公开(公告)号：US20250029864A1

公开(公告)日：2025-01-23

申请号：US18439884

申请日：2024-02-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： KANG GYUNE LEE ,  SANG-WON LEE ,  HYEON HWANG ,  Younhwan SHIN

IPC: H01L21/683 ,  H01L21/67 ,  H01L21/687

Abstract: A chuck table includes a support part receiving a package substrate. The package substrate includes a package area having semiconductor packages arranged thereon and a scrap area surrounding the package area. A package pad part is between the support part and the package substrate and directly contacts the package area. A scrap pad part is disposed between the support part and the package substrate and directly contacts the scrap area. A vacuum pipe extends through the package pad part and extends into the support part. The vacuum pipe has vacuum pressure applied thereto and has the vacuum pressure released therefrom. A fixing device is connected to the vacuum pipe. The fixing device moves closer to an upper surface of the scrap area as the vacuum pressure is applied to the vacuum pipe, and moves away from the upper surface of the scrap area as the vacuum pressure is released.

公开(公告)号：US20230120252A1

公开(公告)日：2023-04-20

申请号：US17735158

申请日：2022-05-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： TAE HWAN KIM ,  HYUNG GIL BAEK ,  YOUNG-JA KIM ,  KANG GYUNE LEE ,  SANG-WON LEE ,  YONG KWAN LEE

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/498

Abstract: A semiconductor package may include; a first substrate, a first semiconductor chip disposed on the first substrate, an interposer disposed on the first semiconductor chip, a connecter spaced apart from the first semiconductor chip in a first horizontal direction and extending between the first substrate and the interposer, wherein the connecter directly electrically connects the first substrate and the interposer, a capacitor disposed between the connecter and the first semiconductor chip, and a guide pattern including a first guide portion and an opposing second guide portion spaced apart in the first horizontal direction, wherein the first guide portion is disposed between the connecter and the capacitor, the second guide portion is disposed between the capacitor and the first semiconductor chip, and at least part of the capacitor is inserted between the first guide portion and the second guide portion.