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公开(公告)号：US11008815B2
公开(公告)日：2021-05-18
申请号：US15745719
申请日：2016-07-20
IPC分类号： E21B10/573 , E21B10/567 , C22C26/00 , C22C29/08 , C04B35/645 , C04B37/02 , B22F7/06 , B22F7/08 , B22F5/00 , C04B35/528 , C04B35/63 , E21B10/50 , E21B10/55
摘要： Cutting elements include a diamond-bonded body attached with a substrate. The substrate has a coercivity of greater than about 200 Oe, and has a magnetic saturation of from about 73 to 90. The diamond-bonded body has a compressive stress at the surface of greater than about 0.9 GPa after heat treatment, and greater than about 1.2 GPa prior to heat treatment.
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2.发明申请公开(公告)号：US20180363383A1
公开(公告)日：2018-12-20
申请号：US16061097
申请日：2016-11-24
发明人： Yahua Bao , Yi Fang , Haibo Zhang , John Daniel Belnap , Youhe Zhang
IPC分类号： E21B10/55
摘要： A cutting element may include: a substrate; and an ultrahard layer on the substrate, the ultrahard layer having a non-planar working surface, the non-planar working surface being formed from a first region and a second region, the first region, encompassing at least a cutting edge or tip of the cutting element and having a differing composition than the second region.
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公开(公告)号：US11199051B2
公开(公告)日：2021-12-14
申请号：US16153865
申请日：2018-10-08
发明人： Yi Fang , J. Daniel Belnap , Scott L. Horman , Ryan Davis , Haibo Zhang
IPC分类号： E21B10/567 , E21B10/08
摘要： A cutting element has an intercrystalline-bonded diamond body that includes an inner region and an outer surface that includes a working surface of the cutting element. The outer surface is treated, after formation of the intercrystalline-bonded diamond by high-pressure/high-temperature process, to have a level of surface compressive stress that is greater than a compressive stress of the inner region.
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公开(公告)号：US10100583B2
公开(公告)日：2018-10-16
申请号：US14475311
申请日：2014-09-02
发明人： Yi Fang , J. Daniel Belnap , Scott L. Horman , Ryan Davis , Haibo Zhang
摘要： Cutting elements include polycrystalline diamond which may be attached to a substrate. The polycrystalline diamond may have a ratio of cubic to hexagonal cobalt crystalline structures of greater than about 1.2. The polycrystalline diamond may have a high level surface compressive stress of greater than about 500 MPa.
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公开(公告)号：US20160144482A1
公开(公告)日：2016-05-26
申请号：US14949520
申请日：2015-11-23
发明人： Yi Fang , Haibo Zhang , J. Daniel Belnap
IPC分类号： B24D3/10 , B24D99/00 , E21B10/567 , B24D18/00
CPC分类号： B24D3/10 , B24D18/0009 , B24D99/005 , E21B10/46 , E21B10/55 , E21B10/567 , E21B10/5735
摘要： A Diamond Enhanced Insert (DEI) includes a working layer of a polycrystalline diamond material (PCD). The PCD material includes a first phase that includes a number of particles of a first material. The PCD material also includes a second phase that is adapted as a catalyst. The PCD material has a fracture toughness greater than 12.5 MPa·√m, a flexural strength of greater than 800 MPa, and a diamond frame strength of less than 400 MPa.
摘要翻译： 钻石增强插入件（DEI）包括多晶金刚石材料（PCD）的工作层。 PCD材料包括第一相，其包括多个第一材料的颗粒。 PCD材料还包括适于作为催化剂的第二相。 PCD材料的断裂韧性大于12.5MPa·√m，弯曲强度大于800MPa，金刚石框架强度小于400MPa。
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公开(公告)号：US10781643B2
公开(公告)日：2020-09-22
申请号：US16061097
申请日：2016-11-24
发明人： Yahua Bao , Yi Fang , Haibo Zhang , John Daniel Belnap , Youhe Zhang
IPC分类号： E21B10/55 , E21B10/56 , E21B10/567
摘要： A cutting element has an ultrahard layer on a substrate, the ultrahard layer having a non-planar working surface. The non-planar working surface is formed from a first region and a second region, where the first region encompasses at least a cutting edge or tip of the cutting element and has a differing composition than the second region.
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公开(公告)号：US20190040688A1
公开(公告)日：2019-02-07
申请号：US16153865
申请日：2018-10-08
发明人： Yi Fang , J. Daniel Belnap , Scott L. Horman , Ryan Davis , Haibo Zhang
IPC分类号： E21B10/567 , E21B10/08
摘要： A cutting element has an intercrystalline-bonded diamond body that includes an inner region and an outer surface that includes a working surface of the cutting element. The outer surface is treated, after formation of the intercrystalline-bonded diamond by high-pressure/high-temperature process, to have a level of surface compressive stress that is greater than a compressive stress of the inner region.
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公开(公告)号：US10107042B2
公开(公告)日：2018-10-23
申请号：US14019394
申请日：2013-09-05
发明人： Feng Yu , Benjamin Randall , Haibo Zhang , J. Daniel Belnap
摘要： Ultra-hard constructions comprise polycrystalline diamond-body having a first metallic substrate attached thereto, and having a second metallic substrate attached to the first metallic substrate. The first and second substrates each comprise a first hard particle phase, e.g., WC, and a second binder material phase, e.g., Co, wherein the hard particles in the second substrate are sized larger than those in the first substrate. The first substrate may contain a larger amount of binder material than the second substrate. Constructed in this matter, the first substrate is engineered to facilitate sintering diamond body during HPHT conditions, while the second substrate is engineered to provide an improved degree of erosion resistance when placed in an end-use application. The construction may be formed during a single HPHT process. The second substrate may comprise 80 percent or more of the combined thickness of the first and second substrates.
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公开(公告)号：US20180216411A1
公开(公告)日：2018-08-02
申请号：US15745719
申请日：2016-07-20
IPC分类号： E21B10/573 , E21B10/567 , C04B35/528 , C04B35/645 , C04B35/63 , C04B37/02 , C22C26/00 , C22C29/08 , B22F7/08
CPC分类号： E21B10/5735 , B22F7/062 , B22F7/08 , B22F2005/001 , B22F2302/10 , B22F2302/406 , C04B35/528 , C04B35/6303 , C04B35/645 , C04B37/023 , C04B37/025 , C04B37/026 , C04B2235/3206 , C04B2235/3208 , C04B2235/442 , C04B2235/96 , C04B2237/086 , C04B2237/12 , C04B2237/363 , C04B2237/401 , C04B2237/704 , C04B2237/72 , C22C26/00 , C22C29/08 , E21B10/50 , E21B10/55 , E21B10/5673 , E21B10/573
摘要： Cutting elements include a diamond-bonded body attached with a substrate. The substrate has a coercivity of greater than about 200 Oe, and has a magnetic saturation of from about 73 to 90. The diamond-bonded body has a compressive stress at the surface of greater than about 0.9 GPa after heat treatment, and greater than about 1.2 GPa prior to heat treatment.
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公开(公告)号：US10016873B2
公开(公告)日：2018-07-10
申请号：US14949520
申请日：2015-11-23
发明人： Yi Fang , Haibo Zhang , J. Daniel Belnap
IPC分类号： B24D3/10 , E21B10/46 , E21B10/55 , E21B10/567 , B24D18/00 , B24D99/00 , E21B10/573
CPC分类号： B24D3/10 , B24D18/0009 , B24D99/005 , E21B10/46 , E21B10/55 , E21B10/567 , E21B10/5735
摘要： A Diamond Enhanced Insert (DEI) includes a working layer of a polycrystalline diamond material (PCD). The PCD material includes a first phase that includes a number of particles of a first material. The PCD material also includes a second phase that is adapted as a catalyst. The PCD material has a fracture toughness greater than 12.5 MPa·√m, a flexural strength of greater than 800 MPa, and a diamond frame strength of less than 400 MPa.
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