A modular integrated circuit test fixture integrates the integrated circuit (IC) handler to IC test fixture alignment interface (the alignment plate) into a daughter card subassembly, which reduces the overall rejection rate of devices due to alignment errors. The test fixture has a plurality of daughter card subassemblies for receiving integrated circuits for testing. Each daughter card subassembly is independently removable from the test fixture and includes a daughter card for a particular size and type of integrated circuit, a plurality of sockets electrically and mechanically coupled to the daughter card to receive respective integrated circuits for testing, and an alignment plate to provide alignment between an IC handler and respective ones of the daughter card subassemblies and to provide alignment for one or more manual test lids. The manual test lids are removed for automatic testing using an IC handler.