SHEAR CUTTER WITH IMPROVED WEAR RESISTANCE OF WC-CO SUBSTRATE
    5.
    发明申请
    SHEAR CUTTER WITH IMPROVED WEAR RESISTANCE OF WC-CO SUBSTRATE 审中-公开
    具有改善WC-CO基材耐磨性的剪切机

    公开(公告)号:US20160121458A1

    公开(公告)日:2016-05-05

    申请号:US14992706

    申请日:2016-01-11

    IPC分类号: B24D3/06 B24D18/00 E21B10/567

    摘要: A cutting element may be formed by sintering together a plurality of metal carbide grains and a metal binder to form a substrate, forming at least one binder gradient in the substrate, and mounting an abrasive layer to the substrate at an interface. The concentration of metal binder material may decrease along at least one direction to form the at least one binder gradient.

    摘要翻译: 可以通过将多个金属碳化物晶粒和金属粘合剂烧结在一起形成基底,在基底中形成至少一种粘合剂梯度,并在研磨界面处将研磨层安装到基底上来形成切割元件。 金属粘合剂材料的浓度可以沿着至少一个方向减小以形成至少一种粘合剂梯度。

    HIGH DIAMOND FRAME STRENGTH PCD MATERIALS
    10.
    发明申请
    HIGH DIAMOND FRAME STRENGTH PCD MATERIALS 审中-公开
    高金刚石框架强度PCD材料

    公开(公告)号:US20150292271A1

    公开(公告)日:2015-10-15

    申请号:US14752265

    申请日:2015-06-26

    IPC分类号: E21B10/55 B24D18/00

    摘要: The present disclosure relates to cutting elements incorporating polycrystalline diamond bodies used for subterranean drilling applications, and more particularly, to polycrystalline diamond bodies having high diamond frame strength and methods for forming and evaluating such polycrystalline diamond bodies. A polycrystalline diamond body is provided, having a top surface, a cutting edge meeting the top surface, and a first region including at least a portion of the cutting edge. The first portion exhibits a diamond frame strength of about 1200 MPa or greater, or about 1300 MPa or greater.

    摘要翻译: 本公开涉及包括用于地下钻井应用的多晶金刚石体的切割元件,更具体地,涉及具有高金刚石框架强度的多晶金刚石体以及用于形成和评估这种多晶金刚石体的方法。 提供多晶金刚石体,其具有顶表面,与顶表面相符的切削刃,以及包括切削刃的至少一部分的第一区域。 第一部分具有约1200MPa或更大,或约1300MPa或更大的金刚石框架强度。