公开(公告)号：US20230116950A1

公开(公告)日：2023-04-20

申请号：US17910876

申请日：2021-03-23

Applicant: Sony Interactive Entertainment Inc.

Inventor： Katsushi ITO ,  Yasuhiro OOTORI ,  Nobuyuki SUGAWARA

IPC: H05K1/18

Abstract: A board shield (52) covers a region in which an electronic part is mounted on a lower surface of a circuit board (50). A memory housing chamber (R1) capable of housing a semiconductor memory is secured on the lower side of the circuit board. The board shield (52) includes a shield wall (52e) along the memory housing chamber R1). With this, it is possible to protect the semiconductor memory while suppressing an increase in the number of parts.

公开(公告)号：US20230097177A1

公开(公告)日：2023-03-30

申请号：US17910197

申请日：2021-03-23

Applicant: Sony Interactive Entertainment Inc.

Inventor： Nobuyuki SUGAWARA ,  Katsushi ITO

IPC: H05K7/20

Abstract: A leakage of electromagnetic waves is suppressed effectively on the periphery of a heat radiating device. A heat radiating device (80) includes a plurality of fins (81) that are arranged on the inside of an opening (52a), a heat pipe (83) that includes a connecting portion (83a) being located between the plurality of fins (81) and a circuit board (50) and extending in a left-right direction along the circuit board (50), and a base plate (82) that supports the plurality of fins (81). The base plate (82) includes a plate left portion (82c). The plate left portion (82c) covers a lower surface of the heat pipe (83), the lower surface facing a side of a board shield (52), and closes a gap (G1) between a left end of the plurality of fins (81) and a left edge of the opening (52a) of the board shield (52).