公开(公告)号：US20230102571A1

公开(公告)日：2023-03-30

申请号：US17910215

申请日：2021-03-25

Applicant: Sony Interactive Entertainment Inc.

Inventor： Nils SABELSTROM ,  Chiyoshi SASAKI ,  Shinya TSUCHIDA ,  Keiichi AOKI ,  Yasuhiro OOTORI

IPC: H05K7/20

Abstract: A heat radiating device includes a plurality of heat pipes including respective heat receiving portions that are located above an integrated circuit and that are thermally connected to the integrated circuit, and a heat sink connected to the plurality of heat pipes. A plurality of the heat receiving portions are aligned with each other in a left-right direction and are in contact with the heat receiving portions (73a) of adjacent ones of the heat pipes. The heat receiving portions each have a first width in an upward-downward direction and have a second width smaller than the width in the left-right direction. With this, cooling performance for the integrated circuit can be improved.