公开(公告)号：US20230114888A1

公开(公告)日：2023-04-13

申请号：US17911874

申请日：2021-03-25

Applicant: Sony Interactive Entertainment Inc.

Inventor： Yujin MORISAWA ,  Yasuhiro OOTORI ,  Keiichi AOKI ,  Shinya TSUCHIDA

IPC: G06F1/20 ,  H05K7/20 ,  H05K5/03

Abstract: There is provided an electronic apparatus which improves an external appearance and which easily ensures the strength of an exterior member. In the electronic apparatus, an upper surface of an exterior panel (20A) has, on a peripheral portion of the upper surface, a first position (P1), a second position (P2) defined on an opposite side of a center (P0) of the upper surface from the first position (P1), a third position (P3), and a fourth position (P4) defined on an opposite side of the center (P0) of the upper surface from the third position (P3). A line (L1) that connects the first position (P1) and the second position (P2) to each other and is formed along the upper surface is a curve bulging to a lower side, and a line (L2) that connects the third position (P3) and the fourth position (P4) to each other and is formed along the upper surface is a curve bulging to an upper side.

公开(公告)号：US20230102571A1

公开(公告)日：2023-03-30

申请号：US17910215

申请日：2021-03-25

Applicant: Sony Interactive Entertainment Inc.

Inventor： Nils SABELSTROM ,  Chiyoshi SASAKI ,  Shinya TSUCHIDA ,  Keiichi AOKI ,  Yasuhiro OOTORI

IPC: H05K7/20

Abstract: A heat radiating device includes a plurality of heat pipes including respective heat receiving portions that are located above an integrated circuit and that are thermally connected to the integrated circuit, and a heat sink connected to the plurality of heat pipes. A plurality of the heat receiving portions are aligned with each other in a left-right direction and are in contact with the heat receiving portions (73a) of adjacent ones of the heat pipes. The heat receiving portions each have a first width in an upward-downward direction and have a second width smaller than the width in the left-right direction. With this, cooling performance for the integrated circuit can be improved.

公开(公告)号：US20230171915A1

公开(公告)日：2023-06-01

申请号：US17910485

申请日：2020-09-24

Applicant: Sony Interactive Entertainment Inc.

Inventor： Shinya TSUCHIDA ,  Keiichi AOKI ,  Yasuhiro OOTORI ,  Yuta TAMAKI ,  Mitsuharu MORISHITA

IPC: H05K7/20

CPC classification number: H05K7/20145 ,  H05K7/2039 ,  H05K7/20336

Abstract: Not only cooling performance for an integrated circuit such as a CPU but also cooling performance for a power supply unit is improved. An electronic apparatus (1) includes a first heat sink (71) and a power supply unit (60) including a power supply unit case (61) having an intake air wall (61a) in which a plurality of air intake holes (61b) are formed. The intake air wall (61b) is located in front of the first heat sink (71). The intake air wall (61b) has an external surface being inclined with respect to both a front-rear direction and a left-right direction and facing the first heat sink (71). A cooling fan (5) is disposed to feed air toward the intake air wall (61a).

公开(公告)号：US20180033464A1

公开(公告)日：2018-02-01

申请号：US15662300

申请日：2017-07-28

Applicant: SONY INTERACTIVE ENTERTAINMENT INC.

Inventor： Kazutaka ETO ,  Shinya TSUCHIDA ,  Keiichi AOKI

IPC: G11B33/02 ,  G06F1/18

CPC classification number: G11B33/027 ,  G06F1/181 ,  G06F1/187 ,  G11B33/022 ,  G11B33/124

Abstract: Disclosed herein is an electronic apparatus including a main body, a compartment provided in the main body, a part that, is accommodated in the compartment and that can be drawn out of the compartment, two attachment sections that are provided on the part and that are located away from each other, and a knob member attached to the two attachment sections. The knob member is a flexible member that is longer than a distance between the two attachment sections, includes a curved portion that is curved in such a manner as to swell in a direction away from the part, and is elastically deformable such that the swelling of the curved portion decreases.