公开(公告)号：US20240054806A1

公开(公告)日：2024-02-15

申请号：US18134360

申请日：2023-04-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Woojae KIM

IPC: G06V40/13 ,  G06F3/041 ,  G06F3/044 ,  G06K19/07

CPC classification number: G06V40/1306 ,  G06V40/1329 ,  G06F3/04164 ,  G06F3/0445 ,  G06F3/0446 ,  G06K19/0718 ,  G06F2203/04103

Abstract: A fingerprint sensor package includes a first substrate including a core insulating layer including first and second surfaces opposing each other and having a through-hole penetrating through the first surface and the second surface, a first bonding pad along a circumference of the through-hole on the first or second surface, and an external connection pad on an edge of the second surface, a second substrate having a third surface including a sensing region and a peripheral region surrounding the sensing region, and a fourth surface opposing the third surface, the second substrate including a second bonding pad along an edge of the third or fourth surface and bonded to the first bonding pad, and covering the through-hole, a controller chip on the fourth surface, and a molded layer on the second surface of the core insulating layer, covering the controller chip, and spaced apart from the external connection pad.

公开(公告)号：US20250166277A1

公开(公告)日：2025-05-22

申请号：US19033942

申请日：2025-01-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Woojae KIM ,  Byeongwook YOO ,  Gunill LEE ,  Wonwoo LEE ,  Jiwon JEONG

IPC: G06T15/04 ,  G06T5/70 ,  G06T7/90

Abstract: An electronic device for providing an avatar is provided. The electronic device includes memory storing one or more computer programs, and one or more processors communicatively coupled to the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the electronic device to obtain a plurality of raw textures by matching a three-dimensional (3D) shape related to a user face to a two-dimensional (2D) plane, perform tone-matching for smoothing each of skin tones of the plurality of raw textures based on an average of the skin tones of the plurality of raw textures, obtain a plurality of texture segments by splitting at least one of a plurality of tone-matched raw textures for each feature area in a face, obtain a combined texture by combining a plurality of texture segments selected by a user input from among the obtained plurality of texture segments, and obtain an avatar representing the user face in a 3D shape based on the combined texture.

公开(公告)号：US20220375812A1

公开(公告)日：2022-11-24

申请号：US17551710

申请日：2021-12-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Woojae KIM

IPC: H01L23/367 ,  H01L23/433 ,  H01L23/00

Abstract: A semiconductor package includes a package substrate, a semiconductor chip on the package substrate, a heat dissipation structure on the package substrate, the heat dissipation structure including a center portion and an edge portion, a dam structure on a bottom surface of the center portion of the heat dissipation structure, the dam structure on a top surface of the semiconductor chip, and a heat conductive layer between the center portion of the heat dissipation structure and the semiconductor chip. A top surface of the dam structure is located at a same distance from a top surface of the package substrate in a vertical direction as a top surface of the heat conductive layer, wherein the vertical direction is perpendicular to the top surface of the package substrate.

公开(公告)号：US20140051243A1

公开(公告)日：2014-02-20

申请号：US14064467

申请日：2013-10-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Han-shin YOUN ,  Yonghwan KWON ,  YoungHoon RO ,  Woojae KIM ,  Sungwoo PARK

IPC: H01L23/00

CPC classification number: H01L24/03 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/48 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/50 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/1082 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An example embodiment relates to a semiconductor package. The semiconductor package includes a first substrate including a first pad, a second substrate upwardly spaced apart from the first substrate and including a second pad opposite to the first pad. At least one electrode is coupled between the first pad and the second pad. The semiconductor package includes a guide ring formed at a periphery of the electrode between the first substrate and the second substrate.

Abstract translation: 示例性实施例涉及半导体封装。 半导体封装包括第一衬底，其包括第一焊盘，与第一衬底向上间隔开的第二衬底，并且包括与第一焊盘相对的第二焊盘。 至少一个电极耦合在第一焊盘和第二焊盘之间。 半导体封装包括形成在第一基板和第二基板之间的电极的周边处的引导环。

公开(公告)号：US20210352526A1

公开(公告)日：2021-11-11

申请号：US17278221

申请日：2019-09-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaeyoel KIM ,  Zhen LI ,  Daejoong KIM ,  Woojae KIM ,  Namryul JEON

IPC: H04W28/06 ,  H04L1/16 ,  H04L1/00 ,  H04L5/00

Abstract: The present disclosure relates to a 5th (5G) generation) or pre-5G communication system for supporting a higher data transmission rate beyond a 4th (4G) generation communication system such as long term evolution (LTE). An operating method of a base station in a wireless communication system according to various embodiments of the present disclosure includes generating at least one compressed symbol based on modulation compression, transmitting to another base station, control information including position indication information which indicates a position of a subcarrier at which a first subcarrier signal is transmitted in a physical resource block (PRB) to which the at least one compressed symbol is mapped, and power indication information for indicating a transmit power of the first subcarrier signal, and transmitting the at least one compressed symbol to the another base station. Thus, transmission capacity may be optimized, and efficient modulation compression is possible.

公开(公告)号：US20200260471A1

公开(公告)日：2020-08-13

申请号：US16788512

申请日：2020-02-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Namryul JEON ,  Daejoong KIM ,  Woojae KIM ,  Jaeyoel KIM

IPC: H04W72/12 ,  H04W72/10 ,  H04W72/08

Abstract: A method for transmitting signals by a first device of a base station transmitting and receiving signals of a wireless communication system is provided. The method includes receiving a plurality of uplink signals, identifying uplink transmission shaping information to be applied to the plurality of uplink signals, and transmitting the plurality of uplink signals to a second device by applying the uplink transmission shaping. The uplink transmission shaping information is information indicating for how many time intervals the first device is to transmit the plurality of uplink signals to the second device using a fronthaul. If the plurality of uplink signals are received by the first device for a first time, the plurality of uplink signals to which the uplink transmission shaping is applied are transmitted by the first device to the second device for the first time and a time determined based on the uplink transmission shaping information.