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公开(公告)号：US10698001B2
公开(公告)日：2020-06-30
申请号：US15824128
申请日：2017-11-28
Applicant: Silicon Laboratories Inc.
Inventor： Larry R. Rose , Wenshui Zhang
IPC: G01R1/04
Abstract: A modular integrated circuit test fixture integrates the integrated circuit (IC) handler to IC test fixture alignment interface (the alignment plate) into a daughter card subassembly, which reduces the overall rejection rate of devices due to alignment errors. The test fixture has a plurality of daughter card subassemblies for receiving integrated circuits for testing. Each daughter card subassembly is independently removable from the test fixture and includes a daughter card for a particular size and type of integrated circuit, a plurality of sockets electrically and mechanically coupled to the daughter card to receive respective integrated circuits for testing, and an alignment plate to provide alignment between an IC handler and respective ones of the daughter card subassemblies and to provide alignment for one or more manual test lids. The manual test lids are removed for automatic testing using an IC handler.
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公开(公告)号：US10551411B2
公开(公告)日：2020-02-04
申请号：US15892931
申请日：2018-02-09
Applicant: SILICON LABORATORIES INC.
Inventor： Scott E. Caudle , Wenshui Zhang , Raymond A. Booher
Abstract: A test system for testing semiconductor chips including a docking plate, a test card, chip sockets, a stiffener, and test electronics. Each test card has a uniform card configuration that may be used with any of several different handlers. Each test card includes conductive pads electrically coupled to and longitudinally offset from a socket interface along a length of the test card. The stiffener includes a test interface including conductive pins for electrically interfacing the conductive pads of the test card. The test card is supported by the stiffener so that it remains undeformed as each chip is plunged into a test socket. The test interface includes a basin that is covered by the test card to form a thermal isolation cavity for thermal separation from the test electronics. A uniform radio frequency interface is provided between each test card and a corresponding test interface.
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公开(公告)号：US20190162755A1
公开(公告)日：2019-05-30
申请号：US15824128
申请日：2017-11-28
Applicant: Silicon Laboratories Inc.
Inventor： Larry R. Rose , Wenshui Zhang
IPC: G01R1/04
Abstract: A modular integrated circuit test fixture integrates the integrated circuit (IC) handler to IC test fixture alignment interface (the alignment plate) into a daughter card subassembly, which reduces the overall rejection rate of devices due to alignment errors. The test fixture has a plurality of daughter card subassemblies for receiving integrated circuits for testing. Each daughter card subassembly is independently removable from the test fixture and includes a daughter card for a particular size and type of integrated circuit, a plurality of sockets electrically and mechanically coupled to the daughter card to receive respective integrated circuits for testing, and an alignment plate to provide alignment between an IC handler and respective ones of the daughter card subassemblies and to provide alignment for one or more manual test lids. The manual test lids are removed for automatic testing using an IC handler.
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Patent Agency Ranking
4.发明申请公开(公告)号：US20220341989A1
公开(公告)日：2022-10-27
申请号：US17241164
申请日：2021-04-27
Applicant: Silicon Laboratories Inc.
Inventor： Wenshui Zhang , Wei Jue Lim
Abstract: A test system for high voltage testing of semiconductor devices including at least one test socket and a docking plate assembly. Each test socket includes a socket enclosure for encompassing first and second contact finger assemblies, in which the socket enclosure may include a cover and alignment plate. At least one test socket is embedded within the docking plate assembly which is configured to mount between high voltage test head and a pick and place handler. The docking plate assembly and each test socket includes one or more site openings each for receiving a corresponding device under test (DUT) during a high voltage test procedure. Each contact finger assembly includes at least one contact finger configured as an elongated conductor with a bent tip for electrically interfacing a pad of the DUT.
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公开(公告)号：US20140232425A1
公开(公告)日：2014-08-21
申请号：US13771889
申请日：2013-02-20
Applicant: SILICON LABORATORIES INC.
Inventor： Larry R. Rose , Craig N. Gabelmann , Wenshui Zhang
IPC: G01R31/28
CPC classification number: G01R1/0433
Abstract: A contactor uses a pogo block in a first configuration as a direct integrated circuit test socket and the contactor can be reconfigured to provide a pogo block assembly to interface between a main test printed circuit board (PCB) and a daughter card that is dedicated to a specific device handler and/or a specific package type that can be different from the main test PCB. A pogo block is inserted into a thick frame with an alignment plate for contactor use in which a device under test fits into a recess in the frame through an alignment plate to align the device under test to make contact with electrical contacts of the contactor. The frame and guide plate can be removed and a thinner frame coupled to the contactor, which changes its function to a pogo block assembly.
Abstract translation: 接触器将第一配置中的pogo块用作直接集成电路测试插座，并且可以重新配置接触器以提供弹性块组件以在主测试印刷电路板（PCB）和专用于 特定的设备处理器和/或可以与主测试PCB不同的特定封装类型。 弹簧块插入厚框架中，其具有用于接触器使用的对准板，其中被测试装置通过对准板配合到框架中的凹部中，以对准被测设备以与接触器的电触点接触。 框架和引导板可以被移除，并且更薄的框架联接到接触器，其将其功能改变为弹性块组件。
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公开(公告)号：US20240426900A1
公开(公告)日：2024-12-26
申请号：US18214090
申请日：2023-06-26
Applicant: Silicon Laboratories Inc.
Inventor： Wenshui Zhang , Chee Teong Chang , Paul Ashley Nathan
IPC: G01R31/28
Abstract: A device enclosure for a wafer level chip scale package (WLCSP) device that is particularly useful for package qualification testing includes a base for receiving the WLCSP device and a removable cover. The device enclosure allows testing to occur without handling of the device. The base has through holes in a center portion of a bottom of the base to allow electrical contacts of the WLCSP device to be exposed when the WLCSP device is mounted in the device enclosure. The cover attaches to the base with screws and has a plurality of openings to provide ingress of air into the device enclosure. A peripheral of the bottom of the cover is recessed from a center portion of the bottom of the cover and the center portion engages the WLCSP device to secure the WLCSP device in the device enclosure when the base and cover are secured together.
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7.发明授权公开(公告)号：US11460501B1
公开(公告)日：2022-10-04
申请号：US17241164
申请日：2021-04-27
Applicant: Silicon Laboratories Inc.
Inventor： Wenshui Zhang , Wei Jue Lim
Abstract: A test system for high voltage testing of semiconductor devices including at least one test socket and a docking plate assembly. Each test socket includes a socket enclosure for encompassing first and second contact finger assemblies, in which the socket enclosure may include a cover and alignment plate. At least one test socket is embedded within the docking plate assembly which is configured to mount between high voltage test head and a pick and place handler. The docking plate assembly and each test socket includes one or more site openings each for receiving a corresponding device under test (DUT) during a high voltage test procedure. Each contact finger assembly includes at least one contact finger configured as an elongated conductor with a bent tip for electrically interfacing a pad of the DUT.
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公开(公告)号：US09274140B2
公开(公告)日：2016-03-01
申请号：US13771889
申请日：2013-02-20
Applicant: SILICON LABORATORIES INC.
Inventor： Larry R. Rose , Craig N. Gabelmann , Wenshui Zhang
CPC classification number: G01R1/0433
Abstract: A contactor uses a pogo block in a first configuration as a direct integrated circuit test socket and the contactor can be reconfigured to provide a pogo block assembly to interface between a main test printed circuit board (PCB) and a daughter card that is dedicated to a specific device handler and/or a specific package type that can be different from the main test PCB. A pogo block is inserted into a thick frame with an alignment plate for contactor use in which a device under test fits into a recess in the frame through an alignment plate to align the device under test to make contact with electrical contacts of the contactor. The frame and guide plate can be removed and a thinner frame coupled to the contactor, which changes its function to a pogo block assembly.
Abstract translation: 接触器将第一配置中的pogo块用作直接集成电路测试插座，并且可以重新配置接触器以提供弹性块组件以在主测试印刷电路板（PCB）和专用于 特定的设备处理器和/或可以与主测试PCB不同的特定封装类型。 弹簧块插入厚框架中，其具有用于接触器使用的对准板，其中被测试装置通过对准板配合到框架中的凹部中，以对准被测设备以与接触器的电触点接触。 框架和引导板可以被移除，并且更薄的框架联接到接触器，其将其功能改变为弹性块组件。
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