-
公开(公告)号:US20220224308A1
公开(公告)日:2022-07-14
申请号:US17657533
申请日:2022-03-31
发明人: Satoru Matsuda , Tatsuya Fujii , Yoshiro Kabe , Kenji Nagano
摘要: Methods of manufacturing an acoustic wave device are disclosed. An anti-reflection layer can be formed over a conductive layer that is over a piezoelectric layer. The conductive layer can include aluminum, for example. The anti-reflection layer can remain distinct from the conductive layer after a heating process. A photolithography process can pattern an interdigital transducer of the acoustic wave device from one or more interdigital transducer electrode layers that include the conductive layer. The anti-reflection layer can reduce reflection from the conductive layer during the photolithography process.
-
公开(公告)号:US11855603B2
公开(公告)日:2023-12-26
申请号:US17657533
申请日:2022-03-31
发明人: Satoru Matsuda , Tatsuya Fujii , Yoshiro Kabe , Kenji Nagano
CPC分类号: H03H9/02574 , H03H9/02559 , H03H9/02834 , H03H9/02842 , H03H9/14502 , H03H9/14541 , H03H9/25 , H03H9/6406 , H03H9/725
摘要: Methods of manufacturing an acoustic wave device are disclosed. An anti-reflection layer can be formed over a conductive layer that is over a piezoelectric layer. The conductive layer can include aluminum, for example. The anti-reflection layer can remain distinct from the conductive layer after a heating process. A photolithography process can pattern an interdigital transducer of the acoustic wave device from one or more interdigital transducer electrode layers that include the conductive layer. The anti-reflection layer can reduce reflection from the conductive layer during the photolithography process.
-
3.
公开(公告)号:US20240223152A1
公开(公告)日:2024-07-04
申请号:US18530700
申请日:2023-12-06
发明人: Rei Goto , Tatsuya Fujii
CPC分类号: H03H9/02574 , H03H9/02661 , H03H9/14541
摘要: An acoustic wave device is disclosed. The acoustic wave device can include a piezoelectric layer, and an interdigital transducer electrode formed with the piezoelectric layer. The interdigital transducer electrode includes a finger extending from a bus bar. The finger has a first region and a second region between the first region and the bus bar. The finger has a lower side and an upper side opposite the lower side. The lower side is closer to the piezoelectric layer than the upper side. Widths of the lower side in the first and second regions are generally the same, and a width of the upper side in the first region is greater than a width of the upper side in the second region.
-
公开(公告)号:US20200266796A1
公开(公告)日:2020-08-20
申请号:US16790408
申请日:2020-02-13
发明人: Satoru Matsuda , Tatsuya Fujii , Yoshiro Kabe , Kenji Nagano
摘要: An acoustic wave device is disclosed. The acoustic wave device includes a piezoelectric layer, an interdigital transducer electrode positioned over the piezoelectric layer, and an anti-refection layer over a conductive layer of the interdigital transducer electrode. The conductive layer can include aluminum, for example. The anti-reflection layer can include silicon. The anti-reflection layer can be free from a material of the interdigital transducer electrode. The acoustic wave device can further include a temperature compensation layer positioned over the anti-reflection layer in certain embodiments.
-
公开(公告)号:US20240223156A1
公开(公告)日:2024-07-04
申请号:US18530655
申请日:2023-12-06
发明人: Rei Goto , Tatsuya Fujii
CPC分类号: H03H9/14538 , H03H3/08 , H03H9/25
摘要: An acoustic wave device is disclosed. The acoustic wave device can include a piezoelectric layer, and an interdigital transducer electrode formed with the piezoelectric layer. The interdigital transducer electrode includes a finger extending from a bus bar. The finger has a first region and a second region between the first region and the bus bar. The finger has a lower side, an upper side opposite the lower side, and a sidewall between the lower side and the upper side. A corner between the upper side and the sidewall is more rounded in the second region than in the first region.
-
6.
公开(公告)号:US20240223149A1
公开(公告)日:2024-07-04
申请号:US18530618
申请日:2023-12-06
发明人: Rei Goto , Tatsuya Fujii
CPC分类号: H03H3/08 , H03H9/14538 , H03H9/25
摘要: A method of forming an acoustic wave device is disclosed. The method can include providing a piezoelectric layer, forming an interdigital transducer electrode with the piezoelectric layer, and selectively removing at least a portion of the interdigital transducer electrode. The interdigital transducer electrode includes a finger extending from a bus bar. The finger has a first region and a second region between the first region and the bus bar. The finger has a lower side, an upper side opposite the lower side, a sidewall between the lower side and the upper side, and a corner between the upper side and the sidewall. Selectively removing at least a portion of the interdigital transducer electrode includes selectively removing at least a portion of the second region of the finger such that the corner in the second region of the finger has a more rounded corner than the corner in the first region.
-
公开(公告)号:US20240088865A1
公开(公告)日:2024-03-14
申请号:US18511405
申请日:2023-11-16
发明人: Satoru Matsuda , Tatsuya Fujii , Yoshiro Kabe , Kenji Nagano
CPC分类号: H03H9/02574 , H03H9/02559 , H03H9/02834 , H03H9/02842 , H03H9/14502 , H03H9/14541 , H03H9/25 , H03H9/6406 , H03H9/725
摘要: An acoustic wave device is disclosed. The acoustic wave device includes a piezoelectric layer, an interdigital transducer electrode positioned over the piezoelectric layer, and an anti-refection layer over a conductive layer of the interdigital transducer electrode. The conductive layer can include aluminum, for example. The anti-reflection layer can include silicon. The anti-reflection layer can be free from a material of the interdigital transducer electrode. The acoustic wave device can further include a temperature compensation layer positioned over the anti-reflection layer in certain embodiments.
-
8.
公开(公告)号:US20240039507A1
公开(公告)日:2024-02-01
申请号:US18221130
申请日:2023-07-12
发明人: Rei Goto , Shoji Okamoto , Tatsuya Fujii , Hironori Fukuhara
CPC分类号: H03H9/02661 , H03H9/6483 , H03H9/02574
摘要: A surface acoustic wave filter package comprising a tapered interdigital transducer structure.
-
-
-
-
-
-
-