公开(公告)号：US20130026212A1

公开(公告)日：2013-01-31

申请号：US13543576

申请日：2012-07-06

申请人： Samuel Waising Tam ,  Bryan Sik Pong Lee ,  Tak Shing Pang

发明人： Samuel Waising Tam ,  Bryan Sik Pong Lee ,  Tak Shing Pang

IPC分类号： H05K13/04

CPC分类号： H01L24/11 ,  H01L21/6836 ,  H01L24/13 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2221/68327 ,  H01L2224/11003 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11849 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/3012 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75253 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/83104 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2924/014 ,  H01L2924/00

摘要： A manufacturing technique includes creating stud bumps on the electrical contacts on a die, either in wafer or die form. A separate stencil or carrier is provided with cavities that correspond to the electrical contacts on the die. The cavities are filled with solder paste and the die is brought into close proximity with the stencil so that the stud bumps extend into the cavities and come into contact with the solder paste. When the die is removed, the solder paste stays affixed to the stud bumps and thereby the solder paste is transferred and delivered to the stud bumps. The die can then be affixed to a substrate such as a PCB.

摘要翻译： 一种制造技术包括在晶片或模具形式的模具上的电触点上形成凸块凸块。 单独的模板或载体上设置有与模具上的电触点相对应的空腔。 这些空腔填充有焊膏，并且模具与模板紧密接近，使得凸块凸起延伸到空腔中并与焊膏接触。 当去除模具时，焊膏保持固定到柱形凸块上，由此焊膏被传送并传递到凸块凸块。 然后可以将模具固定到诸如PCB的基板。