公开(公告)号：US20230120252A1

公开(公告)日：2023-04-20

申请号：US17735158

申请日：2022-05-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： TAE HWAN KIM ,  HYUNG GIL BAEK ,  YOUNG-JA KIM ,  KANG GYUNE LEE ,  SANG-WON LEE ,  YONG KWAN LEE

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/498

Abstract: A semiconductor package may include; a first substrate, a first semiconductor chip disposed on the first substrate, an interposer disposed on the first semiconductor chip, a connecter spaced apart from the first semiconductor chip in a first horizontal direction and extending between the first substrate and the interposer, wherein the connecter directly electrically connects the first substrate and the interposer, a capacitor disposed between the connecter and the first semiconductor chip, and a guide pattern including a first guide portion and an opposing second guide portion spaced apart in the first horizontal direction, wherein the first guide portion is disposed between the connecter and the capacitor, the second guide portion is disposed between the capacitor and the first semiconductor chip, and at least part of the capacitor is inserted between the first guide portion and the second guide portion.

公开(公告)号：US20240321622A1

公开(公告)日：2024-09-26

申请号：US18474455

申请日：2023-09-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YOUNG-JA KIM

IPC: H01L21/683 ,  H01L21/60

CPC classification number: H01L21/6838 ,  H01L21/60 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562

Abstract: An adsorption device for a reflow process according to an embodiment is coupled to a semiconductor package to form a reflow assembly in a reflow process. The semiconductor package includes a substrate and a semiconductor chip disposed at one surface of the substrate. The adsorption device for the reflow process includes a main body and a pressure control member. The main body includes an inner space portion and includes a bottom portion and a substrate adsorption portion that protrudes from the bottom portion to be adhered to the one surface of the substrate in an outer region of the semiconductor chip by a negative pressure. The pressure control member maintains a pressure of the inner space portion.

公开(公告)号：US20250038156A1

公开(公告)日：2025-01-30

申请号：US18442252

申请日：2024-02-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YOUNG-JA KIM ,  SUNWON KANG ,  MI-NA CHOI

IPC: H01L25/10 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367 ,  H01L23/373 ,  H01L23/498

Abstract: A semiconductor package includes a first substrate. A second substrate is spaced apart from the first substrate. A semiconductor chip is between the first substrate and the second substrate. The semiconductor chip is electrically connected to the second substrate. A molding layer surrounds the semiconductor chip. A plate directly contacts a bottom surface of the semiconductor chip. A heat transfer structure connects the plate and the first substrate to each other.

公开(公告)号：US20230187285A1

公开(公告)日：2023-06-15

申请号：US17883250

申请日：2022-08-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： SANG-WON LEE ,  HYUNKI KIM ,  YOUNG-JA KIM ,  HYUNGGIL BAEK

IPC: H01L21/66 ,  H01L23/00

CPC classification number: H01L22/12 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/75621 ,  H01L2224/75001 ,  H01L2224/81194 ,  H01L2224/8118

Abstract: A method of manufacturing a semiconductor package includes estimating an error in a solder ball attaching process, determining a specification of a ball tool and a method of the solder ball attaching process, based on the estimated error, manufacturing the ball tool according to the determined specification thereof, and performing the solder ball attaching process based on the method of the solder ball attaching process. The determining of the specification of the ball tool and the method of the solder ball attaching process includes determining a number of a plurality of holders in the ball tool and a position and a width of each of the plurality of holders, determining a number of a plurality of working regions of a substrate and a position and a width of each of the plurality of working regions, and dividing a substrate into the plurality of working regions.