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    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
    1.
    发明申请
    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE 有权

    公开(公告)号：US20250006698A1

    公开(公告)日：2025-01-02

    申请号：US18884252

    申请日：2024-09-13

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Chulwoo KIM

    IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

    Abstract: A semiconductor package includes a package substrate, an interposer on the package substrate, semiconductor devices in individual mounting regions on a first surface of the interposer, respectively, first conductive connection members, and a molding member on the interposer. The interposer has first bonding pads in the individual mounting regions, respectively. The semiconductor devices each have chip pads electrically connected to the first bonding pads. The first conductive connection members are between the first bonding pads and the chip pads. The molding member covers the semiconductor devices and fills gaps between the first surface of the interposer and the semiconductor devices. At least one of the individual mounting regions includes a pad-free region with a cross shape and pad regions defined by the pad-free region, and the first bonding pads are in the pad regions.

    SEMICONDUCTOR DEVICE
    4.
    发明公开
    SEMICONDUCTOR DEVICE 审中-公开

    公开(公告)号：US20230344417A1

    公开(公告)日：2023-10-26

    申请号：US18087439

    申请日：2022-12-22

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Kwanyeob CHAE ,  Chulwoo KIM ,  Yoonjae CHOI ,  Kyeongkeun KANG

    IPC: H03K17/687 ,  H03K3/012

    CPC classification number: H03K3/012 ,  H03K17/6872

    Abstract: A semiconductor device is provided. The semiconductor device includes: an equalizer circuit configured to output a first control signal corresponding to a first bit of original two-bit data and a second control signal corresponding to a second bit of the original two-bit data; and a driver circuit including a plurality of pull-up transistors connected between an output node and a first power node configured to provide a first power supply voltage, and a plurality of pull-down transistors connected between the output node and a second power node configured to provide a second power supply voltage, wherein the second power supply voltage is lower than the first power supply voltage, and the driver circuit is connected to the equalizer circuit in series. The plurality of pull-up transistors includes a first pull-up transistor and a second pull-up transistor connected to each other in parallel, between the first power node and the output node, and a third pull-up transistor and a fourth pull-up transistor connected to each other in series, between the first power node and the output node.

    ELECTRONIC DEVICE FOR INPUTTING CHARACTERS AND METHOD OF OPERATION OF SAME
    5.
    发明申请
    ELECTRONIC DEVICE FOR INPUTTING CHARACTERS AND METHOD OF OPERATION OF SAME 有权

    公开(公告)号：US20210374342A1

    公开(公告)日：2021-12-02

    申请号：US17048321

    申请日：2019-04-10

    Applicant: Samsung Electronics Co.,. Ltd.

    Inventor： Chulwoo KIM

    IPC: G06F40/274 ,  G06F3/0488

    Abstract: Various embodiments of the present invention relate to an electronic device for inputting characters and a method of operation of same. At this time, the electronic device comprises a display, at least one processor, and a memory operatively connected to the processor, wherein the memory may store instructions that, when executed, cause the at least one processor to: detect at least one input word; determine a priority of a plurality of categories for a content on the basis of the at least one input word; determine at least one recommendation category on the basis of the determined priority of the plurality of categories; and control the display so as to display at least one content corresponding to the at least one determined recommendation category as at least one recommendation content for the at least one input word. Other embodiments may also be possible.

    MOLD
    6.
    发明申请
    MOLD 有权

    公开(公告)号：US20220305711A1

    公开(公告)日：2022-09-29

    申请号：US17838905

    申请日：2022-06-13

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Changhwan PARK ,  Jiyoon KIM ,  Chulwoo KIM ,  Gyoochul LEE ,  Hyeonseop LEE

    IPC: B29C45/40 ,  B29C45/17

    Abstract: A mold includes a core in which a molded product is formed, the core comprises a cored body and a sliding core on the core body, separable from the core body in a first direction with respect to the core body, and an ejector to press the sliding core in the first direction to separate the molded product formed in the core from the core. The ejector includes a driver positioned below the core and movable toward a lower surface of the core in the first direction or away from the lower surface of the core in a direction opposite to the first direction, and a rod movable in the first direction to press the sliding core to be separated from the driver or movable in the direction opposite to the first direction to couple the sliding core with the driver, and the rod is movable further in the first direction than the driver.

    METHOD AND APPARATUS FOR DISPLAYING KEYPAD IN TERMINAL HAVING TOUCH SCREEN
    7.
    发明申请
    METHOD AND APPARATUS FOR DISPLAYING KEYPAD IN TERMINAL HAVING TOUCH SCREEN 有权
    用于在具有触摸屏的终端中显示键盘的方法和装置

    公开(公告)号：US20130179845A1

    公开(公告)日：2013-07-11

    申请号：US13707926

    申请日：2012-12-07

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Ilgeun BOK ,  Chulwoo KIM ,  Seungah OH

    IPC: G06F3/0488

    CPC classification number: G06F3/04883 ,  G06F3/04886

    Abstract: A method and an apparatus thereof display a key pad and solve the trouble and difficulty of a user in selecting the key pad displayed in a terminal having a touch screen. The method detects a touch gesture with respect to the touch screen; determines whether the detects touch gesture is zoom-out; displays thumbnails representing key pads, respectively, when the detected touch gesture is the zoom-out; and displays a key pad of a selected thumbnail when one of the displayed thumbnails is selected by a user.

    Abstract translation: 一种方法及其装置显示键盘，解决用户选择显示在具有触摸屏的终端中的键盘的麻烦和困难。 该方法检测相对于触摸屏的触摸手势; 确定检测到的触摸手势是否缩小; 当检测到的触摸手势是缩小时，分别显示代表键盘的缩略图; 并且当用户选择所显示的缩略图之一时，显示所选缩略图的键盘。

    TIME DOMAIN ANALOG-TO-DIGITAL CONVERTER AND ANALOG-TO-DIGITAL CONVERTING METHOD
    8.
    发明公开
    TIME DOMAIN ANALOG-TO-DIGITAL CONVERTER AND ANALOG-TO-DIGITAL CONVERTING METHOD 审中-公开

    公开(公告)号：US20240178857A1

    公开(公告)日：2024-05-30

    申请号：US18335572

    申请日：2023-06-15

    Applicant: Samsung Electronics Co., Ltd ,  Korea University Research and Business Foundation

    Inventor： Jihwan HYUN ,  Chulwoo KIM ,  Sooho PARK ,  Junghwan CHOI

    IPC: H03M1/38 ,  H03M1/12

    CPC classification number: H03M1/38 ,  H03M1/1245

    Abstract: In analog-to-digital conversion, a plurality of stages configured in a sequence to sequentially decide a plurality of bits in successive-approximation, each of the plurality of stages configured to operate in response to a corresponding clock among a plurality of clocks, and decide a corresponding bit among the plurality of bits from a corresponding positive pulse among a plurality of positive pulses and a corresponding negative pulse among a plurality of negative pulses; and a plurality of clock generating circuits respectively corresponding to a plurality of first stages among the plurality of stages, each of the plurality of clock generating circuit configured to generate the corresponding clock of a corresponding stage among the plurality of first stages based on an operation of a previous stage among the plurality of stages, the previous stage being before the corresponding stage in the sequence.

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
    10.
    发明申请
    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE 有权

    公开(公告)号：US20220359466A1

    公开(公告)日：2022-11-10

    申请号：US17536547

    申请日：2021-11-29

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Chulwoo KIM

    IPC: H01L25/065 ,  H01L23/00 ,  H01L23/498 ,  H01L23/31

    Abstract: A semiconductor package includes a package substrate, an interposer on the package substrate, semiconductor devices in individual mounting regions on a first surface of the interposer, respectively, first conductive connection members, and a molding member on the interposer. The interposer has first bonding pads in the individual mounting regions, respectively. The semiconductor devices each have chip pads electrically connected to the first bonding pads. The first conductive connection members are between the first bonding pads and the chip pads. The molding member covers the semiconductor devices and fills gaps between the first surface of the interposer and the semiconductor devices. At least one of the individual mounting regions includes a pad-free region with a cross shape and pad regions defined by the pad-free region, and the first bonding pads are in the pad regions.

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