公开(公告)号：US20050158979A1

公开(公告)日：2005-07-21

申请号：US10864917

申请日：2004-06-09

申请人： Seiji Momota ,  Eiji Mochizuki

发明人： Seiji Momota ,  Eiji Mochizuki

IPC分类号： H01L21/288 ,  H01L21/3205 ,  H01L21/329 ,  H01L23/52 ,  H01L29/06 ,  H01L29/417 ,  H01L29/861 ,  H01L21/76 ,  H01L21/44

CPC分类号： H01L29/66136 ,  H01L29/417 ,  H01L29/861 ,  H01L2924/0002 ,  Y10S438/928 ,  H01L2924/00

摘要： A method of manufacturing a semiconductor device is disclosed in which a metallic deposit is stably formed on the anode side with small variation in film thickness, and plating is prevented on the cathode side without carrying out any additional processing on the cathode side. The processed anode side causes no interference in subsequent processing. Insulator films are used to cover a scribe line, as well as a field plate or an open electrode provided on a surface of a silicon substrate before Ni electroless plating of an aluminum electrode is performed to form a metallic deposit on the electrode.

摘要翻译： 公开了一种制造半导体器件的方法，其中在阳极侧稳定地形成金属沉积物，薄膜的厚度变化小，并且在阴极侧不会对阴极侧进行任何额外的处理来防止电镀。 经处理的阳极侧在后续处理中不产生干扰。 在进行铝电极的Ni化学镀以在电极上形成金属沉积物之前，使用绝缘膜覆盖划线，以及设置在硅衬底的表面上的场板或开放电极。

公开(公告)号：US08026566B2

公开(公告)日：2011-09-27

申请号：US12149115

申请日：2008-04-28

申请人： Masafumi Horio ,  Yoshinari Ikeda ,  Eiji Mochizuki

发明人： Masafumi Horio ,  Yoshinari Ikeda ,  Eiji Mochizuki

IPC分类号： H01L23/485 ,  H01L21/60

CPC分类号： H01L23/3735 ,  H01L23/142 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00

摘要： A semiconductor device includes a first metal foil, an insulating sheet mounted on an upper surface of the first metal foil main, at least one second metal foil mounted on the insulating sheet, at least one solder layer mounted on the at least one second metal foil, and at least one semiconductor element mounted on the at least one second metal foil through the at least one solder layer. The at least one semiconductor has a thickness of 50 μm or greater and less than 100 μm.

摘要翻译： 半导体器件包括第一金属箔，安装在第一金属箔主体的上表面上的绝缘片，安装在绝缘片上的至少一个第二金属箔，安装在至少一个第二金属箔上的至少一个焊料层 以及通过所述至少一个焊料层安装在所述至少一个第二金属箔上的至少一个半导体元件。 所述至少一个半导体具有50μm以上且小于100μm的厚度。

公开(公告)号：US20090121442A1

公开(公告)日：2009-05-14

申请号：US12094453

申请日：2006-11-27

申请人： Yasufumi Uozumi ,  Eiji Mochizuki

发明人： Yasufumi Uozumi ,  Eiji Mochizuki

IPC分类号： F16J15/34 ,  B26F1/40 ,  F02M61/16

CPC分类号： B21D53/20 ,  F02M47/027 ,  F02M55/005 ,  F02M61/168 ,  F02M2200/8053 ,  F02M2200/8061 ,  F02M2200/8069 ,  F02M2547/003 ,  Y10T83/0481

摘要： To provide: a method of manufacturing a ring-shaped member that can efficiently manufacture a stronger backup ring that reinforces a seal member disposed in a pressure introduction chamber of a fuel injection valve; the backup ring; and a seal structure for a fuel injection valve disposed with the backup ring.A method of manufacturing a ring-shaped member that is manufactured by subjecting a rigid flat-shaped base material to burring includes: a step of forming a prepared hole with respect to the base material; a step of pressing an edge portion of the prepared hole to thereby bend the edge portion using a first punch member that has a diameter that is larger than the diameter of the prepared hole and is tapered towards its distal end portion; and a step of forming a flange portion by press-inserting, with respect to the prepared hole whose edge portion has been bent, a second punch member that has a diameter that is smaller than the diameter of the first punch member and is tapered towards its distal end portion.

摘要翻译： 提供一种制造环形构件的方法，所述环形构件可以有效地制造强化用于加强设置在燃料喷射阀的压力导入室中的密封构件的较强的支撑环; 备用环; 以及配置有备用环的燃料喷射阀的密封结构。 通过对刚性扁平状基材进行毛边加工而制造的环状构件的制造方法包括：相对于基材形成预定孔的工序; 使用直径比准备好的孔的直径大的第一冲头构件使其朝向其前端部逐渐变细的步骤，从而使边缘部分弯曲， 以及通过相对于其边缘部分已被弯曲的预制孔而通过压入而形成凸缘部的步骤，第二冲头构件的直径小于第一冲头构件的直径，并且朝向其逐渐变细 远端部分。

公开(公告)号：US20080225363A1

公开(公告)日：2008-09-18

申请号：US12048694

申请日：2008-03-14

申请人： Tetsurou SAITOH ,  Eiji Mochizuki ,  Yukito Sato ,  Yoshiaki Yasuda ,  Masahiro Akamatsu ,  Masanao Tani

发明人： Tetsurou SAITOH ,  Eiji Mochizuki ,  Yukito Sato ,  Yoshiaki Yasuda ,  Masahiro Akamatsu ,  Masanao Tani

IPC分类号： G02B26/10

CPC分类号： G02B26/0858

摘要： An optical deflector includes a plurality of piezoelectric unimorph oscillating bodies (210a to 210d) that cause a reflecting plate (1) to oscillate rotationally, centering upon a pair of flexible support units (2a and 2b). The optical deflector forms a single structure of the oscillating plates (23a to 23b), the reflecting plate (1), the flexible support units (2a and 2b), and a support body (9), by connecting one set of the terminals of the oscillating plates (23a to 23d) of the suite of piezoelectric unimorph oscillating bodies (210a to 210d) to the flexible support units (2a and 2b), and connecting the other set of terminals to the support body (9). Furthermore, the plurality of piezoelectric unimorph oscillating bodies (210a to 210d) each respectively comprise a plurality of parallel oscillating bodies (23a1 to 23a-3, 23b-1 to 23b-3, 23c-1 to 23c-3), and (23d-1 to 23d-3), and a suite of parallel actuators (28a-1 to 28a-3, 28c-1 to 28c-3, and 28d-1 to 28d-3).

摘要翻译： 光学偏转器包括使得反射板（1）以一对柔性支撑单元（2a和2b）为中心旋转地摆动的多个压电单晶振荡体（210a至210d）。 光学偏转器通过连接一组振动板（23a至23b），反射板（1），柔性支撑单元（2a和2b）和支撑体（9）形成单一结构 将压电单晶振荡体（210a至210d）的振动板（23a至23d）的端子连接到柔性支撑单元（2a和2b），并将另一组端子连接到 支撑体（9）。 此外，多个压电单晶体振荡体（210a〜210d）各自分别包括多个平行的振荡体（23a，1〜23a-3,23b-1〜23b-3,23c-1〜 23c-3）和（23d-1至23d-3）以及一组平行致动器（28a-1至28a-3,28c-1至28c-3和28d- 1〜28d-3）。

公开(公告)号：US06485126B1

公开(公告)日：2002-11-26

申请号：US09632046

申请日：2000-08-03

申请人： Seiichi Kato ,  Kouichi Ohtaka ,  Makoto Tanaka ,  Eiji Mochizuki

发明人： Seiichi Kato ,  Kouichi Ohtaka ,  Makoto Tanaka ,  Eiji Mochizuki

IPC分类号： B41J204

CPC分类号： B41J2/1635 ,  B41J2/14314 ,  B41J2/16 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1642 ,  B41J2002/14411

摘要： An ink jet head that can be easily connected to an external circuit is provided without an increase in the number of production procedures. Diaphragms and a diaphragm external electrode having the same thickness as the diaphragms are formed on a silicon substrate that is a first substrate located on the same plane as the diaphragms. The diaphragm external electrode is located within 2 &mgr;m from the individual external electrodes of a plurality of electrodes on a second substrate.

摘要翻译： 提供可以容易地连接到外部电路的喷墨头，而不增加制造程序的数量。 在作为与隔膜相同的平面上的第一基板的硅基板上形成具有与隔膜相同厚度的隔膜和隔膜外部电极。 隔膜外部电极位于第二基板上的多个电极的各个外部电极的2μm以内。

公开(公告)号：US08373916B2

公开(公告)日：2013-02-12

申请号：US12722980

申请日：2010-03-12

申请人： Mitsumi Fujii ,  Tetsurou Saitoh ,  Eiji Mochizuki ,  Kohki Sasaki

发明人： Mitsumi Fujii ,  Tetsurou Saitoh ,  Eiji Mochizuki ,  Kohki Sasaki

IPC分类号： G02B26/08

CPC分类号： G02B26/0858 ,  G02B26/105

摘要： An optical scanner, including a frame member; a pair of connection members near a coupling end with the frame member; a pair of elastic members connected with the frame member by the connection members; a mirror substrate supported by the pair of elastic members, the mirror substrate having a bending rigidity outward from the rotational axis for each area in accordance with a bending moment caused by oscillation, the mirror substrate having a slit at both connection ends with the pair of elastic members; and a piezoelectric element provided on each of the connection members, the piezoelectric element generating a torque for driving the mirror substrate oscillatable back and forth around the pair of elastic members as a torsion rotational axis.

摘要翻译： 一种光学扫描器，包括框架构件; 在与所述框架构件的联接端附近的一对连接构件; 一对弹性构件，通过连接构件与框架构件连接; 由所述一对弹性构件支撑的镜面基板，所述反射镜基板根据由振动引起的弯曲力矩从所述旋转轴向外侧具有弯曲刚度，所述镜面基板在两个连接端具有所述一对狭缝 弹性构件; 以及设置在每个连接构件上的压电元件，所述压电元件产生用于驱动所述反射镜基板的扭矩，所述扭矩可围绕所述一对弹性构件来回摆动，作为扭转旋转轴线。

公开(公告)号：US07985630B2

公开(公告)日：2011-07-26

申请号：US12926304

申请日：2010-11-09

申请人： Masafumi Horio ,  Tatsuo Nishizawa ,  Eiji Mochizuki ,  Rikihiro Maruyama

发明人： Masafumi Horio ,  Tatsuo Nishizawa ,  Eiji Mochizuki ,  Rikihiro Maruyama

IPC分类号： H01L21/00

CPC分类号： H01L25/072 ,  H01L23/3121 ,  H01L2224/32225 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/3511 ,  H01L2924/00

摘要： A method for manufacturing a semiconductor module, includes the steps of preparing a board; mounting a semiconductor device on the second metal foil; placing a resin case onto the board for surrounding a first metal foil, an insulating sheet, the second metal foil, and the semiconductor device; pouring a resin in a paste form into the case to fill a space relative to the first metal foil, insulating sheet, the second metal foil and the semiconductor device; and heat-curing the resin. A bottom end of a peripheral wall of the case is located above a bottom surface of the first metal. The bottom surface of the first metal foil and the resin form a flat bottom surface to contact an external mounting member.

公开(公告)号：US07902653B2

公开(公告)日：2011-03-08

申请号：US12149114

申请日：2008-04-28

申请人： Masafumi Horio ,  Tatsuo Nishizawa ,  Eiji Mochizuki ,  Rikihiro Maruyama

发明人： Masafumi Horio ,  Tatsuo Nishizawa ,  Eiji Mochizuki ,  Rikihiro Maruyama

IPC分类号： H01L23/06

CPC分类号： H01L25/072 ,  H01L23/3121 ,  H01L2224/32225 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/3511 ,  H01L2924/00

摘要： A semiconductor module includes a first metal foil; an insulating sheet mounted on a top surface of the first metal foil; at least one second metal foil mounted on a top surface of the insulating sheet; at least one semiconductor device mounted on the second metal foil; and a resin case for surrounding the first metal foil, insulating sheet, second metal foil, and semiconductor device. A bottom end of a peripheral wall of the resin case is located above a bottom surface of the first metal foil. A resin is provided inside the resin case to fill the inside of the resin case. The bottom surface of the first metal foil and the resin form a flat bottom surface so that the flat bottom surface contacts an external mounting member.

摘要翻译： 半导体模块包括第一金属箔; 安装在所述第一金属箔的顶表面上的绝缘片; 安装在所述绝缘片的顶表面上的至少一个第二金属箔; 安装在所述第二金属箔上的至少一个半导体器件; 以及用于围绕第一金属箔，绝缘片，第二金属箔和半导体器件的树脂壳体。 树脂壳体的周壁的底端位于第一金属箔的底面的上方。 在树脂壳体的内部设置树脂以填充树脂壳体的内部。 第一金属箔的底面和树脂形成平坦的底面，使得平坦的底面接触外部安装构件。

公开(公告)号：US20100232833A1

公开(公告)日：2010-09-16

申请号：US12722980

申请日：2010-03-12

申请人： Mitsumi Fujii ,  Tetsurou Saitoh ,  Eiji Mochizuki ,  Kohki Sasaki

发明人： Mitsumi Fujii ,  Tetsurou Saitoh ,  Eiji Mochizuki ,  Kohki Sasaki

IPC分类号： G03G15/22 ,  G02B26/08

CPC分类号： G02B26/0858 ,  G02B26/105

摘要： An optical scanner, including a frame member; a pair of connection members near a coupling end with the frame member; a pair of elastic members connected with the frame member by the connection members; a mirror substrate supported by the pair of elastic members, the mirror substrate having a bending rigidity outward from the rotational axis for each area in accordance with a bending moment caused by oscillation, the mirror substrate having a slit at both connection ends with the pair of elastic members; and a piezoelectric element provided on each of the connection members, the piezoelectric element generating a torque for driving the mirror substrate oscillatable back and forth around the pair of elastic members as a torsion rotational axis.

摘要翻译： 一种光学扫描器，包括框架构件; 在与所述框架构件的联接端附近的一对连接构件; 一对弹性构件，通过连接构件与框架构件连接; 由所述一对弹性构件支撑的镜面基板，所述反射镜基板根据由振动引起的弯曲力矩从所述旋转轴向外侧具有弯曲刚度，所述镜面基板在两个连接端具有所述一对狭缝 弹性构件; 以及设置在每个连接构件上的压电元件，所述压电元件产生用于驱动所述反射镜基板的扭矩，所述扭矩可围绕所述一对弹性构件来回摆动，作为扭转旋转轴线。

公开(公告)号：US07551339B2

公开(公告)日：2009-06-23

申请号：US11877800

申请日：2007-10-24

申请人： Eiji Mochizuki

发明人： Eiji Mochizuki

IPC分类号： G02B26/08

CPC分类号： G02B26/0858 ,  G02B26/0841 ,  G02B26/105

摘要： An optical scanning apparatus includes a vibration mirror having a mirror surface that reflects an optical beam. A pair of torsion beams swingably support the mirror. The mirror is vibrated in a sealed space whose pressure is adjusted such that a characteristic of the mirror falls within a predetermined range.

摘要翻译： 光学扫描装置包括具有反射光束的镜面的振动镜。 一对扭转梁可摆动地支撑镜子。 镜子在密封空间中振动，其压力被调节使得镜子的特性落在预定范围内。