-25
Applicant: Sony Interactive Entertainment Inc.
Inventor： Satoshi MITO , Yasuhiro OOTORI
IPC: H05K7/20
Abstract: An electronic apparatus (1) includes a cooling fan (5) configured to generate an airflow that cools a part mounted on a circuit board (50), a flow passage wall (34) defining a flow passage of the airflow fed from the cooling fan (5), and a dust collecting chamber Ds configured to capture dust in the airflow and store the captured dust, the dust collecting chamber Ds being provided to the flow passage wall (34). According to this, the amount of the dust fed to air supply targets such as a heat sink and a power supply unit together with air can be reduced.
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公开(公告)号：US20230110303A1
公开(公告)日：2023-04-13
申请号：US17910203
申请日：2021-03-23
Applicant: Sony Interactive Entertainment Inc.
Inventor： Yuta TAMAKI , Hironobu ENDO , Yasuhiro OOTORI
Abstract: Buttons (41A, 41B) have a button moving part (42) disposed in front of a circuit board (51) and allowed to move in a front-back direction, and guided parts (42e) moving in conjunction with the button moving part (42). The buttons (41A, 41B) cause the button moving part (42) to operate a switch (52) of the circuit board (51). Guide parts (21E, 21F) are disposed along the guided parts (42e) and restrict the direction in which the button moving part (42) moves. The guide parts (21E, 21F) and the guided parts (42e) have portions located back of a front surface (51a) of the circuit board (51). This structure effectively prevents the buttons from tilting when they are operated.
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公开(公告)号：US20230116950A1
公开(公告)日：2023-04-20
申请号：US17910876
申请日：2021-03-23
Applicant: Sony Interactive Entertainment Inc.
Inventor： Katsushi ITO , Yasuhiro OOTORI , Nobuyuki SUGAWARA
IPC: H05K1/18
Abstract: A board shield (52) covers a region in which an electronic part is mounted on a lower surface of a circuit board (50). A memory housing chamber (R1) capable of housing a semiconductor memory is secured on the lower side of the circuit board. The board shield (52) includes a shield wall (52e) along the memory housing chamber R1). With this, it is possible to protect the semiconductor memory while suppressing an increase in the number of parts.
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公开(公告)号：US20170196098A1
公开(公告)日：2017-07-06
申请号：US15466877
申请日：2017-03-23
Applicant: SONY INTERACTIVE ENTERTAINMENT INC.
Inventor： Yukito INOUE , Yasuhiro OOTORI
CPC classification number: H05K5/0008 , A63F13/90 , G06F1/181 , G06F1/20 , H05K5/0004 , H05K5/0247 , H05K5/03 , H05K7/1427 , H05K7/20136 , H05K7/20145 , H05K7/20181
Abstract: A plurality of parts built, in an electronic apparatus (1) are attached to a frame (20). Further, the frame (20) has a peripheral wall portion (21, 22, 23) formed along an outer peripheral face of the electronic apparatus (1). An upper cover (30) has a rear face portion (32) attached to a rear wall portion (23) of the frame (20) by a screw. Further, a lower cover (40) has a rear face portion (43) attached to the rear wall portion (23) of the frame (20) by a screw. With the structure, insertion locations of the fixtures such as screws can be suppressed from standing out.
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公开(公告)号：US20230114888A1
公开(公告)日：2023-04-13
申请号：US17911874
申请日：2021-03-25
Applicant: Sony Interactive Entertainment Inc.
Inventor： Yujin MORISAWA , Yasuhiro OOTORI , Keiichi AOKI , Shinya TSUCHIDA
Abstract: There is provided an electronic apparatus which improves an external appearance and which easily ensures the strength of an exterior member. In the electronic apparatus, an upper surface of an exterior panel (20A) has, on a peripheral portion of the upper surface, a first position (P1), a second position (P2) defined on an opposite side of a center (P0) of the upper surface from the first position (P1), a third position (P3), and a fourth position (P4) defined on an opposite side of the center (P0) of the upper surface from the third position (P3). A line (L1) that connects the first position (P1) and the second position (P2) to each other and is formed along the upper surface is a curve bulging to a lower side, and a line (L2) that connects the third position (P3) and the fourth position (P4) to each other and is formed along the upper surface is a curve bulging to an upper side.
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Patent Agency Ranking
公开(公告)号：US20230102571A1
公开(公告)日：2023-03-30
申请号：US17910215
申请日：2021-03-25
Applicant: Sony Interactive Entertainment Inc.
Inventor： Nils SABELSTROM , Chiyoshi SASAKI , Shinya TSUCHIDA , Keiichi AOKI , Yasuhiro OOTORI
IPC: H05K7/20
Abstract: A heat radiating device includes a plurality of heat pipes including respective heat receiving portions that are located above an integrated circuit and that are thermally connected to the integrated circuit, and a heat sink connected to the plurality of heat pipes. A plurality of the heat receiving portions are aligned with each other in a left-right direction and are in contact with the heat receiving portions (73a) of adjacent ones of the heat pipes. The heat receiving portions each have a first width in an upward-downward direction and have a second width smaller than the width in the left-right direction. With this, cooling performance for the integrated circuit can be improved.
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公开(公告)号：US20240192737A1
公开(公告)日：2024-06-13
申请号：US18411118
申请日：2024-01-12
Applicant: Sony Interactive Entertainment Inc.
Inventor： Yujin MORISAWA , Kazutaka ETO , Yasuhiro OOTORI , Yuta TAMAKI , Toshihiro UEDA
CPC classification number: G06F1/181 , G06F1/20 , H05K7/20145 , H05K7/20172 , H05K5/0008
Abstract: An exterior panel for attachment to a surface of a housing includes: a curved profile that includes an inner surface and an outer surface; and a plurality of projecting portions extending out of the inner surface of the exterior panel, where each of the projecting portions is configured to fit in corresponding attachment holes that is formed on the surface of the housing of the game device, and the plurality of projecting portions, when fit into the corresponding holes, provide a separation between the surface of the housing of the game device and the inner surface.
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公开(公告)号：US20230171915A1
公开(公告)日：2023-06-01
申请号：US17910485
申请日：2020-09-24
Applicant: Sony Interactive Entertainment Inc.
Inventor： Shinya TSUCHIDA , Keiichi AOKI , Yasuhiro OOTORI , Yuta TAMAKI , Mitsuharu MORISHITA
IPC: H05K7/20
CPC classification number: H05K7/20145 , H05K7/2039 , H05K7/20336
Abstract: Not only cooling performance for an integrated circuit such as a CPU but also cooling performance for a power supply unit is improved. An electronic apparatus (1) includes a first heat sink (71) and a power supply unit (60) including a power supply unit case (61) having an intake air wall (61a) in which a plurality of air intake holes (61b) are formed. The intake air wall (61b) is located in front of the first heat sink (71). The intake air wall (61b) has an external surface being inclined with respect to both a front-rear direction and a left-right direction and facing the first heat sink (71). A cooling fan (5) is disposed to feed air toward the intake air wall (61a).
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公开(公告)号：US20210303039A1
公开(公告)日：2021-09-30
申请号：US17201307
申请日：2021-03-15
Applicant: Sony Interactive Entertainment Inc.
Inventor： Yujin MORISAWA , Kazutaka ETO , Yasuhiro OOTORI , Yuta TAMAKI , Toshihiro UEDA
Abstract: An electronic apparatus includes an apparatus main body having a first external surface that faces a first direction and a first side surface that faces a second direction orthogonal to the first direction, and a first exterior panel curved at least partly, in which the first exterior panel covers the first external surface and is attached to the first external surface, and the first exterior panel has, at an end portion of the first exterior panel, a first projecting portion beyond a position of the first side surface.
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公开(公告)号：US20210303038A1
公开(公告)日：2021-09-30
申请号：US17201072
申请日：2021-03-15
Applicant: Sony Interactive Entertainment Inc.
Inventor： Yujin MORISAWA , Kazutaka ETO , Yasuhiro OOTORI , Yuta TAMAKI , Toshihiro UEDA
Abstract: An electronic apparatus includes an apparatus main body having a first external surface that faces a first direction and a first side surface that faces a second direction orthogonal to the first direction, and a first exterior panel curved at least partly, in which the first exterior panel covers the first external surface and is attached to the first external surface, and the first exterior panel has, at an end portion of the first exterior panel, a first projecting portion beyond a position of the first side surface.
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