公开(公告)号：US20150000792A1

公开(公告)日：2015-01-01

申请号：US14372999

申请日：2013-01-08

Applicant: Senju Metal Industry Co., Ltd.

Inventor： Takao Sugiura ,  Yoko Higashimura ,  Motohiro Onitsuka ,  Hiroshi Kawanago ,  Kaichi Tsuruta

IPC: B23K35/362

CPC classification number: B23K35/362 ,  B23K35/0222 ,  B23K35/0227 ,  B23K35/0266 ,  B23K35/3612 ,  H05K3/3489

Abstract: To provide flux for flux cored solder that allows flux residue to have flexibility and can be used without depending on any soldering method. The flux for flux cored solder contains rosin, high molecular compound that prevents melt viscosity of the flux from being increased and allows a flux residue to have flexibility after heating by soldering, and halide that prevents the melt viscosity of the flux from being increased and by a combination of the high molecular compound that allows the flux residue to have flexibility after the heating by the soldering, allows the flux to cover a surface of solder melted during the heating by the soldering.

Abstract translation: 为助焊剂助焊剂提供助焊剂，使助焊剂残留物具有柔韧性，并可在不依赖任何焊接方法的情况下使用。 助焊剂焊料焊剂含有松香，高分子化合物，防止焊剂的熔融粘度增加，并允许助焊剂残留物通过焊接加热后具有柔性，并且防止焊剂熔体粘度增加的卤化物和由 在通过焊接加热后允许助焊剂残留物具有柔性的高分子化合物的组合允许焊剂覆盖通过焊接在加热期间熔化的焊料的表面。

公开(公告)号：US11344976B2

公开(公告)日：2022-05-31

申请号：US16766259

申请日：2018-11-21

Applicant: SENJU METAL INDUSTRY CO., LTD.

Inventor： Hiroyoshi Kawasaki ,  Hiroki Sudo ,  Takahiro Roppongi ,  Hiroshi Okada ,  Daisuke Soma ,  Takashi Akagawa ,  Hiroshi Takahashi ,  Hiroshi Kawanago ,  Satoshi Yokota ,  Osamu Munekata

IPC: B23K35/26 ,  B23K35/02 ,  C22C13/00 ,  C22C13/02 ,  B22F1/00 ,  H05K3/34

Abstract: The present invention provides a solder material containing Sn or a Sn-containing alloy and 40 to 320 ppm by mass of A, the solder material including an As-enriched layer.

公开(公告)号：US20200376607A1

公开(公告)日：2020-12-03

申请号：US16766259

申请日：2018-11-21

Applicant: SENJU METAL INDUSTRY CO., LTD.,

Inventor： Hiroyoshi Kawasaki ,  Hiroki Sudo ,  Takahiro Roppongi ,  Hiroshi Okada ,  Daisuke Soma ,  Takashi Akagawa ,  Hiroshi Takahashi ,  Hiroshi Kawanago ,  Satoshi Yokota ,  Osamu Munekata

IPC: B23K35/26 ,  B23K35/02 ,  C22C13/00

Abstract: The present invention provides a solder material containing Sn or a Sn-containing alloy and 40 to 320 ppm by mass of A, the solder material including an As-enriched layer.

公开(公告)号：US10265808B2

公开(公告)日：2019-04-23

申请号：US14971072

申请日：2015-12-16

Applicant: Senju Metal Industry Co., Ltd.

Inventor： Motohiro Onitsuka ,  Yoko Kurasawa ,  Toshihisa Kugi ,  Hiroshi Kawanago ,  Kaichi Tsuruta

IPC: B23K35/36 ,  B23K35/362 ,  B23K35/02 ,  H05K3/34

Abstract: A flux for a resin flux cored solder contains 30% or more by mass but 80% or less by mass rosin ester and 5% or more by mass but 15% or less by mass activator. The total content ratio of base materials including the rosin ester is preferably equal to or more than 85% by mass but equal to or less than 95% by mass.

公开(公告)号：US20160184937A1

公开(公告)日：2016-06-30

申请号：US14971072

申请日：2015-12-16

Applicant: Senju Metal Industry Co., Ltd.

Inventor： Motohiro Onitsuka ,  Yoko Kurasawa ,  Toshihisa Kugi ,  Hiroshi Kawanago ,  Kaichi Tsuruta

IPC: B23K35/36 ,  B23K35/02 ,  B23K35/362

CPC classification number: B23K35/3612 ,  B23K35/0227 ,  B23K35/0261 ,  B23K35/0266 ,  B23K35/3613 ,  B23K35/362 ,  H05K3/3478 ,  H05K3/3489 ,  H05K2203/0405

Abstract: A flux for a resin flux cored solder contains 30% or more by mass but 80% or less by mass rosin ester and 5% or more by mass but 15% or less by mass activator. The total content ratio of base materials including the rosin ester is preferably equal to or more than 85% by mass but equal to or less than 95% by mass.

Abstract translation: 用于树脂药芯焊剂的助熔剂含有质量分数为30质量％以上且80质量％以下的松香酯，5质量％以上，15质量％以下的活化剂。 包含松香酯的基材的总含量比优选为85质量％以上且95质量％以下。