公开(公告)号：US20240426900A1

公开(公告)日：2024-12-26

申请号：US18214090

申请日：2023-06-26

Applicant: Silicon Laboratories Inc.

Inventor： Wenshui Zhang ,  Chee Teong Chang ,  Paul Ashley Nathan

IPC: G01R31/28

Abstract: A device enclosure for a wafer level chip scale package (WLCSP) device that is particularly useful for package qualification testing includes a base for receiving the WLCSP device and a removable cover. The device enclosure allows testing to occur without handling of the device. The base has through holes in a center portion of a bottom of the base to allow electrical contacts of the WLCSP device to be exposed when the WLCSP device is mounted in the device enclosure. The cover attaches to the base with screws and has a plurality of openings to provide ingress of air into the device enclosure. A peripheral of the bottom of the cover is recessed from a center portion of the bottom of the cover and the center portion engages the WLCSP device to secure the WLCSP device in the device enclosure when the base and cover are secured together.