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公开(公告)号：US20150187741A1
公开(公告)日：2015-07-02
申请号：US14211244
申请日：2014-03-14
Applicant: Siliconware Precision Industries Co., Ltd
Inventor： Shih-Hao Tung , Chang-Yi Lan , Lung-Yuan Wang , Cheng-Chia Chiang , Chu-Huei Huang
CPC classification number: H01L25/105 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/50 , H01L2224/131 , H01L2224/16237 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/06568 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/014 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2924/207
Abstract: A method for fabricating a package on package (PoP) structure is provided, which includes: providing a first packaging substrate having at least a first electronic element and a plurality of first support portions, wherein the first electronic element is electrically connected to the first packaging substrate; forming an encapsulant on the first packaging substrate for encapsulating the first electronic element and the first support portions; forming a plurality of openings in the encapsulant for exposing portions of surfaces of the first support portions; and providing a second packaging substrate having a plurality of second support portions and stacking the second packaging substrate on the first packaging substrate with the second support portions positioned in the openings of the encapsulant and bonded with the first support portions. As such, the encapsulant effectively separates the first support portions or the second support portions from one another to prevent bridging from occurring therebetween.
Abstract translation: 提供了一种用于制造封装（PoP）封装结构的方法，其包括：提供具有至少第一电子元件和多个第一支撑部分的第一封装基板，其中第一电子元件电连接到第一封装 基质; 在所述第一包装基板上形成密封剂，以密封所述第一电子元件和所述第一支撑部分; 在所述密封剂中形成多个开口以暴露所述第一支撑部分的表面的部分; 以及提供具有多个第二支撑部分的第二包装基板，并且将第二包装基板堆叠在第一包装基板上，其中第二支撑部分位于密封剂的开口中并与第一支撑部分结合。 因此，密封剂有效地将第一支撑部分或第二支撑部分彼此分离，以防止在它们之间发生桥接。
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公开(公告)号：US09905546B2
公开(公告)日：2018-02-27
申请号：US14211244
申请日：2014-03-14
Applicant: Siliconware Precision Industries Co., Ltd
Inventor： Shih-Hao Tung , Chang-Yi Lan , Lung-Yuan Wang , Cheng-Chia Chiang , Chu-Huei Huang
IPC: H01L21/56 , H01L23/28 , H01L25/00 , H01L25/10 , H01L23/498 , H01L23/00 , H01L25/065 , H01L23/31
CPC classification number: H01L25/105 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/50 , H01L2224/131 , H01L2224/16237 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/06568 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/014 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2924/207
Abstract: A method for fabricating a package on package (PoP) structure is provided, which includes: providing a first packaging substrate having at least a first electronic element and a plurality of first support portions, wherein the first electronic element is electrically connected to the first packaging substrate; forming an encapsulant on the first packaging substrate for encapsulating the first electronic element and the first support portions; forming a plurality of openings in the encapsulant for exposing portions of surfaces of the first support portions; and providing a second packaging substrate having a plurality of second support portions and stacking the second packaging substrate on the first packaging substrate with the second support portions positioned in the openings of the encapsulant and bonded with the first support portions. As such, the encapsulant effectively separates the first support portions or the second support portions from one another to prevent bridging from occurring therebetween.
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