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公开(公告)号：US12107101B2
公开(公告)日：2024-10-01
申请号：US17546740
申请日：2021-12-09
发明人： Kerui Xi , Xuhui Peng , Feng Qin , Tingting Cui , Zhenyu Jia
IPC分类号： H01L27/146 , H01L25/16
CPC分类号： H01L27/14618 , H01L25/167 , H01L27/1462 , H01L27/14627 , H01L27/14636
摘要： The present disclosure provides chip package structure, packaging method, camera module and electronic equipment. The package structure includes chip package module, which includes light-transmitting substrate, wiring layer located on side of light-transmitting substrate and including first metal wire, conductor located on side of wiring layer facing away from light-transmitting substrate, photosensitive chip located on side of wiring layer facing away from the light-transmitting substrate, active chip located on side of wiring layer facing away from light-transmitting substrate, and plastic encapsulation layer encapsulating photosensitive chip and active chip. The conductor includes first end electrically connected to first metal wire, and second end. The photosensitive chip includes pin electrically connected to first metal wire and has photosensitive surface facing towards light-transmitting substrate. The photosensitive surface includes photosensitive region that is not overlapping first metal wire. The active chip includes pin electrically connected to first metal wire.
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公开(公告)号：US11791553B2
公开(公告)日：2023-10-17
申请号：US17425572
申请日：2020-08-24
发明人： Kerui Xi , Xuhui Peng , Feng Qin , Tingting Cui , Qinyi Duan , Qiongqin Mao
CPC分类号： H01Q3/36
摘要： A phase shifter, a fabrication method thereof, and an antenna are provided. The phase shifter includes a first substrate, a second substrate, a ground electrode disposed on a side of the first substrate facing towards the second substrate, a transmission electrode disposed on a side of the second substrate facing towards the first substrate, and liquid crystals filled between the first substrate and the second substrate. In a direction perpendicular to a plane of the second substrate, the transmission electrode overlaps with the ground electrode. The ground electrode is provided with a detection hollow part, and in the direction perpendicular to the plane of the second substrate, at least a part of the detection hollow part does not overlap with the transmission electrode.
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公开(公告)号：US11670852B2
公开(公告)日：2023-06-06
申请号：US17574344
申请日：2022-01-12
发明人： Dengming Lei , Kerui Xi , Zhenyu Jia , Ping Su , Huihui Jiang , Yi Wang , Wei Li , Huan Li , Feng Qin
IPC分类号： H01Q3/36
CPC分类号： H01Q3/36
摘要： A scanning antenna is provided in the present disclosure. The scanning antenna includes a first substrate and a second substrate which are arranged oppositely; a liquid crystal layer between the first substrate and the second substrate; and a feed signal access terminal and a plurality of phase shift units, where the plurality of phase shift units is connected with each other, each phase shift unit is connected to the feed signal access terminal, and electrical lengths between at least two phase shift units and the feed signal access terminal are different. The present disclosure not only realizes one-dimensional wave beam scanning, but also has desirable scanning effect. The bias voltage is not needed to be independently applied to each phase shift unit, which can greatly simplify the bias voltage line configuration and be beneficial for reducing production cost and wiring difficulty.
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4.发明授权公开(公告)号：US11581196B2
公开(公告)日：2023-02-14
申请号：US16913020
申请日：2020-06-26
发明人： Xuhui Peng , Kerui Xi , Tingting Cui , Feng Qin , Jie Zhang
IPC分类号： H01L21/48 , H01L21/56 , H01L23/498 , H01L23/00
摘要： A semiconductor package and a method of forming the semiconductor package are provided. The method includes providing a first substrate, forming a wiring structure containing at least two first wiring layers, disposing a first insulating layer between adjacent two first wiring layers, and patterning the first insulating layer to form a plurality of first through-holes. The adjacent two first wiring layers are electrically connected to each other through the plurality of first through-holes. The method also includes providing at least one semiconductor element each including a plurality of pins. In addition, the method includes disposing the plurality of pins of the each semiconductor element on a side of the wiring structure away from the first substrate. Further, the method includes encapsulating the at least one semiconductor element, and placing a ball on a side of the wiring structure away from the at least one semiconductor element.
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公开(公告)号：US12119559B2
公开(公告)日：2024-10-15
申请号：US17375310
申请日：2021-07-14
发明人： Zhenyu Jia , Kerui Xi , Zhen Liu , Baiquan Lin , Dengming Lei , Feng Qin , Jing Wang , Liping Zhang
CPC分类号： H01Q3/2676 , H01P1/182 , H01P1/184 , H01Q3/36 , H01Q15/147 , H01Q15/148
摘要： Provided are a phase shifter, a preparation method thereof, and an antenna. The phase shifter includes at least one phase shifting unit, and the phase shifting unit includes a microstrip line, a photo-dielectric layer, a ground electrode, and at least one light guiding structure; the microstrip line is located on a side of the photo-dielectric layer, and the ground electrode is located on a side of the photo-dielectric layer facing away from the microstrip line; the light-guiding structure at least partially overlaps the photo-dielectric layer, and the light-guiding structure is configured to guide light into the photo-dielectric layer.
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公开(公告)号：US11984672B2
公开(公告)日：2024-05-14
申请号：US17348842
申请日：2021-06-16
发明人： Linzhi Wang , Kerui Xi , Dengming Lei , Zhenyu Jia
CPC分类号： H01Q9/045 , H01L25/0753 , H01L25/167 , H10K59/00
摘要： Provided are an antenna and a preparation method thereof, a phase shifter, and a communication device. The antenna includes a first electrode, a second electrode, a third electrode, and a photodielectric variable layer. The first electrode and the second electrode are respectively disposed on opposite two sides of the photodielectric variable layer. The first electrode includes a plurality of transmission electrodes, and the plurality of transmission electrodes are configured to transmit an electrical signal. The second electrode is provided with a fixed potential. The third electrode includes a plurality of radiator units, and the plurality of radiator units are configured to send the electrical signal. The antenna further includes at least one light-emitting element configured to emit light irradiated to the photodielectric variable layer to change a dielectric constant of the photodielectric variable layer.
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7.发明授权公开(公告)号：US11334740B2
公开(公告)日：2022-05-17
申请号：US16910840
申请日：2020-06-24
发明人： Kerui Xi , Tingting Cui , Feng Qin , Xuhui Peng , Linzhi Wang
摘要： Fingerprint recognition circuit, fingerprint recognition structure, fingerprint recognition device, display panel, and display device are provided. The circuit includes: a fingerprint recognition driving transistor; a first capacitor; a driving signal input terminal; and a sensing signal output terminal. The first capacitor has a terminal electrically connected to a gate of the fingerprint recognition driving transistor and another terminal electrically connected to a ground. The driving signal input terminal is electrically connected to an input terminal of the fingerprint recognition driving transistor. An output terminal of the fingerprint recognition driving transistor is electrically connected to the sensing signal output terminal.
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公开(公告)号：US10409134B2
公开(公告)日：2019-09-10
申请号：US15782438
申请日：2017-10-12
IPC分类号： G02F1/167 , H01L27/146 , H01L27/15 , G02F1/1676
摘要： An electronic paper display panel, including a first and second substrate; an electrophoresis layer arranged between the first and second substrates, the electrophoresis layer including black electrophoretic particle, white electrophoretic particle and at least one color electrophoretic particle; a first electrode layer arranged at a side of the first substrate facing the second substrate including multiple first electrodes; a second electrode layer arranged at a side of the second substrate facing the first substrate including multiple second electrodes; and a drive circuit; multiple pixel areas correspond multiple second electrodes; each first electrode includes a first sub-electrode and a second sub-electrode placed in same pixel area, which are insulated from each other, correspond to one second electrode and are connected with drive circuit, the first sub-electrode receives voltage signal different from voltage signal the second sub-electrode receives; the first electrode is common electrode and the second electrode is pixel electrode.
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公开(公告)号：US09455277B2
公开(公告)日：2016-09-27
申请号：US14723227
申请日：2015-05-27
发明人： Zhaokeng Cao , Dandan Qin , Tingting Cui , Kerui Xi
IPC分类号： G02F1/133 , H01L27/12 , G02F1/1368 , G02F1/1362 , G02F1/1335
CPC分类号： H01L27/124 , G02F1/13306 , G02F1/133382 , G02F1/133514 , G02F1/136286 , G02F1/1368 , G02F2201/40 , G09G3/20 , G09G2300/0426 , G09G2300/043 , G09G2320/041 , H01L27/1218 , H01L27/1255
摘要： An array substrate includes a substrate, a plurality of gate lines and a plurality of data lines intersecting each other and being insulating from each other, and a plurality of pixel units arranged in an array and surrounded by the intersecting gate lines and data lines. The array substrate also includes at least one temperature measuring unit and at least one gate signal start control line. The temperature measuring unit includes at least one thin film transistor. The array substrate further includes a signal input line, a signal output line, and resistor is arranged on the signal input line. The temperature measuring unit includes a first terminal electrically connected with the signal input line and a second terminal electrically connected with the signal output line.
摘要翻译： 阵列基板包括彼此相交并彼此绝缘的基板，多条栅极线和多条数据线，以及排列成阵列并被相交的栅极线和数据线围绕的多个像素单元。 阵列基板还包括至少一个温度测量单元和至少一个栅极信号起始控制线。 温度测量单元包括至少一个薄膜晶体管。 阵列基板还包括信号输入线，信号输出线和电阻器，布置在信号输入线上。 温度测量单元包括与信号输入线电连接的第一端子和与信号输出线路电连接的第二端子。
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公开(公告)号：US12057324B2
公开(公告)日：2024-08-06
申请号：US18090918
申请日：2022-12-29
发明人： Xuhui Peng , Kerui Xi , Tingting Cui , Feng Qin , Jie Zhang
IPC分类号： H01L21/48 , H01L21/56 , H01L23/00 , H01L23/498
CPC分类号： H01L21/4853 , H01L21/486 , H01L21/4896 , H01L21/561 , H01L23/49816 , H01L23/49822 , H01L24/81 , H01L24/96 , H01L24/97 , H01L2924/37001
摘要： A semiconductor package includes a semiconductor element, a wiring structure, an encapsulation structure, and a solder ball. The semiconductor element includes a plurality of pins. A side of the wiring structure is electrically connected to the plurality of pins of the semiconductor element. The wiring structure includes at least two first wiring layers. A first insulating layer is disposed between adjacent two first wiring layers of the at least two first wiring layers. The first insulating layer includes a plurality of first through-holes. The adjacent two first wiring layers are electrically connected to each other through the plurality of first through-holes. The encapsulation structure at least partially surrounds the semiconductor element. The solder ball is located on a side of the wiring structure away from the semiconductor element. The solder ball is electrically connected to the at least two first wiring layers.
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